Microelectronics International: Volume 24 Issue 2


Table of contents

Simulation, design, development and test of antennas for wireless sensor network systems

Brendan O'Flynn, D. Laffey, J. Buckley, J. Barton, S.C. O'Mathuna

This paper aims to describe the simulation, design, development and characterisation of antennas for wireless sensor networks operating in a variety of environments…


Fabrication and characterization of bulk and thick film perovskite NTC thermistors

J. Kulawik, D. Szwagierczak, B. Gröger, A. Skwarek

The aim of the present work was the characterization of a group of compounds with the perovskite‐type structure in respect of their applicability as thermistor materials.

Selected design aspects in CAN‐bus system connected with signal propagation in real transmission lines

Włodzimierz Kalita, Kazimierz Kamuda

The paper focuses on CAN‐bus based systems: a determination of the configuration parameters by analysis of their characteristic structure, topology conditions and…

Graphical touch screen of thermal signs for the blind people – clinic tests

Krzysztof Boroń, Piotr Bratek, Andrzej Kos

The paper aims to present the prototype of a graphical touch screen of thermal signs for the blind.

Modeling and analysis of the growth of copper dendrites in saturated conditions using a multilevel factorial design analysis

Wayne Lawson, R.D. Pilkington, A.E. Hill

Tracks, pads and vias on printed circuit boards can suffer from a variety of problems, if the surfaces are contaminated with electrically‐conducting substances. Aims to…

A useful pseudo‐logarithmic circuit

Brent Maundy, David Westwick, Stephan Gift

This paper proposes a useful pseudo‐logarithmic circuit as a basic building block in the construction of a logarithmic amplifier made from piecewise approximations.

A 1.2 V single supply operational amplifier design using 0.13 μm technology

Radhalakshmi Ramakrishnan, Maqsood A. Chaudhry

This paper aims to present a design of a single power supply, low voltage (1.2) high performance operational amplifier using 0.13 μm technology whose characteristics are…


Future VLSI interconnects: optical fiber or carbon nanotube – a review

Brajesh Kumar Kaushik, Saurabh Goel, Gaurav Rauthan

To review and explore optical fiber and carbon nanotube (CNT) as prospective alternatives to copper in VLSI interconnections.


Optimization of reflow soldering process for BGA packages by artificial neural network

Yu‐Hsin Lin, Wei‐Jaw Deng, Jie‐Ren Shie, Yung‐Kuang Yang

This investigation applied a hybrid method combining a trained artificial neural network (ANN) and the sequential quadratic programming (SQP) method to determine an…

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  • Professor John Atkinson