Table of contents
Quality Issues in Chip‐on‐board (COB) Technology
E. Giani, J.P. MathurinCritical processing steps of COB manufacturing, as implemented at Epitek, are reported. They include testing of incoming boards, cleaning, bonding parameters, bonding defects and…
Measurement of the Electrical Properties of High Performance Dielectric Materials for Multichip Modules
K. Laursen, D. Hertling, N. Berry, S.A. Bidstrup, P. Kohl, G. ArrozMultichip modules provide short chip‐to‐chip interconnects in order to take advantage of the high speeds available in integrated circuits. One multichip approach utilises layers…
MCM‐L Technology
N. Chandler, S.G. TylerMultichip modules using lamination techniques to make the substrate (MCM‐Ls) are a natural extension of printed circuit technology to meet the ever increasing demands of system…
Flip Chip Attach of Silicon and GaAs Fine Pitch Devices as well as Inner Lead TAB Attach Using Ball‐bump Technology
J. Eldring, E. Zakel, H. ReichlBall‐bumping is a flexible low cost bumping technology based on the conventional wire bonding procedure. It is applicable to single chips or whole wafers as well as to substrates…
Very Fine Line Photoimageable Thick Film Technology Developed at Hibridas
J. Minalgiene, V. Baltrushaitis, S. MuckettThe Microelectronics Division of the Radio Measurement Engineering Research Institute of Lithuania has developed a unique photoimageable thick film chemistry and process…
Performance Enhancement of Thick Film Microstripline Circuits by Metallic Thin Film Overcoat
V. PuriThe microwave properties of microstripline at S‐band and X‐band and ?/2 rejection filter with midband rejection at 3 GHz fabricated by thick film technology are studied. The…
Trends in MCM and Electronics Assembly
M.G. Sage, D.R. GrossThis paper looks at the progress taking place in packaging and assembly, with particular emphasis on the introduction of three‐dimensional IC technology. The progression from DIP…
Novel Techniques for Low‐cost, High Performance, Optoelectronic Component Assembly
I.P. HallThe drive towards low unit cost in optoelectronics packaging is assisted by simple, rapid assembly processes, and by avoiding the need for hermeticity. This paper discusses the…
Design and Processing Considerations for the Use of a Crystallising Low Temperature Cofiring Ceramic Tape System with Integratable Passive Components
B. Sjöling, S.P. Turvey, J.H. AlexanderLow temperature cofiring ceramic tape (LTCC) is increasingly used for the production of complex three‐dimensional multilayer interconnect structures in microelectronics packaging…
ISHM news
A.P. Hilley, H. Binner, Tae Sung Oh‘The Choice between Chip and Wire and High Density Surface Mount Packages (MCM‐X, COB, etc.)’ was the title of the above event. One of a regular series held by ISHM‐France, this…
Industry news
Dr Nihal Sinnadurai has taken up his new post as Professor of Electronics Technology at Middlesex University and head of its Microelectronics Centre.
ISSN:
1356-5362Online date, start – end:
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Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson