Microelectronics International: Volume 28 Issue 2

Subject:

Table of contents

Modelling and wave velocity calculation of multilayer structure SAW sensors

Dejan V. Tošić, Marija F. Hribšek

The purpose of this paper is to model multilayer structure surface acoustic wave (SAW) sensors, incorporated in CMOS or micro‐electro‐mechanical system integrated…

Overview and outlook of through‐silicon via (TSV) and 3D integrations

John H. Lau

The purpose of this paper is to focus on through‐silicon via (TSV), with a new concept that every chip or interposer could have two surfaces with circuits. Emphasis is…

3719

Testing on dynamic behavior of PBGA assembly by considering fixed‐modes

Ping Yang, Zixia Chen

The purpose of this paper is to develop a systematic experimental investigation for testing dynamic behavior of plastic ball grid array (PBGA) integrity in electronic…

DC magnetron sputter‐deposited tungsten silicide films for microelectronic applications

Jian‐Wei Hoon, Kah‐Yoong Chan, Teck‐Yong Tou

The purpose of this paper is to share valuable information about metallization in microelectronic industries by implementing tungsten silicide (WSi) thin film materials.

264

Stabilization network optimization of internally matched GaN HEMTs

W.J. Luo, X.J. Chen, C.Y. Yang, Y.K. Zheng, K. Wei, X.Y. Liu

The purpose of this paper is to report on the stabilization network optimization of internally matched GaN high electron mobility transistors (HEMTs).

A low‐power CMOS DC‐DC buck converter with on‐chip stacked spiral inductor

Chan‐Soo Lee, Ho‐Yong Choi, Yeong‐Seuk Kim, Nam‐Soo Kim

The purpose of this paper is to present a fully integrated power converter. A stacked spiral inductor is applied in a voltage‐mode CMOS DC‐DC converter for the chip…

X‐ray diffraction studies of AlxGa1−xN (0≤x≤1) ternary alloys grown on sapphire substrate

Ng Sha Shiong, Ching Chin Guan, Zainuriah Hassan, Haslan Abu Hassan

The purpose of this paper is to report the structural properties of AlxGa1−xN (0≤x≤1) grown on sapphire substrate by means of X‐ray diffraction (XRD) technique. The main…

An investigation into the effect of fabrication parameter variation on the characteristics of screen‐printed thick‐film silver/silver chloride reference electrodes

J.K. Atkinson, M. Glanc, P. Boltryk, M. Sophocleous, E. Garcia‐Breijo

The purpose of this paper is to show how the fabrication parameters of screen‐printed thick‐film reference electrodes have been experimentally varied and their effect on…

Response of Ag thick film microstrip straight resonator to perturbation of bulk and thick film Ni(1−x)CuxMn2O4 (0≤x≤1) ceramics

R.N. Jadhav, Vijaya Puri

The purpose of this paper is to describe the use of copper‐substituted nickel manganite thick film and bulk ceramic superstrate on Ag thick film microstrip straight…

Cover of Microelectronics International

ISSN:

1356-5362

Online date, start – end:

1982

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editor:

  • Professor John Atkinson