Category:Electrical and Electronic Engineering
Table Of Contents: Volume 22 Issue 1
The main purpose of this paper is to find a simple method to improve the breakdown voltage of BJTs fabricated on SOI.
To study the breakdown (MI) mechanism in the sub‐micron MOSFET device.
Use of thin film microstrip patch antenna for leaf moisture studies.
This paper aims to present systematic studies of a wide spectrum of geometrical and electrical properties of thick‐film and LTCC microresistors (with designed dimensions…
Delay and power dissipation are the two major design constraints in very large scale integration (VLSI) circuits. These arise due to millions of active devices and…
Online date, start – end:1982
Copyright Holder:Emerald Publishing Limited
- Professor John Atkinson