Table of contents
The Design Process for Application Specific Integrated Circuits (ASICS)
J.D. TongeThis paper presents an overview of the ASIC design cycle, and covers the main topics involved in the successful translation of an ASIC concept into a chip capable of exploitation…
The Theoretical Fundamentals of the Screen Printing Process
D.E. RiemerThe basic parameters of screen printing are discussed, and an analytical model of the screen printing process is introduced. The ink roll in front of the squeegee is treated as a…
Silicon Integration and Its Impact on the Hybrid Industry
D. TophamRapid advances in silicon, including ever higher complexity and easier access to customised approaches, are forcing dramatic changes in electronic equipment design and…
Integrated Magnetics Components Using Thick Film Hybrid Technology
N. Aitmani, Y. Ousten, J.L. Aucouturier, D. Michaux, P. MasRecent advances in solid state power conversion, specially in the high frequency domain, have shown the need for magnetics components for hybrid circuits. This paper describes the…
Zero‐stress Film Adhesive for Substrate Attach
L.M. Leung, K.K.T. ChungTraditional B‐staged epoxy film adhesives have been used as substrate attach adhesive for hybrid circuits. The advantages of using film adhesive instead of paste adhesive are…
Packaging for Thermal Detectors
M.K. Robinson, N.M. Shorrocks, R.W. Bicknell, P. Watson, D.J. PedderA new lass of sensors for thermal imaging and detection in the infra‐red band is emerging which exploits the pyroelectric effect in ferroelectric materials. These sensors, which…
Experience with AlN Substrate
M. FeilThe similarity of its temperature expansion coefficient to that of silicon, as well as its high thermal conductivity, makes AlN a material suited for application in…
Hybrid Microelectronics and the Market Opportunities in Europe
N. SinnaduraiIn order to identify and quantify the size and shape of the rapidly changing complexion of the market for hybrid microelectronics, in 1987 ISHM launched a survey in Europe of the…
Some Adhesion Aspects of Thick Film Conductors
I. Storbeck, G. Leitner, M. Wolf, P. Gottschalk, U. SchläferAn attempt is made to discuss the adhesion of thick film conductors on ceramic substrates in connection with thermally induced internal stresses caused by mismatch of the thermal…
Vapour Phase Curing of PTF Inks — A Commercial Reality?
R.S. Briggs, P. Newton, P. SrinivasanThe use of vapour phase heating as a rapid and uniform method of heat transfer is widely established in the electronics industry for reflow soldering of surface mounted devices…
Advanced Electronic Packaging Development Centre ICI Electronics, Manor Park, Runcorn, Cheshire
Runcorn and neighbouring Widnes have strong connections with the beginnings of the chemical industry. Indeed, one of the four companies which merged in 1926 to form Imperial…
ISHM news
G. Forster, Graham JonesOrganised by ISHM‐France, this event is aimed at suppliers, manufacturers, and users of hybrid microelectronic circuits. The aim of the conference is to present information on the…
ISHM‐NORDIC Conference and Exhibition
R.B.T., S.J.M.All Scandinavian cities seem to be close to water, if not the sea then there will be a lake or river. All too have that wonderful clear light in which the reflections sparkle and…
Industry news
Electro‐Science Laboratories Inc., whose thick film pastes and materials for the microelectronics industry are manufactured and distributed in Europe by Agmet Ltd of Reading, have…
New products
A new microcomputer‐controlled wire bond pull tester, designed to enable manufacturers of hybrid microcircuits to perform fully automatic non‐destructive pull testing of wire…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson