Table of contents
The reliability assessment of flip chip components
C.Y. HuangFlip chip technology involves the attachment of active side of the silicon chip onto printed circuit board or substrate. The interconnections are provided by solder bumps, which…
2D analysis of functional stress degradations on power VDMOS transistor
B. Beydoun, M. Zoaeter, A. Alaeddine, I. Rachidi, F. Bahsoun, J‐J. Charlot, J‐P. CharlesModifications of physical and electrical properties of the vertical double‐diffused metal oxide semiconductor (VDMOS) transistor are observed on using the device under some…
Increasing placement capacity with area based optimization and line balancing
Timo Liukkonen, Aulis TuominenPrinted wiring board placement optimization of high‐speed placement machines in a high volume surface mount line was studied based on more careful analysis of the board layout…
Prediction of temperature in silicon chip with non‐uniform power: a Lagrangian interpolation approach
Teck Joo Goh, K.N. Seetharamu, G.A. Quadir, Z.A. Zainal, K. JeevanThis paper describes a generalized method of predicting the temperature distribution of the silicon chip with non‐uniform power dissipation patterns using Lagrangian interpolation…
Characterization of copper pastes for end termination application of base metal electrode MLCCs
Masyood Akhtar, Rupendra M. AnklekarThe steep rise in the cost of palladium metal in the last decade has necessitated significant research and development efforts for using the base metal nickel electrodes in the…
Inspection of electronics packages using the efficient perception technique
Z.W. Zhong, Y. JiangWhen engineers choose and arrange proper lighting sources for an inspection system, many of them rely on their own experience or guesswork without any guidance of theories. This…
Fourier and wavelet transform analysis of moire fringe patterns in electronic packaging
C.Y. Xiong, J. Zhang, M. Li, J. Fang, S. YiIn this paper, two transform methods, the Fourier transform (FT) and the wavelet transform (WT) methods, are utilized to process moiré fringes for the strain analysis of…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson