Microelectronics International: Volume 12 Issue 3

Hybrid Technology

Professor H. Binner

Piezoelectric Thick-film Materials and Sensors

M. Prudenziati, B. Morten, G. De Cicco

Planar Thick Film Integrated LCV Cells

O.S. Aleksić, P.M. Nikolić, M.D. Luković, D. Vasiljević-Radović

Electrical Design Techniques for MCM-D

D.B. Tuckerman, D. Benson

Low Cost, Thick Film Resistive Compositions without the Use of Noble Metals

S. Achmatowicz, M. Jakubowska, E. Zwierkowska, M. Primovitch

Microelectronics Markets in Europe

N. Sinnadurai

High Performance Material Technologies for Advanced Circuit Assemblies and MCMs

P. Barnwell, G. Shorthouse

A Novel Composite Material for Electronic Packaging

J.-M. Ting, M.L. Lake

Fine Pitch Wire Bonding for µBGA™ Packages

Z. Kovac, T.H. DiStefano, J. Grange, I. Alfonso