Microelectronics International: Volume 26 Issue 3

Subject:

Table of contents

Novel layout technique for on‐chip inductance minimization

V.T.S. Dao, T.G. Etoh, M. Tanaka, T. Akino

The purpose of this paper is to minimize on‐chip inductance effect for modern very large‐scale integration (VLSI), ultra large‐scale integration (ULSI) systems.

A highly miniaturized wireless inertial sensor using a novel 3D flexible circuit

J. Buckley, B. O'Flynn, J. Barton, S.C. O'Mathuna

The purpose of this paper is to develop a highly miniaturized wireless inertial sensor system based on a novel 3D packaging technique using a flexible printed circuit…

4814

Exploiting narrow values for faster parity generation

Yusuf Onur Koçberber, Yusuf Osmanlıoğlu, Oğuz Ergin

The purpose of this paper is to reduce parity generation latency if the input value is narrow.

Micro‐flow sensor for water using NTC thick film segmented thermistors

O.S. Aleksic, S.M. Savic, M.V. Nikolic, L. Sibinoski, Lukovic

The purpose of this paper is to apply negative thermal coefficient (NTC) thick film segmented thermistors (TFSTs) in a micro‐flow sensor for water.

426

Application of a low‐glitch current cell in 10‐bit CMOS current‐steering DAC

Zhi‐Yuan Cui, Joong‐Ho Choi, Yeong‐Seuk Kim, Shi‐Ho Kim, Nam‐Soo Kim

The purpose of this paper is to describe the application of low‐glitch current cell in a digital to analog converter (DAC) to reduce the clock‐feedthrough effect and…

Chemical characterization of failures and process materials for microelectronics assembly

Chien‐Yi Huang, Ming‐Shu Li, Chen‐Liang Ku, Hao‐Chun Hsieh, Kung‐Cheng Li

The purpose of this paper is to discuss the chemical characterization of failures and process materials for microelectronics assembly.

Effects of process variation in VLSI interconnects – a technical review

K.G. Verma, B.K. Kaushik, R. Singh

Process variation has become a major concern in the design of many nanometer circuits, including interconnect pipelines. The purpose of this paper is to provide a…

Response of Ag thick film microstrip equilateral triangular patch antenna to overlay of moisture laden soybean

Vaishali Mane, Vijaya Puri

The purpose of this paper is to report on the Ku band microwave characteristics of moisture laden soya seeds using overlay technique.

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Cover of Microelectronics International

ISSN:

1356-5362

Online date, start – end:

1982

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editor:

  • Professor John Atkinson