Microelectronics International: Volume 19 Issue 3

Subject:

Table of contents

Packaging technologies for pressure‐sensors

Marko Pavlin, Darko Belavic, Marina Santo Zarnik, Marko Hrovat, Matej Mozek

Pressure‐sensor miniaturization requires high‐density packaging. This means that designers are constantly faced with all kinds of challenging, and sometimes impossible…

Laser treatment of LTCC for 3D structures and elements fabrication

Jaroslaw Kita, Andrzej Dziedzic, Leszek J. Golonka, Tomasz Zawada

This paper presents possibility of laser application for fabrication of 3D elements and structures. The Aurel NAVS‐30 Laser Trimming and Cutting System with special…

Using LTCC for microsystems

Torsten Thelemann, Heiko Thust, Michael Hintz

A characteristic feature of LTCC is good workability. In some cases a LTCC‐based microsystem can be a good alternative to microsystems made in silicon or other…

1238

On the zero offset stability of thick film strain gauges

Yulan Zheng, John Atkinson, Russ Sion

This paper presents results of work aimed at characterising the zero offset stability in novel thick film strain gauges. The devices studied are z‐axis (k33) load sensors…

Effect of gamma radiation onto the properties of TeO2 thin films

K. Arshak, O. Korostynska

The effects of γ‐radiation on both the optical and the electrical properties of Tellurium dioxide (TeO2) thin films were investigated. TeO2 thin films were fabricated…

Cover of Microelectronics International

ISSN:

1356-5362

Online date, start – end:

1982

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editor:

  • Professor John Atkinson