Microelectronics International: Volume 34 Issue 2


Table of contents

Structural, mechanical and elastic properties of Ni0.7−xCoxZn0.3Fe2O4 nano-ferrite thick films

Maruti K. Rendale, S.N. Mathad, Vijaya Puri

The present communication aims to investigate the influence of cobalt substitution on the structural, mechanical and elastic properties of nickel–zinc ferrite thick films…

Growth kinetic and composition of the interfacial layer for RF sputtering Al2O3 layer on germanium

Siti Kudnie Sahari, Muhammad Kashif, Norsuzailina Mohamed Sutan, Zaidi Embong, Nik Amni Fathi Nik Zaini Fathi, Azrul Azlan Hamzah, Rohana Sapawi, Burhanuddin Yeop Majlis, Ibrahim Ahmad

The quality of GeOx–Ge interface and the equivalent oxide thickness (EOT) are the main issues in fabricating high-k/Ge gate stack due to the low-k of GeOx interfacial…

Back plate electroplating for high aspect ratio processes

Simone Luigi Marasso, Simone Benetto, Isabella Para, Chiara Ottone, Domenico Mombello, Denis Perrone, Sergio Ferrero, Luciano Scaltrito, Diego Pugliese, Matteo Cocuzza, Fabrizio Candido Pirri

In this process the electrical contact is brought to the backside of a standard silicon wafer. The details of the entire process are disclosed, from the photolithography…

Electrode-width-weighted wavelet transform processor using SAW devices

Wenke Lu, Lili Gao, Qinghong Liu, Jingduan Zhang, Haoxin Zhang

When designing the electrode widths of the electrode-width-weighted (EWW) input interdigital transducers (IDTs) according to the envelope amplitudes of the wavelet…

BGA substrate outgassing negative impact study on Cu wire bonding

Hanmin Zhang, Ming Hu, Zhijie Wang, Qingchun He, Denghong Ye

The purpose of this paper is to attempt to study the failure mechanism of BGA (ball grid array) Cu wire bond ball lift and specifically focused on substrate outgassing’s…

Linearized differential current sensor in low-voltage CMOS

Neil Naudé, Saurabh Sinha

This work aims to improve upon the linearity of integrated CMOS current sensors used in switch mode power supply topologies, using a low-cost and low-voltage (less than…

Interdigitated microelectrode geometry for simple electrical Escherichia coli O157:H7 DNA detection

Sharipah Nadzirah, Uda Hashim

The purpose of this study is to fabricate a transducer-based TiO2 interdigitated microelectrodes with various gap sizes. The most stable electrical properties have been…

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  • Professor John Atkinson