Category:Electrical and Electronic Engineering
Table Of Contents: Volume 24 Issue 3
Optimal process parameters design for a wire bonding of ultra‐thin CSP package based on hybrid methods of artificial intelligenceYung‐Hsiang Hung
The aim of this research is to combine the Taguchi method and hybrid methods of artificial intelligence, to use them as the optimal tool in wire bond designing parameters…
This paper aims to obtain the optimal wire sizing of buffered global interconnects and to investigate the impact of weight factor on the optimized system performance for…
Recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packagingZ.W. Zhong, T.Y. Tee, J‐E. Luan
This paper seeks to review recent advances in wire bonding, flip chip and lead‐free solder for advanced microelectronics packaging.
Low temperature co‐fired ceramics (LTCC) material is introduced as an excellent alternative to silicon, glass, or plastic materials for the fabrication of miniaturised…
This paper sets out to design and realize a highly linear, wide dynamic range and high switching efficiency integrated CMOS up‐conversion mixer for two‐step IEEE 802.1a…
This paper proposes to study the effect of line resistance and driver width on crosstalk noise for a CMOS gate driven inductively and capacitively coupled VLSI interconnects.
The paper aims to focus on the semiconductor temperature prediction in the multichip modules by using a simplified 1D model, easy to implement in the electronic simulation tools.
This paper aims to study tuning effects on thick film microstripline due to ferrite thick film overlay.
The purpose of this work is to highlight the evolutions of the switching times parameters of commercial vertical diffuse metal oxide semiconductor field effect transistors…
The encapsulation of electronic assemblies within thermoplastic polymers is an attractive technology for the protection of circuitry used in harsh environments, such as…
Online date, start – end:1982
Copyright Holder:Emerald Publishing Limited
- Professor John Atkinson