Table of contents
The Rôle of the Semiconductor Industry in Hybrid Technology—A Tutorial
G.W. GriffithsWhatever one may feel is the importance of particular interconnection and assembly technologies with which one is associated, Thin Film or Thick Film Hybrid, PCB Through Hole…
A Comparison of Electrodeposited Tin and Tin/Lead Coatings on Nickel Barrier Terminated, Multilayer Ceramic Chip Capacitors
M. KuceraNickel, as a barrier to the dissolution of termination materials, requires a solderable coating to prevent nickel oxidation and preserve solderability of surface mount devices…
Characterisation of Die Attach Adhesives
M. Remškar, D. RočakSeveral commercially available epoxy and polyimide adhesives were tested. The properties essential for the use of adhesives in microelectronics are stated and their compliance…
Characterisation of Aluminium Nitride Ceramic Substrates
M.G. NortonAluminium nitride (AlN) is currently under investigation as a substrate material for use in microcircuit applications in particular where high thermal conductivity is required…
An Assessment of Thick‐Film Piezoresistors on Insulated Steel Substrates
N.M. WhiteThe development of new, inexpensive, robust and miniaturised sensors is continuously being sought and it is believed that thick‐film technology can help to achieve these goals. A…
Screen Printed Thick Film Resistors — Better Yields with Shorter Set‐up Times
E. Giani, J.P. MathurinA set of rules is presented for printing thick film resistors, whose implementation minimises losses due to resistors firing too high or too low, and also results in the shortest…
Assembly and Packaging Considerations for GaAs Microwave Power Devices
J.R. Tyler, D.K. AndradeRecent developments in microwave GaAs technology are yielding devices with higher power capabilities and increased levels of integration. The mechanical and thermal properties of…
A Single Substrate Thick Film Temperature Datalogger
R.T. Pullman, P.F. Van Kuyk, C.A. JennessDuring the transport of perishable goods it is important to ensure that optimum temperature storage conditions are observed. To ensure compliance to these conditions a miniature…
Copper Thick Film—A Maturing Technology
P. SayersKnowledge of critical materials and process parameters necessary to fabricate quality copper thick film multilayer and hybrid circuits is being amassed and distributed throughout…
ISHM news
Hamish LawDates: 29–31 May 1991 Venue: De Doelen Conference Centre, Rotterdam, The Netherlands The Benelux Chapter of the International Society for Hybrid Microelectronics will be…
Industry news
B. TurnbullJenny Wheeler has recently joined PRTM Ltd, an international operations management consultancy company offering implementation orientated support to high technology industry. PRTM…
New products
UK based Hermetronics plc has announced a range of hermetic packages, suitable for microwave circuit operation at up to 30 GHz. The high operating frequency of the RF30 range of…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson