Table of contents
Comparison of low cost, insulated aluminium substrates used as integrated heat sinks with conventional technologyE. Eisermann, K. Höll, W. Smetana, W. Tusler, M. Unger, J. Whitmarsh
The purpose of this paper is to describe two new thick film paste systems (one glass‐based and the other polymer‐based) for insulating aluminium substrates and allowing…
The purpose of this paper is to review recent advances in fine and ultra‐fine pitch wire bonding.
The purpose of this paper is to study the properties of disc type negative temperature coefficient (NTC) thermistors based on the spinel system Mn‐Co‐Ni‐O with the doping…
The purpose of this paper is to characterize electrical parameters of amorphous Ni‐P resistive layers used for fabrication of precise resistors.
The purpose of this paper is to present a novel nanostructured polymer‐metal composite film providing continuous all‐metal thermally conductive pathways, intended to meet…
The purpose of this paper is to compare different junctions' parameters extraction models.
The purpose of this paper is to present the characteristics of novel silicon Schottky barrier (SB) photodiodes (PDs) with aluminium nitride (AlN) (100 nm) nucleation layer.
A capacitor is a basic electronic passive component. Thick‐film technology allows manufacturing of capacitors covering the range of small and medium capacitances and they…
Online date, start – end:1982
Copyright Holder:Emerald Publishing Limited
- Professor John Atkinson