Table of contents
Structural, mechanical and elastic properties of Ni0.7−xCoxZn0.3Fe2O4 nano-ferrite thick films
Maruti K. Rendale, S.N. Mathad, Vijaya PuriThe present communication aims to investigate the influence of cobalt substitution on the structural, mechanical and elastic properties of nickel–zinc ferrite thick films. The…
Growth kinetic and composition of the interfacial layer for RF sputtering Al2O3 layer on germanium
Siti Kudnie Sahari, Muhammad Kashif, Norsuzailina Mohamed Sutan, Zaidi Embong, Nik Amni Fathi Nik Zaini Fathi, Azrul Azlan Hamzah, Rohana Sapawi, Burhanuddin Yeop Majlis, Ibrahim AhmadThe quality of GeOx–Ge interface and the equivalent oxide thickness (EOT) are the main issues in fabricating high-k/Ge gate stack due to the low-k of GeOx interfacial layer (IL)…
Back plate electroplating for high aspect ratio processes
Simone Luigi Marasso, Simone Benetto, Isabella Para, Chiara Ottone, Domenico Mombello, Denis Perrone, Sergio Ferrero, Luciano Scaltrito, Diego Pugliese, Matteo Cocuzza, Fabrizio Candido PirriIn this process the electrical contact is brought to the backside of a standard silicon wafer. The details of the entire process are disclosed, from the photolithography processes…
Electrode-width-weighted wavelet transform processor using SAW devices
Wenke Lu, Lili Gao, Qinghong Liu, Jingduan Zhang, Haoxin ZhangWhen designing the electrode widths of the electrode-width-weighted (EWW) input interdigital transducers (IDTs) according to the envelope amplitudes of the wavelet function, the…
BGA substrate outgassing negative impact study on Cu wire bonding
Hanmin Zhang, Ming Hu, Zhijie Wang, Qingchun He, Denghong YeThe purpose of this paper is to attempt to study the failure mechanism of BGA (ball grid array) Cu wire bond ball lift and specifically focused on substrate outgassing’s impact on…
Linearized differential current sensor in low-voltage CMOS
Neil Naudé, Saurabh SinhaThis work aims to improve upon the linearity of integrated CMOS current sensors used in switch mode power supply topologies, using a low-cost and low-voltage (less than 1.2 V…
Interdigitated microelectrode geometry for simple electrical Escherichia coli O157:H7 DNA detection
Sharipah Nadzirah, Uda HashimThe purpose of this study is to fabricate a transducer-based TiO2 interdigitated microelectrodes with various gap sizes. The most stable electrical properties have been selected…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson