Table of contents
Design of an asynchronous least common multiple circuit
V. Bansal, A. Nandy, K.T. LauThe purpose of the paper is to focus on the development of an asynchronous application which helps to compute the least common multiple (LCM) of two 4‐bit numbers.
Studies on electrical properties of polymer thick film resistors
Y. Srinivasa RaoThe paper aims to study the variation of electrical properties like electrical resistivity and current noise of a polymer thick film resistor, namely, PVC‐graphite thick film…
Modifying electric artworks to improve dimensional stability of microelectronic substrates
Parsaoran Hutapea, Joachim L. GrenestedtThe paper aims to deal with a tuning method to reduce warpage of microelectronic substrates.
Effects of die‐pad resonance on ultrasonic bond quality of wire bonds
Narasimalu SrikanthWire bonding is an important method of interconnection in microelectronics. Ultrasonic energy is known to soften metallic materials and hence when used in the wire bond process it…
Modeling and simulation of NTC thick film thermistor geometries
O.S. Aleksić, B.M. Radojčić, R.M. RamovićThe paper aims to focus on thick film planar thermistors.
λ/2 Microstrip rejection filter behavior due to ferrite thin film overlay in the absence of external magnetic field
Vandan Surve, Vijaya PuriTo study nonreciprocal effects in microstrip components due to ferrite thin film overlay.
Voltage scaling – a novel approach for crosstalk reduction in global VLSI interconnects
B.K. Kaushik, S. Sarkar, R.P. Agarwal, R.C. JoshiTo analyze the effect of voltage scaling on crosstalk.
Study of the effect of substrate bias on the electrical properties of sputtered HfO2 thin film deposited on silicon substrate
R.K. Nahar, Aparna SharmaHfO2 has emerged as the most promising high k dielectric for an alternative gate material. As‐deposited HfO2 thin films have large number of defects resulting in increased oxide…
Investigations of mechanical strength and electrical resistance of adhesives and adhesive joints in liquid nitrogen
B. Bober, A. Bochenek, B. Olszewska‐Mateja, Z. ŻalukThe paper aims to present the original and easy for application methods of mechanical strength and electrical properties examination of conductive adhesives and adhesive joints at…
ISSN:
1356-5362Online date, start – end:
1982Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Professor John Atkinson