Microelectronics International: Volume 33 Issue 1


Table of contents

Thermal tablet for the blind

Andrzej Kos, Krzysztof Boron, Ireneusz Brzozowski

This paper aims present a thermal touch screen for the blind – a thermal tablet. A blind person using the device can imagine simple graphics or characters by touching flat…

Structural, electrical and microwave properties of (Sr0.6Ca0.4) (CoyMn1−y) O3 (0.2 ≤ y ≤ 1.0) thick film ceramics

R.P. Pawar, Vijaya Puri

– This paper aims to study the structural, electrical and microwave properties of (Sr0.6Ca0.4) (CoyMn1−y) O3 (0.2 ≤ y ≤ 1.0) thick-film ceramics.

Thermal resistance of high power LED influenced by ZnO thickness and surface roughness parameter

Shanmugan Subramani, Mutharasu Devarajan

The purpose of this research is to study the effect of thickness and surface properties of ZnO solid thin film for heat dissipation application in LED. Heat dissipation in…

Non-destructive detection methods for discontinuities of interconnection structures

Tomas Blecha

The purpose of this paper is to demonstrate the non-destructive methods for detection and localization of interconnection structure discontinuities based on the signal…

Electrical parameters of solar cells with electrodes made by selective metallization

Piotr Kowalik, Edyta Wrobel, Janusz Mazurkiewicz

This paper aims to present the results of measurements of the photovoltaic structures made by electroless selective metallization technology. The developed technology…

Thermal analysis of chip-on-flexible LED packages with Cu heat sinks by SnBi soldering

Yang Liu, Fenglian Sun, Cadmus A. Yuan, Guoqi Zhang

The purpose of this paper is to discuss the possibility of using soldering process for the bonding of chip-on-flexible (COF) light-emitting diode (LED) packages to heat…

Study of flexible organic electroluminescent devices with PEDOT:PSS anodes by impedance measurements

Mariya Petrova Aleksandrova

Purpose This study aims to apply the impedance spectroscopy (IS) for analyzing the electrical behavior and extracting the equivalent circuit of single-layer flexible…

Effects of ball bond diameter on wire bond reliability for automotive application

Hui Yuen Peng, Mutharasu Devarajan, Teik Toon Lee, David Lacey

The purpose of this paper is to investigate the reliability of wire bonds with three varying ball bond diameters, which are ball bonded with three different sizes of gold…

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