Microelectronics International: Volume 22 Issue 3

Subject:

Table of contents

Thermal management of multi‐chip module and printed circuit board using FEM and genetic algorithms

K. Jeevan, G.A. Quadir, K.N. Seetharamu, I.A. Azid

To determine the optimal chip/component placement for multi‐chip module (MCM) and printed circuit board (PCB) under thermal constraint.

Flexible electronics: silicon meets paper and beyond

J. Whitmarsh

To consider the various aspects of this emerging market and to query the traditional view of thick film deposition and processing for successful flexible electronic production.

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Performance exploration of adder architectures for small to moderate‐sized low‐power, high‐performance adders

Anu Gupta, Chandra Shekhar

The objective is to explore various adder architectures using different logic‐design styles and transistor‐sizes for different operand sizes. The scope of this work is the…

Delay analysis of a single voltage‐scaled‐repeater driven long interconnect

Rajeevan Chandel, S. Sarkar, R.P. Agarwal

To study the effect of voltage‐scaling on output voltage waveform, delay and power dissipation in a single inverter/repeater driven interconnect load, in different…

Effects of MOSFET mismatch on the performance of single supply low voltage operational amplifiers

Radhalakshmi Ramakrishnan, Maqsood A. Chaudhry

In this paper, we study the effect on the performance of a single supply low voltage operational amplifier due to such a mismatch.

Transition time considerations in repeater‐chains

Rajeevan Chandel, S. Sarkar, R.P. Agarwal

In this short communication, transition times of input signals for various stages of a repeater‐chain loaded VLSI interconnects are studied.

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Cover of Microelectronics International

ISSN:

1356-5362

Online date, start – end:

1982

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editor:

  • Professor John Atkinson