Table of contents
In‐situ Electrical Measurements on Thick Film Dielectrics
J.V. Manca, L. De Schepper, W. De Ceuninck, M. D'Olieslager, L.M. Stals, M.F. Barker, C.R. Pickering, W.A. Craig, E. Beyne, J. RoggenIn this paper, it is shown that the so‐called in‐situ electrical measurement technique is a valuable tool for understanding failure mechanisms in thick film dielectrics. The…
Temperature Computations in Power Microcircuits
A. KosThis paper deals with the computation of thermal fields of power hybrid circuits using the finite difference method (FDM). The FDM is one of the classical methods used for…
Cracking Behaviour during Au‐Au TAB Inner Lead Bonding
A.F.J. Baggerman, F.J.H. KesselsTape automated bonding (TAB) is an interconnection technique for integrated circuits (ICs) with a small lead pitch and a thin assembly thickness. During inner lead bonding the…
Robust Aluminium Nitride Package Technology for Multichip Modules
J.C. Mather, G.R. MinogueThe advent of novel advanced packaging technologies such as multilayer thin‐film interconnect, combined with continuous improvements in IC clock speed and circuit performance, has…
Thermal Effects of Replacing Solder with Conductive Adhesives
O. SpaldingAn important disadvantage of conducting adhesives is their inferior heat conductivity when compared with soft solder such as Sn60Pb40. Thermal simulations, however, show that, by…
Sensitivity Analysis in the Determination of Thermal Parameters
M. WiedemannThis paper will describe how methods developed in structural dynamics may be used to solve a problem of microsystem technologies. In microsystem simulation, determination of the…
Adhesives for Electronic Applications
J.A. Adell, M. Molina, J.M. CaveroThis paper describes the results of an analysis carried out on thermally conductive and electrically conductive adhesives, in order to characterise their behaviour for electronics…
Singapore's Hybrid Industry in the '90s ‐ the Dynamic Decade?
F.T. LiuDespite great developments in silicon technology over the past decade, hybrid microelectronics continue to survive for a number of reasons. One reason is the difficulty of…
A Comprehensive Microelectronics Programme: Education and Research at Virginia Polytechnic Institute and State University (VPI & SU)
A. Elshabini‐Riad, D.J. MooreThe Hybrid Microelectronics Laboratory in the Bradley Department of Electrical Engineering at Virginia Polytechnic Institute and State University (VPI & SU), also named Virginia…
Coors Ceramics Electronics Ltd, Glenrothes, Scotland
The majority of visitors to the ‘Kingdom of Fife’ probably arrive there by the 2.5 kilometres long Forth Road Bridge, the southern gateway to Fifeshire, which is geographically…
ISHM news
Vojtěch Heřmanský, M. Bilinski, H. Binner, Joon Lee, Dave Lowrie, M. WhitesideThe members of the chapter at the annual meeting held on 27 November 1992 in Brno decided not to split after the separation of Czechoslovakia. It was suggested to organise a…
Industry news
Rob Knowles has been appointed Technical Service Specialist by Metech‐Ronal to support the company's rapidly expanding Thick Film Materials business throughout Europe.
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson