Table of contents
Measurements and simulation of SMT components
Ryszard J. Pryputniewicz, David Rosato, Cosme FurlongIntegrity of surface mount technology (SMT) components depends on their response to temperature changes caused by operating conditions. Temperature induced differential thermal…
Multi‐layer thick‐film microwave components and measurements
Zhengrong Tian, Charles Free, Colin Aitchison, Peter Barnwell, James WoodThe trend in wireless and mobile communications for broader bandwidth microwave circuitry, coupled with high packaging density and low cost fabrication has triggered…
A frequency tunable half‐wave resonator using a MEMS variable capacitor
Patrick Bell, Nils Hoivik, Victor Bright, Zoya PopovicA frequency tunable half‐wave resonator at 3 GHz is presented with a microelectromechanical systems (MEMS) variable capacitor as the tuning element. The capacitor is fabricated…
High‐Q RF inductors on 20 Ω.cm silicon realized through wafer‐level packaging techniques
G.J. Carchon, W. De Raedt, E. BeyneHigh Q on‐chip inductors and low loss on‐chip interconnects and transmission lines are an important roadblock for the further development of Si‐based technologies at RF and…
An evaluation of materials and processes employed in the construction of novel thick film force sensors
Yulan Zheng, John Atkinson, Zhige Zhang, Russ SionNovel thick film strain gauges have been constructed using a z‐axis orientation on insulated stainless steel for a variety of force sensing applications. These devices exhibit…
Materials characterization of the effect of mechanical bending on area array package interconnects
Daniel T. Rooney, N. Todd Castello, Mike Cibulsky, Doug Abbott, Dongji XieThe mechanical integrity of solder joint interconnects in PWB assemblies with micro ‐ BGA, chip scale, and LGA packages are being questioned as the size and pitch decrease…
Mechanically fixed and thermally insulated micromechanical structures for GaAs heterostructure based MEMS devices
T. Lalinsky´, Sˇ. Haščík, Ž. Mozolová, E. Burian, M. Krnáč, M. Tomáška, J. Škriniarová, M. Drzˇík, I. Kosticˇ, L. MatayA new micromachining technology of mechanically fixed and thermally insulated cantilevers, bridges and islands was developed to be used for design of GaAs heterostructure based…
Advanced thick film system for AlN substrates
Y.L. Wang, A.F. Carroll, J.D. Smith, Y. Cho, R.J. Bacher, D.K. Anderson, J.C. Crumpton, C.R.S. NeedesSubstrates with high thermal conductivity continue to be in great demand for their ability to enable smaller and denser high power circuits. BeO has been used for this purpose for…
High‐resolution integration of passives using micro‐contact printing (μCP)
Charles D.E. Lakeman, Patrick F. FleigAs the number of passive components in electronic circuits increases, new methods for fabricating passives are under development to optimize utilization of board space. In this…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson