Microelectronics International
Issue(s) available: 126 – From Volume: 1 Issue: 1, to Volume: 40 Issue: 3
Volume 40
Volume 38
A numerical investigation on the influence of full vs perimeter arrays on the mechanical reliability of electronic assemblies under vibration
Mohammad A. GharaibehThis paper aims to compare and evaluate the influence of package designs and characteristics on the mechanical reliability of electronic assemblies when subjected to harmonic…
Study on electronic transport performance of Ag-ZnO film by photoassisted conductive atomic force microscopy
Yidong ZhangThe purpose of this paper is to study the electronic transport performance of Ag-ZnO film under dark and UV light conditions.
Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering
Y. Wu, Z.J. Zhang, L.D. Chen, X. ZhouLaser soldering has attracted attention as an alternative soldering process for microsoldering due to its localized and noncontact heating, a rapid rise and fall in temperature…
Reduction of the warping of a silicon wafer coated with two thin layers by minimal geometric modifications
Imad El Fatmi, Soufyane Belhenini, Abdellah TouguiThe aim of this study is to make a contribution towards reducing the deflections of silicon wafers. The deformation of silicon wafers used in the manufacture of electronic…
A novel S-shaped frequency and pattern reconfigurable patch antenna for 4G LTE, WLAN/Wi-Max application
Pallav Rawal, Sanyog RawatIn wireless communication system, use of multiple antennas for different requirements of system will increase the system complexity. However, reconfigurable antenna is maximizing…
Model of boron diffusion in silicon used for solar cell fabrication based on boric acid solutions
Wojciech FilipowskiThe purpose of this paper is to develop a model that allows determining the boron concentration profile in silicon based on duration and temperature of the diffusion process.
An ultrawideband Koch fractal patch antenna
Iqra Masroor, Jamshed Aslam AnsariCompact and wideband antennas are the need of modern wireless systems that preferably work with compact, low-profile and easy-to-install devices that provide a wider coverage of…
A chemosensitive-based ammonia gas sensor with PANI/PEO–ZnO nanofiber composites sensing layer
Gözde Konuk Ege, Özge Akay, Hüseyin YüceThis study aims to investigate the ammonia-sensing performance of polyaniline/polyethylene oxide (PANI/PEO) and polyaniline/polyethylene oxide/zinc oxide (PANI/PEO-ZnO) composite…
A modal analysis based optimal mounting support locations of a printed circuit board
Muthuram N., Saravanan S.This paper aims to improve the life of the printed circuit boards (PCB) used in computers based on modal analysis by increasing the natural frequency of the PCB assembly.
Magnetic alignment technology for wafer bonding
Lezhi Ye, Xuanjie Song, Chang YueWafer bonding is a key process for 3 D advanced packaging of integrated circuits. It requires very high accuracy for the wafer alignment. To solve the problems of large movement…
Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times
Xiangou Zhang, Yuexing Wang, Xiangyu Sun, Zejia Deng, Yingdong Pu, Ping Zhang, Zhiyong Huang, Quanfeng ZhouAu stud bump bonding technology is an effective means to realize heterogeneous integration of commercial chips in the 2.5D electronic packaging. The purpose of this paper is to…
Influence of extended surface area of heatsink on heat transfer: design and analysis
Shanmugan Subramani, Mutharasu DevarajanLight emitting diode (LED) has been the best resource for commercial and industrial lighting applications. However, thermal management in high power LEDs is a major challenge in…
Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints
Xing Gao, Z.J. Zhang, Hong Wei, Xu Zhou, Quan Shi, Yang Wu, Lei Da ChenSolder bumps for chip interconnections are downsizing from current approximately 100 µm to the expected 1 µm in future. As a result, the Cu-Ni cross-interaction in Cu/Solder/Ni…
Structural analysis of paper substrate for flexible microfluidics device application
Supriya Yadav, Kulwant Singh, Anmol Gupta, Mahesh Kumar, Niti Nipun Sharma, Jamil AkhtarThe purpose of this paper is to predict a suitable paper substrate which has high capillary pressure with the tendency of subsequent fluid wrenching in onward direction for the…
Defected microstrip structure-based near-end and far-end crosstalk mitigation in high-speed PCBs for mixed signals
Yokesh V., Gulam Nabi Alsath, Malathi KanagasabaiThe design, fabrication and experimental validation of defected microstrip structure (DMS) are proposed to address the problem of near-end crosstalk (NEXT) and far-end crosstalk…
A high performance RC-INV triggering SCR under 0.25 µm process
Xuebing Su, Yang Wang, Xiangliang Jin, Hongjiao Yang, Yuye Zhang, Shuaikang Yang, Bo YuAs it is known, the electrostatic discharge (ESD) protection design of integrated circuit is very important, among which the silicon controlled rectifier (SCR) is one of the most…
Improving displacement of silicon V-shaped electrothermal microactuator using platinum sputter deposition process
Dzung Tien Nguyen, Phuc Hong Pham, Kien Trung HoangThis paper aims to propose a method to reduce the resistance of silicon-based V-shaped electrothermal microactuator (VEM) by applying a surface sputtering process.
CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED
Shanmugan Subramani, Mutharasu DevarajanPolymer-based thermal interface materials (TIMs) are having pump out problem and could be resolved for reliable application. Solid-based interface materials have been suggested…
Design of radio frequency power amplifier for 2.45 GHz IoT application using 0.18 µm CMOS technology
Nuha Rhaffor, Wei Keat Ang, Mohamed Fauzi Packeer Mohamed, Jagadheswaran Rajendran, Norlaili Mohd Noh, Mohd Tafir Mustaffa, Mohd Hendra HairiThe purpose of this study is to show that due to the emergence of the Internet of Things (IoT) industry in recent years, the demand for the higher integration of wireless…
A monopole polarisation diversity antenna for high density packaging MIMO applications
Dhanalakshmi K.M., Kavya G., Rajkumar S.This paper aims to propose a single element, dual feed, polarisation diversity antenna. The proposed antenna operates from 2.9 to 10.6 GHz for covering the entire ultra-wideband…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson
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