Category:Electrical and Electronic Engineering
Table Of Contents: Volume 27 Issue 1
The purpose of this paper is to design and create a potentiostat that can be integrated and encapsulated within a microelectrode as a low‐cost electrochemical sensor…
The role of bonding duration in wire bond formation: a study of footprints of thermosonic gold wire on aluminium padHui Xu, Changqing Liu, Vadim V. Silberschmidt, Zhong Chen, Jun Wei
Optimization of the process parameters remains a challenging task in thermosonic wire bonding due to relatively poor understanding of the bonding mechanism. The purpose of…
The purpose of this paper is to study the effects of positive and negative bias stressing on switching performance of power VDMOSFETs used in communication systems.
The purpose of this paper is to investigate the effect of SiC addition up to 60 percent SiC on the mechanical properties and thermal expansion of Al‐7vol.% Si/SiC composites.
Development of 2.4 and 3.5 GHz 0.15 μm GaAs PHEMT medium‐power amplifier employing core‐based design approachAmiza Rasmi, Arjuna Marzuki, Mohd Nizam Osman, Ahmad Ismat Abdul Rahim, Mohamed Razman Yahya, Abdul Fatah Awang Mat
The purpose of this paper is to discuss medium‐power amplifier (MPA) design using parasitic‐aware core‐based approach.
The purpose of this paper is to demonstrate electromechanical properties of a new stretchable interconnect design for “fine pitch” applications in stretchable electronics.
The purpose of this paper is to design and realize a low‐phase noise, high‐output power, and high‐tuning range, fully integrated source injection parallel coupled…
The purpose of this paper is to synthesize Si (porous silicon (PS)) by laser‐induced etching (LIE) technique. The LIE process has the added advantage of a controlling size…
Online date, start – end:1982
Copyright Holder:Emerald Publishing Limited
- Professor John Atkinson