Table of contents
To determine the optimal chip/component placement for multi‐chip module (MCM) and printed circuit board (PCB) under thermal constraint.
To consider the various aspects of this emerging market and to query the traditional view of thick film deposition and processing for successful flexible electronic production.
Performance exploration of adder architectures for small to moderate‐sized low‐power, high‐performance addersAnu Gupta, Chandra Shekhar
The objective is to explore various adder architectures using different logic‐design styles and transistor‐sizes for different operand sizes. The scope of this work is the…
To study the effect of voltage‐scaling on output voltage waveform, delay and power dissipation in a single inverter/repeater driven interconnect load, in different…
In this paper, we study the effect on the performance of a single supply low voltage operational amplifier due to such a mismatch.
Online date, start – end:1982
Copyright Holder:Emerald Publishing Limited
- Professor John Atkinson