Microelectronics International: Volume 25 Issue 2

Subject:

Table of contents

High‐quality In0.47Ga0.53N/GaN heterostructure on Si(111) and its application to MSM detector

L.S. Chuah, Z. Hassan, H. Abu Hassan

This paper aims to report on the use of radio frequency nitrogen plasma‐assisted molecular beam epitaxy (RF‐MBE) to grow high‐quality n‐type In0.47Ga0.53N/GaN on Si(111…

1969

Wire bonding using insulated wire and new challenges in wire bonding

Z.W. Zhong

This paper attempts to review recent advances in wire bonding using insulated wire and new challenges in wire bonding for advanced microelectronics packaging.

473

Reliability of wirebonds in micro‐electronic packages

W.D. van Driel, R.B.R. van Silfhout, G.Q. Zhang

At present, over 95 percent of the manufactured packages are still being wire bonded. Owing to the ongoing trend of miniaturization, material changes, and cost reduction…

Critical issues, processes and solutions in ISFET packaging

Vinod Kumar Khanna

To provide an insight of the intricacies of ion‐sensitive field‐effect transistor (ISFET) encapsulation and describe the presently available packaging solutions…

Experimental and numerical analyses of thick‐film piezoceramic structures for miniaturised sensors and actuators

Marina Santo Zarnik, Darko Belavic, Srecko Macek

The successful use of piezoceramic thick films in sensors and actuators requires a thorough understanding of their electrical and electromechanical characteristics. Since…

Geometrical, electrical and stability properties of thick‐film and LTCC microcapacitors

Edward Miś, Andrzej Dziedzic, Tomasz Piasecki, Jarosław Kita, Ralf Moos

Capacitors are frequently used in electronic circuits. Thick‐film technology allows fabrication of such components in the case of small‐ and medium‐capacitance values…

Micro solid oxide fuel cells and their fabrication methods

Piotr Jasinski

The purpose of this work is to present the strategies and current state of development in the field of micro solid oxide fuel cells (μSOFC).

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Cover of Microelectronics International

ISSN:

1356-5362

Online date, start – end:

1982

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editor:

  • Professor John Atkinson