Table of contents
Automatic Inspection of Component Boards Using 3‐D and Greyscale Vision
D.J. Svetkoff, D.N. Smith, B.L. DossRecently great interest has developed for a high speed, flexible machine vision system which can accurately determine solder paste and component placement for both process…
Notes on the Effects of Metallisation of Surface Mounted Components on Soldering
R.J. Klein WassinkSome characteristics of the metallisation of leadless ceramic components are discussed, such as dissolution, reliability of joints, intermetallic compound formations and the…
Thermodynamics of Processing Copper Thick Film Systems in a Reactive Atmosphere
P. Palanisamy, D.H.R. SarmaA major drawback of current copper thick‐film technology is the inefficient removal of the organic binder associated with the dielectric material in the low‐oxygen inert gas (N2…
Inexpensive Substrates from Moulded Glass Powder for Thin Film Potentiometers
B. Herod, D. Lusniak‐WojcickaManufacturing of thin film potentiometers involves using very special substrates, usually with complicated shapes and explicit dimensional tolerance. Commonly, such substrates…
Silver‐glass Die Attachment—Adhesion Mechanisms with Gold and Chromium/Gold Backed Die
N.M. Davey, F.W. WieseSilver‐glass die attach materials represent a significant advance in silicon packaging technology and are expected to displace gold‐silicon eutectic bonding as the preferred…
Temperature Behaviour of the Bowing of Multilayer Thick Film Substrates
I. Storbeck, G. LeitnerThe bowing of thick film substrates, wholly covered with copper pastes of the Du Pont base metal system DP 9922 and 9924, with one, four and ten layers has been measured from room…
Surface Mount Design and Assembly for High Density Complex Modules
S. Anderson, J. St JeanA packaging system has been developed using surface mounted components on ceramic substrates for conductive‐cooling applications. This has resulted in a high density, high…
Thermosonic Wire Bonding on Single‐layer Polymer Hybrid Integrated Circuits (POLYHICs)
R.L. ShookA study was undertaken to evaluate the thermosonic gold‐wire bonding capability to Ti‐Pd‐Cu‐Ni‐Au thin film metallisation on newly developed polymer hybrid integrated circuits…
A Review of Thin Film Resistors and their Assembly Problems
J.E. HughesThis paper will be presented in two parts. Part 1, after an introduction to thin film resistor technology, gives a review of thin films and other resistors, followed by designer's…
Thick Film High‐power Attenuators for Microwave Frequency Range
J. Fitt, J. Reimann, H. ThustMicrowave and thermal problems in manufacturing high‐power microwave attenuators are considered and some proposals of thick film solutions are presented. Theoretical…
Electrical Characterisation and Design of Multilayer Thick Film Circuit Boards for High Speed Digital Applications
G. Clatterbaugh, H.K. CharlesNumerical techniques and experimental methods for the electrical characterisation and design of large multilayer thick film circuit boards are discussed. The numerical techniques…
Men, Methods and Machines in Microelectronics Packaging and Interconnection: Part I Ferro‐ECA Electronics Company, Erie, Pennsylvania, USA Ceramic Coated Metal Substrates (or Porcelain Enamelled Steel Substrates Revisited)
Nihal SinnaduraiThe once highly publicised Porcelain Enamelled Steel (PES) substrates seem to have disappeared from the public gaze, or have they? They certainly have not. If anything, they have…
Du Pont Electronic Materials Division, Stevenage, England
A narration of the fascinating history of the Du Pont Company could almost fill volumes and it would be temptingly easy to utilise the journalistic cliché that here ‘space does…
ISHM news
The ISHM‐Benelux Chapter will organise a one‐day conference at the Antwerp Crest Hotel, on Thursday 29 October 1987. The conference will be aimed at applications of hybrid…
Industry news
Mr Peter Knight has joined Balzers High Vacuum Ltd, Berkhamsted, as sales engineer, thin films. Responsible to thin films manager Jim Rees, he will handle all UK sales of specific…
New products
A new high precision reflow soldering/bonding machine, the Farco F‐130, ideal for automatically placing and accurately soldering surface mount devices such as flatpacks, chip…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson