Microelectronics International: Volume 26 Issue 3

Novel layout technique for on‐chip inductance minimization

The purpose of this paper is to minimize on‐chip inductance effect for modern very large‐scale integration (VLSI), ultra large‐scale integration (ULSI) systems.

A highly miniaturized wireless inertial sensor using a novel 3D flexible circuit

The purpose of this paper is to develop a highly miniaturized wireless inertial sensor system based on a novel 3D packaging technique using a flexible printed circuit (FPC). The…

Exploiting narrow values for faster parity generation

The purpose of this paper is to reduce parity generation latency if the input value is narrow.

Micro‐flow sensor for water using NTC thick film segmented thermistors

The purpose of this paper is to apply negative thermal coefficient (NTC) thick film segmented thermistors (TFSTs) in a micro‐flow sensor for water.

Application of a low‐glitch current cell in 10‐bit CMOS current‐steering DAC

The purpose of this paper is to describe the application of low‐glitch current cell in a digital to analog converter (DAC) to reduce the clock‐feedthrough effect and achieve a low…

Chemical characterization of failures and process materials for microelectronics assembly

The purpose of this paper is to discuss the chemical characterization of failures and process materials for microelectronics assembly.

Effects of process variation in VLSI interconnects – a technical review

Process variation has become a major concern in the design of many nanometer circuits, including interconnect pipelines. The purpose of this paper is to provide a comprehensive…

Response of Ag thick film microstrip equilateral triangular patch antenna to overlay of moisture laden soybean

The purpose of this paper is to report on the Ku band microwave characteristics of moisture laden soya seeds using overlay technique.

NanoKTN Launches Directory of UK Micro and Nanotechnology (MNT) Academics and Industrialists

Synopsys & Worlson join forces

Moisture and electronics do not mix

Cadence and NEC electronics announce encounter digital implementation system to support NEC Electronics' system LSI with built-in V850 CPU core

MicroTech-2009 overview

Fairchild Semiconductor announces the lowest RDS(ON) 20 V MicroFET™ MOSFET in the industry

Day 2

IMAPS-UK Annual General Meeting 2009

Alpha Micro Components adds u-blox' AMY-5M to its portfolio The distributor teams up with u-blox to resell the GPS industry's smallest standalone receiver

Rutronik and ST consolidate successful partnership

Oxford RF Sensors (ORFS) has gained ISO 9001

DEK shows next-generation solar metallization solutions at Shanghai

Nanopackaging: Nanotechnologies and Electronics Packaging

Pickering Interfaces introduces new 50-297 PCI Precision Resistor card

Half-size SBC packs a full size punch

International diary

1U cPCI/VME64x 19 in low cost chassis

Printed Electronics Europe 7 and 8 April 2009 Dresden Germany

Fujitsu Microelectronics and TSMC to collaborate on leading edge process technology

NXP demonstrates world's first functional Cortex™-M0 silicon

Tundra Semiconductor selects Synopsys as its primary EDA partner Synopsys' differentiated offering of tools, IP and services cited as key to selection

Fairchild Semiconductor's gate drivers enable improved fuel efficiency in automotive applications