Microelectronics International: Volume 10 Issue 2


Table of contents

In‐situ Electrical Measurements on Thick Film Dielectrics

J.V. Manca, L. De Schepper, W. De Ceuninck, M. D'Olieslager, L.M. Stals, M.F. Barker, C.R. Pickering, W.A. Craig, E. Beyne, J. Roggen

In this paper, it is shown that the so‐called in‐situ electrical measurement technique is a valuable tool for understanding failure mechanisms in thick film dielectrics…

Temperature Computations in Power Microcircuits

A. Kos

This paper deals with the computation of thermal fields of power hybrid circuits using the finite difference method (FDM). The FDM is one of the classical methods used for…

Cracking Behaviour during Au‐Au TAB Inner Lead Bonding

A.F.J. Baggerman, F.J.H. Kessels

Tape automated bonding (TAB) is an interconnection technique for integrated circuits (ICs) with a small lead pitch and a thin assembly thickness. During inner lead bonding…

Robust Aluminium Nitride Package Technology for Multichip Modules

J.C. Mather, G.R. Minogue

The advent of novel advanced packaging technologies such as multilayer thin‐film interconnect, combined with continuous improvements in IC clock speed and circuit…

Thermal Effects of Replacing Solder with Conductive Adhesives

O. Spalding

An important disadvantage of conducting adhesives is their inferior heat conductivity when compared with soft solder such as Sn60Pb40. Thermal simulations, however, show…

Sensitivity Analysis in the Determination of Thermal Parameters

M. Wiedemann

This paper will describe how methods developed in structural dynamics may be used to solve a problem of microsystem technologies. In microsystem simulation, determination…

Adhesives for Electronic Applications

J.A. Adell, M. Molina, J.M. Cavero

This paper describes the results of an analysis carried out on thermally conductive and electrically conductive adhesives, in order to characterise their behaviour for…

Singapore's Hybrid Industry in the '90s ‐ the Dynamic Decade?

F.T. Liu

Despite great developments in silicon technology over the past decade, hybrid microelectronics continue to survive for a number of reasons. One reason is the difficulty of…

A Comprehensive Microelectronics Programme: Education and Research at Virginia Polytechnic Institute and State University (VPI & SU)

A. Elshabini‐Riad, D.J. Moore

The Hybrid Microelectronics Laboratory in the Bradley Department of Electrical Engineering at Virginia Polytechnic Institute and State University (VPI & SU), also named…

Coors Ceramics Electronics Ltd, Glenrothes, Scotland

The majority of visitors to the ‘Kingdom of Fife’ probably arrive there by the 2.5 kilometres long Forth Road Bridge, the southern gateway to Fifeshire, which is…

ISHM news

Vojtěch Heřmanský, M. Bilinski, H. Binner, Joon Lee, Dave Lowrie, M. Whiteside

The members of the chapter at the annual meeting held on 27 November 1992 in Brno decided not to split after the separation of Czechoslovakia. It was suggested to organise…

Industry news

Rob Knowles has been appointed Technical Service Specialist by Metech‐Ronal to support the company's rapidly expanding Thick Film Materials business throughout Europe.

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  • Professor John Atkinson