Microelectronics International: Volume 25 Issue 3

Subject:

Table of contents

Creation and verification of dynamic compact thermal model of a BGA package

F. Mohammadi, M. Marami

The purpose of this paper is to develop a dynamic compact thermal model (DCTM) of electronic packages. This model is a necessary tool for rapid thermal analysis of the…

Wire bonding of low‐k devices

Z.W. Zhong

The purpose of this paper is to review recent advances in wire bonding of low‐k devices.

779

A voltage reference circuit for current source of RFIC blocks

A. Marzuki, Zaliman Sauli, Ali Yeon, Shakaff

The purpose of this paper is to design a voltage reference circuit for current source of radio frequency integrated circuit blocks. The voltage reference circuit is called…

Studies on temperature coefficient of resistance (TCR) of polymer thick film resistors

Y. Srinivasa Rao

The purpose of this paper is to study the variation of the temperature coefficient of resistance (TCR) of polymer thick film resistors, namely, PVC‐graphite thick film…

432

Prediction of microwave permittivity of leafy vegetation using Ag thick film microstripline

P.D. Kamble, Vijaya Puri

The purpose of this paper is to predict permittivity of leafy vegetation using overlay technique.

167

Photoconductive cells from screen‐printed and sintered cadmium sulfoselenide

Jiří Franc, Stanislav Nešpůrek

Screen‐printing is an appropriate technique for the manufacture of large‐area position‐sensitive detectors. The purpose of this paper is to present simple methods of paste…

Cover of Microelectronics International

ISSN:

1356-5362

Online date, start – end:

1982

Copyright Holder:

Emerald Publishing Limited

Open Access:

hybrid

Editor:

  • Professor John Atkinson