Table of contents
The Characterisation of Novel PWB Substrate Materials for Leadless Ceramic Chip Carrier Attachment
C.J. Brierley, D.J. Pedder, J.P. McCarthyThe problems associated with the direct attachment of leadless ceramic chip carriers (LCCCs) to conventional PWB structures subjected to ambient thermal and power (on/off) cycling…
A Thermal Model for Hybrid Circuits
G. Casselman, G. De MeyThe present paper describes a relaxation technique to calculate the two dimensional temperature distribution of a hybrid circuit made on a ceramic substrate. The method calculates…
The Interaction Between Thick Film Conductors and Low Ohmic Resistors
M. Hrovat, F. Jan, D. KolarFor thick film resistor materials with low sheet resistivity (less than 10 ohm/□) sheet resistivity increases with decreasing resistor length, when terminated with Pd alloy based…
The Measurement of the Solderability of Metallic Pads on Thick‐film Substrates
M.M.F. VerguldA method for assessing the solderability of thick‐film substrates is described. An appropriate quantity of solder, with a soldering flux, is applied to the land to be tested and…
Piezoresistive Properties of Thick‐film Resistors An Overview
M. Prudenziati, B. MortenThe paper gives a review of the present knowledge of the piezoresistive properties of thick‐film resistors (TFRs) and shows how they have been exploited for the implementation of…
Wetting, Leaching and Solder Adhesion of Copper Thick Film Conductors on Alumina and Multilayer Glasses
W. LeibfriedThis paper outlines methods and results of wetting, leaching and adhesion analyses on copper thick film conductors over alumina and multilayer glasses after different processing…
Evaluation of Polyimide Thick Film High Temperature Polymeric Materials
S. HanassabThis report discusses the physical, electrical, mechanical and thermal characteristics of polyimide conductive, resistive, and dielectric thick film compositions made for…
Bond Strengths of Inner and Outer Leads on TAB Devices
L.‐G. LiljestrandChips with 43 leads mounted on three layer tapes were outer lead bonded to different substrates. The substrate materials were ceramics with Cu thick film, glass fibre reinforced…
Thermal Management Evaluation of Large Size Thick Film Hybrids
R.T. Bilson, R.W. Allen, J.P. McCarthy, A.J. StanleySuccessive over‐relaxation methods have been applied to solutions of Poisson's equation for temperature distribution analysis of a number of metal reinforced and metal cored thick…
Optical Interconnections Between Integrated Circuit Chips
J.A. NeffA major limitation to achieving significant speed increases in VLSI lies in the metallic interconnects. They are costly not only from the charge transport standpoint but also from…
Philosophy of Thick Film Materials Development
M.S. SettyThick film technology is increasingly used in hybrid microelectronic circuits throughout the world. It is entering areas of electronics hitherto dominated by other technologies…
Company profile
Brian C. Waterfield, Lorna CullenThe Batten and Allen story is a success story that follows the pattern of so many successful enterprises. The ingredients have to be first the people involved and their…
ISHM news
Nihal Sinnadurai, G. Kersuzan, B.S. Sonde, Boguslaw Herod, Brian C. Waterfield, J.B. Knowles, M.A. SteinI was an invited speaker to the ISHM‐Benelux meeting. As I arrived early, I also sat in on the committee meeting as an observer. Jos B. Peeters was the outgoing president and the…
Special reports
The Deutscher Verband für Schweisstechnik (German Welding Society) made a very judicious and much appreciated choice of venue for its Third International Conference on 18–20…
Industry news
Technograph Microcircuits Ltd of Bracknell announce the appointment of S. K. Archer as Director and General Manager. Steve joins the company from Signal Technology until recently…
New products
DEK Printing Machines have developed a number of systems for printing solar cells. In the case of one system for installation in India, it was specified that the substrate feed…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson