Table of contents
Packaging technologies for pressure‐sensors
Marko Pavlin, Darko Belavic, Marina Santo Zarnik, Marko Hrovat, Matej MozekPressure‐sensor miniaturization requires high‐density packaging. This means that designers are constantly faced with all kinds of challenging, and sometimes impossible…
Laser treatment of LTCC for 3D structures and elements fabrication
Jaroslaw Kita, Andrzej Dziedzic, Leszek J. Golonka, Tomasz ZawadaThis paper presents possibility of laser application for fabrication of 3D elements and structures. The Aurel NAVS‐30 Laser Trimming and Cutting System with special software was…
Using LTCC for microsystems
Torsten Thelemann, Heiko Thust, Michael HintzA characteristic feature of LTCC is good workability. In some cases a LTCC‐based microsystem can be a good alternative to microsystems made in silicon or other technologies…
On the zero offset stability of thick film strain gauges
Yulan Zheng, John Atkinson, Russ SionThis paper presents results of work aimed at characterising the zero offset stability in novel thick film strain gauges. The devices studied are z‐axis (k33) load sensors…
Effect of gamma radiation onto the properties of TeO2 thin films
K. Arshak, O. KorostynskaThe effects of γ‐radiation on both the optical and the electrical properties of Tellurium dioxide (TeO2) thin films were investigated. TeO2 thin films were fabricated using…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson