Table of contents
The Chip Carrier, Universal Chip Support for High Level Integration
C. Val, G. Kersuzan, B. Dreyfus‐AlainThe ‘chip carrier’ or CC is an intermediate support, hermetically sealed or otherwise, (of alumina, beryllium oxide or plastic) requires to connect an integrated circuit…
Comparative Study of Thick Film Dielectrics
W. VermeirschIncreasing density requirements urge the thick film hybrid manufacturers to print high resolution patterns and to consider the application of multilayer hybrids. The…
A Review of Distributed RC Thick Film Components
P.L. MoranSome of the unique properties of distributed RC thick film components are reviewed and discussed. In particular the evolution of a method of functionally adjusting active…
The Use of Polymer Thick Film for Making Printed Circuit Boards
F.W. MartinThe electronics industry is facing a situation in which the cost of electronic functions is dropping continuously while the cost of interconnecting the functions by…
Thermal Expansion and Laser Trim Stability of Ruthenium Based Thick Film Resistors on Alumina and on Multilayer Dielectric
I. TaitlFired resistors exhibit variations which are minimised by abrasive and laser trimming. The latter may cause unstable behaviour which is further aggravated by thermal…
Mounting Leadless Chip Carriers onto Printed Circuit Boards
D. Fishman, N. CooperIt is reasoned that wide penetration of chip carriers into equipment for professional and commercial applications depends on developing methods for mounting the leadless…
A True Air Speed Sensor for Miniature Unmanned Aircraft
J.A.C. BeattieThis paper describes the development of a laboratory prototype true air speed sensor for use on unmanned aircraft. The sensor works on vortex shedding principles and has a…
The Business of Thick Film
M.G. SageThis paper looks at the growth, current situation and future of the thick film hybrid industry worldwide. The approach taken has been to regard the thick film hybrid as…
Complementary Technologies—A Comparison of Electronic Packaging Technologies for Circuit Realisation
D.O. SpillerThis paper outlines the results of a study (initiated in June 1981) of the optimum packaging and interconnection techniques for a specific electronic sub‐system which was…
EMPIRIC/SHM—A Noble Art
P.L. KirbyAs Vice‐President of ISHM‐UK, I am very pleased to have this opportunity to express a few thoughts about our technology in this first issue of the new Journal. In the UK…
ISHM news
Daniel D Zimmerman has been named by the International Society for Hybrid Microelectronics to fill the newly created position of Director of Technical Services (DOTS) on…
Industry news
Piezo Ceram Electronique, the French furnace and manufacturing equipment company have appointed Dage (GB) Ltd. as their UK agent. Particular emphasis will be placed on…
New products
A new range of feed systems is claimed to be particularly suitable for larger substrates and those with special flatness problems. The DEK AUTOFEED 3960/3970/3980 series…
Bruel & Kjaer, Denmark
Forty years ago, in 1942, a worthy partnership was formed by Dr. Bruel and Dr. Kjaer to specialise in, what at the time could never have been envisaged as of such…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson