Microelectronics International: Volume 20 Issue 3


Table of contents

The effect of pulse voltage trimming on current noise of polymer thick film resistors

Y. Srinivasa Rao, M. Satyam

This paper deals with the investigations carried out on the variation of current noise (1/f noise) in polymer thick film resistors, when they are subjected to pulse…

Characterization of low‐k benzocyclobutene dielectric thin film

K.C. Chan, M. Teo, Z.W. Zhong

This paper reports the characterization of a photosensitive benzocyclobutene (BCB), a low dielectric constant spin‐on polymer for use as interlayer dielectric in the…

Edge potential effect on the operation of short‐channel devices

A.K. Singh, S. Gurunarayanan, V. Ramachandran, M. Umashankar

We have solved the two‐dimensional Poisson's equation for short‐channel device under the assumption that even in the absence of drain‐to‐source voltage (VDS), a potential…

Liquid dispensing encapsulation in semiconductor packaging

Liyu Yang, Carl K. King, Joseph B. Bernstein

Liquid encapsulation techniques have been used extensively in advanced semiconductor packaging, including applications of underfilling, cavity‐filling, and glob top…

Design and fabrication of silicon condenser microphone using single deeply corrugated diaphragm technique

W.J. Wang, R.M. Lin, Y. Ren

A single wafer silicon condenser microphone with a novel single deeply corrugated diaphragm is presented in this paper. The microphone diaphragm with corrugation depth of…

New modeling approach of on‐chip interconnects for RF integrated circuits in CMOS technology

H. Ymeri, B. Nauwelaers, K. Maex, D. De Roest

New analytical approximation for the frequency‐dependent impedance matrix components of symmetric VLSI interconnect on lossy silicon substrate are derived. The results…

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  • Professor John Atkinson