Microelectronics International: Volume 29 Issue 2

Subject:

Table of contents

Comparison approach on strain behavior of PBGA assembly by considering different thermal‐mechanical compound loading modes

Guangbin Tan, Ping Yang, Tianbo Li, Tao Xi, Xiaoming Yuan, Jianming Yang

The purpose of this paper is to provide a systematic method to perform analysis and test for vibration‐thermal strain behavior of plastic ball grid array (PBGA) assembly…

Power management of a wireless sensor node with solar energy harvesting technology

Kah‐Yoong Chan, Hee‐Joe Phoon, Chee‐Pun Ooi, Wai‐Leong Pang, Sew‐Kin Wong

Power management of a wireless sensor node is important and needs to be designed efficiently without wasting excessive energy. The purpose of this paper is to report on…

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Characterization and modelling of miniature ferrite transformer for high frequency applications

Mirjana S. Damnjanović, Ljiljana D. Živanov, Snezana M. Djurić, Andrea M. Marić, Aleksandar B. Menićanin, Goran J. Radosavljević, Nelu V. Blaž

Significant achievements in ferrite material processing enable developments of many ferrite devices with a wide range of power levels and working frequencies, which make…

An 11 GHz low‐phase‐noise voltage‐controlled oscillator

Mei‐Ling Yeh, Yao‐Chian Lin, Wei‐Chieh Chang

The purpose of this paper is to design a low phase noise and high figure of merit, fully integrated, voltage‐controlled oscillator (VCO) which was fabricated in TSMC CMOS…

Fabrication of porous ZnO thin films using wet chemical etching with 0.5% HNO3

Ang Chai Im, Leonard Lu Tze Jian, Ooi Poh Kok, Suriani Yaakob, Ching Chin Guan, Ng Sha Shiong, Zainuriah Hassan, Haslan Abu Hassan, Mat Johar Abdullah

The purpose of this paper is to synthesize porous zinc oxide (ZnO) by means of strain etching/wet chemical etching method with the use of 0.5% of nitric acid (HNO3

Optimal placement of modules on partially reconfigurable device for reconfiguration time improvement

Bouraoui Ouni, Abdellatif Mtibaa

The purpose of this paper is to reduce the reconfiguration time of a field‐programmable gate array (FPGA).

The bulk alloy microstructure and tensile properties of Sn‐1Ag‐0.5Cu‐xAl lead‐free solder alloys (x=0, 1, 1.5 and 2 wt.%)

Dhafer Abdul‐Ameer Shnawah, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin, Fa Xing Che

The purpose of this paper is to investigate the effect of Al addition on the bulk alloy microstructure and tensile properties of the low Ag‐content Sn‐1Ag‐0.5Cu (SAC105…

Cover of Microelectronics International

ISSN:

1356-5362

Online date, start – end:

1982

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editor:

  • Professor John Atkinson