Microelectronics International: Volume 37 Issue 4


Table of contents

Thermal performance and fatigue life prediction of POP stacked chip assembly under thermal cycling load

Dongbo Li, Jianpei Wang, Bing Yang, Yongle Hu, Ping Yang

This paper aims to perform experimental test on fatigue characteristics of package on package (POP) stacked chip assembly under thermal cycling load. Some suggestions for…

Novel implementation of 3D multiplexers in nano magnetic logic technology

Farnoosh Farzaneh, Reza Faghih Mirzaee, Keivan Navi

Owing to recent challenges of CMOS manufacturing and power consumption in silicon technologies among alternative technologies, Nanomagnetic logic (NML) is one of the most…

The interfacial reliability of through-glass vias for 2.5D integrated circuits

Omar Ahmed, Golareh Jalilvand, Scott Pollard, Chukwudi Okoro, Tengfei Jiang

Glass is a promising interposer substrate for 2.5 D integration; yet detailed analysis of the interfacial reliability of through-glass vias (TGVs) has been lacking. The…

Investigations of temperature sensor embedded into PCB

Kamil Janeczek, Aneta Araźna, Wojciech Stęplewski, Marek Kościelski, Krzysztof Lipiec, Ireneusz Rafalik, Sebastian Karolewski, Dorota Liszewska, Anna Sitek

The purpose of this study is to design and fabricate a simple passive sensor circuitry embedded into a printed circuit board (PCB) and then to examine its properties.

A 1-mm2 CMOS-pipelined ADC with integrated folded cascode operational amplifier

Norhamizah Idros, Zulfiqar Ali Abdul Aziz, Jagadheswaran Rajendran

The purpose of this paper is to demonstrate the acceptable performance by using the limited input range towards lower open-loop DC gain operational amplifier (op-amp) of…

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  • Professor John Atkinson