Microelectronics International: Volume 30 Issue 2

Subject:

Table of contents

Growth of InN thin films on different Si substrates at ambient temperature

Maryam Amirhoseiny, Zainuriah Hassan, Sha Shiong Ng

The purpose of this paper was to investigate the growth dependence of InN on Si substrate with different orientation through RF reactive magnetron sputtering in ambient…

Potentiality of polysilicon nanogap structure for label‐free biomolecular detection

T.S. Dhahi, U. Hashim, M.E. Ali

The purpose of this paper was to systematically study the electrical properties of 5‐, 42‐ and 75‐nm gap polysilicon structures to evaluate the potentiality of these…

Non‐destructive quantitative phase analysis of an LTCC material

Kostja Makarovič, Anton Meden, Marko Hrovat, Darko Belavič, Janez Holc, Marija Kosec

In this manuscript the purpose is to present and evaluate the developed non‐destructive method for analysing the phase composition of LTCC Du Pont “Green Tape 951”…

177

Thermal resistance studies of surface modified heat sink for 3W LED using transient curve

Shanmugan Subramani, Teeba Nadarajah, Mutharasu Devarajan

Surface configuration at the interface between two materials makes a huge difference on thermal resistance. Thermal transient analysis is a powerful tool for thermal…

Microwave studies by perturbation of Ag thick film microstrip ring resonator using superstrate of bismuth strontium manganites

S.N. Mathad, R.N. Jadhav, Vijaya Puri

The purpose of this paper was to determine the complex permittivity of bismuth strontium manganites (Bi1−xSrxMnO3) in the 8‐12 GHz range by using perturbation of Ag thick…

Thick film screen printed environmental and chemical sensor array reference electrodes suitable for subterranean and subaqueous deployments

J.K. Atkinson, M. Glanc, M. Prakorbjanya, M. Sophocleous, R.P. Sion, E. Garcia‐Breijo

The purpose of this paper is to report thick film environmental and chemical sensor arrays designed for deployment in both subterranean and submerged aqueous applications.

Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

Yap Boon Kar, Noor Azrina Talik, Zaliman Sauli, Foong Chee Seng, Tan Chou Yong, Vithyacharan Retnasamy

This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the…

Cover of Microelectronics International

ISSN:

1356-5362

Online date, start – end:

1982

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editor:

  • Professor John Atkinson