Microelectronics International: Volume 35 Issue 4

Electrical properties of Pb[Zr0.35Ti0.65]O3 on PEALD Al2O3 for NVM applications

Prashant Singh, Rajesh Kumar Jha, Rajat Kumar Singh, B.R. Singh

Development of (1T-type) ferroelectric random access memory (FeRAM) has most actively progressed since 1995 and motivated by the physical limits and technological drawbacks of the…

The electrothermal impact on a contact metal-semiconductor: applications to the germanium–silver system

Arkadiy Skvortsov, Nikolay A. Khripach, Boris A. Papkin, Danila E. Pshonkin

This study aims to examine the electromigration processes resulting from thermal overloads of semiconductor devices. While in operation, parts of such devices can heat up to 330°C…

Development of a current mirror-integrated pressure sensor using CMOS-MEMS cofabrication techniques

Shashi Kumar, Pradeep Kumar Rathore, Brishbhan Singh Panwar, Jamil Akhtar

This paper aims to describe the fabrication and characterization of current mirror-integrated microelectromechanical systems (MEMS)-based pressure sensor.

Absorption enhancement in a-Si thin-film solar cells based on silver nanopillar arrays

Boyang Qu, Peng Zhang, Jianmin Luo, Shie Yang, Yongsheng Chen

The purpose of this paper is to investigate a light-trapping structure based on Ag nanograting for amorphous silicon (a-Si) thin-film solar cell. Silver nanopillar arrays on…

High performance of quantum dots light-emitting diodes based on double transparent electrodes

Zhiwei Li

The purpose of this paper is to find an effective route to fabricate high transparent top electrode in quantum dots light-emitting diodes (QLEDs).

Facile method for synthesis of α-Co(OH)2 and their supercapacitor properties

F.F.M Shaikh, T.D. Dongale, R.K. Kamat

The overall purpose of this research paper largely depends on developing an easy method to synthesis a material suitable for supercapacitor application. This paper includes the…

System in package (SiP) technology: fundamentals, design and applications

Fabio Santagata, Jianwen Sun, Elina Iervolino, Hongyu Yu, Fei Wang, Guoqi Zhang, P.M. Sarro, Guoyi Zhang

The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP) approach. This new packaging approach is based on stacked silicon submount technology. As…

Corrigendum