Microelectronics International: Volume 29 Issue 1

Subject:

Table of contents

Properties of magnesium oxide and magnesium oxide‐bismuth oxide mixed thick film

Shital Patil, Vijaya Puri

The purpose of this paper is to study properties of magnesium oxide and mixed magnesium oxide‐bismuth oxide thick films for application in tuned devices.

Current‐mode highpass, bandpass and lowpass filters using followers

Jiun‐Wei Horng

The purpose of this paper is to present two new follower‐based current‐mode multifunction filters. Each of the proposed circuits can realize highpass, bandpass and lowpass…

Reliability evaluation and modeling of high density electronic packages

Liyu Yang, Joseph Bernstein

The purpose of this paper is to describe key failure mechanisms observed during the development of the advanced packaging technology. Extensive accelerated stress tests…

Design of a class‐E transcutaneous energy transmitter for an implantable system

Mondher Chaoui, Richard Perdriau, Hamadi Ghariani, Mongi Lahiani

The purpose of this paper is to develop a model of the inductive link for implantable systems. The model is suitable for a cochlear implant in which a lateral misalignment…

Study of I‐V characteristics of ZnO film on Si substrate with Ag buffer layer by C‐AFM

Yidong Zhang, Weiwei He

The purpose of this paper is to demonstrate the I‐V characteristics of ZnO film on Si substrates with Ag buffer layer by conductive atomic force (C‐AFM).

Polysilicon nanogap fabrication using a thermal oxidation process

T.S. Dhahi, U. Hashim, M.E. Ali, Nazwa Taib

Nanogap electrodes have important applications in power saving devices, electrochemical sensors and dielectric detections of biomolecules. The purpose of this paper is to…

A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low‐Ag Sn‐Ag‐Cu solder joints

Dhafer Abdul Ameer Shnawah, Mohd Faizul Bin Mohd Sabri, Irfan Anjum Badruddin, Suhana Said

The purpose of this paper is to discuss the reliability of board level Sn‐Ag‐Cu (SAC) solder joints in terms of both thermal cycling and drop impact loading conditions…

Cover of Microelectronics International

ISSN:

1356-5362

Online date, start – end:

1982

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editor:

  • Professor John Atkinson