Table of contents
Flip Chip Solder Bonding for Microelectronic Applications
D.J. PedderThe relentless drive towards greater complexity and interconnection density on silicon integrated circuit (SIC) devices is leading to a reappraisal of techniques for making…
Automotive Electronics: Where Are We Going?
R. Dell'Acqua, F. ForlaniThe need for better performance, safety and comfort is the driving force behind the dramatic growth in car electronics. The key to success depends mainly on system reliability and…
Copper Ball/Wedge Bonding to Copper Thick Film
R.V. Winkle, S.R. CaterThis paper describes the first of a two part study of copper ball/wedge thermosonic wire bonding and concentrates on the second wedge bond to copper thick film. Results of varying…
Large Scale Interconnects for Aerospace Applications
G. MenozziThis paper addresses three main technologies of large scale interconnects that have been evaluated at the Microelectronics Department of Crouzet Aerospace for chip and wire or…
Advances in Flux Technology for the Soldering of Surface Mounted Devices
W. RubinRecent developments in synthetic resin based non‐corrosive fluxes for soft soldering have coincided with completion of the work of the international flux standard committee. With…
Thermal Analysis of Hybrid Circuits with Mounted Components
G. De Mey, L. Van SchoorIn this contribution a linear thermal model for hybrid circuits is presented. Both the heat dissipated in screen printed resistors and in mounted components such as transistors…
Resistance to Soldering Heat and Thermal Characteristics of Plastic SMDs
C. Cognetti, E. Stroppolo, R. TizianiThis paper addresses the themes of resistance to soldering heat and heat dissipation as aspects of reliability in relation to surface mounted devices soldered on a plastic…
A Review of Thin Film Resistors and Their Assembly Problems: Part 2
D. MillsThis paper has been presented in two parts. Part 1, after an introduction to thin film resistor technology, gave a review of thin films and other resistors, followed by designer's…
Thermal and Electrical Characteristics of Thick Film Overcurrent Protector with Self‐recovery
Y. Sorimachi, I. Tsubata, S. MiyauchiA thick film overcurrent protector with self‐recovery has been developed using carbon black graft polymer. Carbon black graft polymer, henceforth called CG, is a thick film PTC…
Semiconductor Seal Testing
T. GillespieIncreasing awareness of the consequences of device failures has resulted in increased reliance on Environmental Testing as an additional means of enhancing the integrity and…
Polymeric Copper Pastes for Additive Multilayer Circuits
A. Kabe, I. MorookaThe paper describes a newly developed economical method of fabricating multilayers by means of polymeric copper paste, chemical copper and dielectric paste. The parameters…
Water‐cooled Copper‐clad Invar Hybrid Power Circuit
C. Zardini, J.D. Pistre, F. Rodes, J.L. AucouturierWater cooling of hybrid modules allows a power dissipation much higher than that of conventional methods. This paper describes the design and construction of a copper‐clad Invar…
ISHM news
R. Blancquaert, Bob Turnbull, G. Forster, Lorna Cullen, Boguslaw Herod, Steve Muckett, James LawsonISHM‐Benelux held its 1987 Autumn Conference on 29 October, at the Antwerp Crest Hotel. This one‐day meeting focused on applications of hybrid circuit technology in various fields…
Industry news
David Tuffield, former UK marketing manager for Augat/Isotronics, has been appointed European marketing manager to head the company's plans to increase penetration into this…
New products
Two die attach adhesive products, manufactured by Furane Products Co., claim to meet the military specification for epoxy electronic adhesives (MIL‐STD‐883C, Method 5011) without…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson