Table of contents
Comparison of low cost, insulated aluminium substrates used as integrated heat sinks with conventional technology
E. Eisermann, K. Höll, W. Smetana, W. Tusler, M. Unger, J. WhitmarshThe purpose of this paper is to describe two new thick film paste systems (one glass‐based and the other polymer‐based) for insulating aluminium substrates and allowing components…
Fine and ultra‐fine pitch wire bonding: challenges and solutions
Z.W. ZhongThe purpose of this paper is to review recent advances in fine and ultra‐fine pitch wire bonding.
Ruthenium dioxide doped manganite‐based NTC thermistors for low‐resistance applications
Shweta Jagtap, Sunit Rane, Suresh Gosavi, Dinesh AmalnerkarThe purpose of this paper is to study the properties of disc type negative temperature coefficient (NTC) thermistors based on the spinel system Mn‐Co‐Ni‐O with the doping of RuO2…
Influence of solution acidity on composition, structure and electrical parameters of Ni‐P alloys
Z. Pruszowski, P. Kowalik, M. Cież, J. KulawikThe purpose of this paper is to characterize electrical parameters of amorphous Ni‐P resistive layers used for fabrication of precise resistors.
Polymer‐metal nano‐composite films for thermal management
Björn Carlberg, Teng Wang, Johan Liu, Dongkai ShangguanThe purpose of this paper is to present a novel nanostructured polymer‐metal composite film providing continuous all‐metal thermally conductive pathways, intended to meet future…
Comparison between models for p‐n junctions parameters extraction
G.C. Pesenti, H. BoudinovThe purpose of this paper is to compare different junctions' parameters extraction models.
Silicon Schottky barrier photodiodes with a thin AlN nucleation layer
L.S. Chuah, Z. Hassan, H. Abu Hassan, C.W. Chin, S.M. Thahab, S.C. TeohThe purpose of this paper is to present the characteristics of novel silicon Schottky barrier (SB) photodiodes (PDs) with aluminium nitride (AlN) (100 nm) nucleation layer.
Electrical properties and electrical equivalent models of thick‐film and LTCC microcapacitors
Edward Miś, Andrzej Dziedzic, Karol NitschA capacitor is a basic electronic passive component. Thick‐film technology allows manufacturing of capacitors covering the range of small and medium capacitances and they have…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson