Table of contents
A New Approach to the Study of the Intrinsic Ageing Kinetics of Thick Film Resistors
L. De Schepper, W. De Ceuninck, H. Stulens, L.M. Stals, R. Vanden Berghe, S. DemolderA new method of studying the accelerated ageing of interconnection materials is applied to a high‐stability thick film resistor system (the Du Pont HS‐80 system). The new method…
Packaging Options for High Lead Count ASIC Devices
S.T. RichesSelection of the correct interconnection technique for high lead count integrated circuits is dependent on technical and economic factors, in particular in small batch production…
Terpene vs. CFC Defluxing in Hybrid Circuits Manufacturing
B. OsvalderBecause of the influence of chlorofluorocarbon based solvents on the stratospheric ozone layer, electronics manufacturers worldwide are attempting to find new solvents or methods…
The Use of CAD in Advanced Ceramic Package Designs
R. Callahan, J. EwanichBeing competitive in the high performance IC market requires package design concepts which keep pace with the rapid increase in device complexity. Devices operating in the 50…
Non‐linear Thermal Effects in Hybrid Circuits
G. De Mey, E. Boone, G. Nachtergaele, S. Demolder, L. RottiersA review is given of the several heat transfer phenomena occurring in hybrid circuits. Most attention is devoted to the non‐linear properties. Some theoretical simulations and…
High Performance Electrically Conductive Silicone Adhesives
M.A. Lutz, R.L. ColeSilicones have long been recognised as attractive materials for use in electronics applications because of their unique combination of properties. Now, technology which couples…
Literature abstracts
ZAKEL, E., SIMON, J. and SCHULER, S., Verbindungstechnik in der Elektronik, Vol. 2, No. 2, pp. 53–57, June (1990) TAB is an attractive microconnecting technology for chips with a…
Center for Advanced Ceramic Technology, Alfred University, Alfred, New York, USA
Richard M. SpriggsThe dawning, in the world of technology, of the Age of Advanced Materials has led to a search for new ways of establishing research programmes capable of meeting the increased…
Book reviews
When one considers the critical importance of solders and soldering in the fabrication of all types of electronic circuits, it is perhaps surprising that there is not a greater…
ISHM news
J. Lantairès, B.C. Waterfield, H. Binner, G. Griffiths, Maurice WrightISHM invites papers for the above Conference, to be held on 29–31 May 1991 in Rotterdam, The Netherlands. Papers should cover areas such as: design, manufacturing, packaging and…
Industry news
Gwent Electronic Materials has won its third award under the Department of Trade and Industry's SMART competition scheme.
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson