Microelectronics International: Volume 31 Issue 2

Analysis of misalignment-induced deformation in three-dimensional semiconductor chip stacks

Richard W. Johnson, Yu-Lin Shen

The purpose of this study is to numerically assess the misalignment-induced deformation and its implications, in the through-silicon via (TSV), silicon chip, solder micro-bump…

Dynamic reliability approach of chip scale package assembly under vibration environment

Ping Yang, Xiusheng Tang, Yu Liu, Shuting Wang, Jianming Yang

The purpose of this paper is to perform experimental tests on fatigue characteristics of chip scale package (CSP) assembly under vibration. Some suggestions for design to prolong…

Silicon nanowire fabrication: Silicon trimming via shallow anisotropic etching

Tijjani Adam, U. Hashim

The purpose of this study is to present reports on fabrication of silicon (Si) nanowires (NWs). The study consists of microwire formation on silicon-on-insulator (SOI) that was…

Connection of electronic and microelectronic modules

Josef Sandera

The purpose of this article is to describe the design of electronic and microelectronic modules and, in particular, it focuses on connecting system of electrical modules to the…

Evolution of photovoltaic solar modules dark properties after exposition to electrical reverse stress current inducing thermal effect

Jihad Sidawi, Carine Zaraket, Roland Habchi, Nathalie Bassil, Chafic Salame, Michel Aillerie, Jean-Pierre Charles

The purpose of this paper is to investigate the dark properties as a function of reverse current induced defects. Dark characteristics of solar modules are very essential in the…

The effect of microwave radiation on polyvinyl chloride-graphite thick film resistors

Kandagaddla Venkatasubrahmanayam, Busi Ram Babu, Billa Poornaiah, Yarravarapu Srinivasa Rao

The purpose of this paper is to study the microwave interactions in polymer thick film resistors, namely, polyvinyl chloride (PVC)-graphite thick film resistors, and its…

Fabrication and characterization of a single-bridge nanorod between microgap electrodes

Qazi Humayun, Muhammad Kashif, Uda Hashim

– The purpose of this study was to investigate the performance of a single-bridge ZnO nanorod as a photodetector.

The tunnelling and electron injection reliabilities for FG transistors

Bongani C. Mabuza, Saurabh Sinha

The purpose of this paper was to present the results of the three types of FG transistors that were investigated. The reliability issues of oxide thickness due to programming…

RF characteristics of 0.13-μm NMOS transistors for millimeter-wave application

Siti Maisurah Mohd Hassan, Yusman M. Yusof, Arjuna Marzuki, Nazif Emran Farid, Siti Amalina Enche Ab Rahim, Mohd Hafis M. Ali

The purpose of this paper is to present the high-frequency performance of 0.13-μm n-type metal-oxide-semiconductor (NMOS) transistors with various multi-finger configurations for…

Future and technical considerations of gold wirebonding in semiconductor packaging – a technical review

Chong Leong Gan, Francis Classe, Bak Lee Chan, Uda Hashim

The purpose of this paper is to provide a systematic review on technical findings and discuss the feasibility and future of gold (Au) wirebonding in microelectronics packaging. It…

Wafer damage issue study by heavy Al wire wedge bonding

Hanmin Zhang, Ming Hu, Fei Zong, Baoguan Yin, Denghong Ye, Qingchun He, Zhijie Wang

– The purpose of this paper was to attempt to confirm the root cause of wafer damage issue by heavy Al wire wedge bonding and propose some permanent solutions for it.