Microelectronics International: Volume 24 Issue 1


Table of contents

Design of an asynchronous least common multiple circuit

V. Bansal, A. Nandy, K.T. Lau

The purpose of the paper is to focus on the development of an asynchronous application which helps to compute the least common multiple (LCM) of two 4‐bit numbers.

Studies on electrical properties of polymer thick film resistors

Y. Srinivasa Rao

The paper aims to study the variation of electrical properties like electrical resistivity and current noise of a polymer thick film resistor, namely, PVC‐graphite thick…

Modifying electric artworks to improve dimensional stability of microelectronic substrates

Parsaoran Hutapea, Joachim L. Grenestedt

The paper aims to deal with a tuning method to reduce warpage of microelectronic substrates.

Effects of die‐pad resonance on ultrasonic bond quality of wire bonds

Narasimalu Srikanth

Wire bonding is an important method of interconnection in microelectronics. Ultrasonic energy is known to soften metallic materials and hence when used in the wire bond…

λ/2 Microstrip rejection filter behavior due to ferrite thin film overlay in the absence of external magnetic field

Vandan Surve, Vijaya Puri

To study nonreciprocal effects in microstrip components due to ferrite thin film overlay.

Study of the effect of substrate bias on the electrical properties of sputtered HfO2 thin film deposited on silicon substrate

R.K. Nahar, Aparna Sharma

HfO2 has emerged as the most promising high k dielectric for an alternative gate material. As‐deposited HfO2 thin films have large number of defects resulting in increased…

Investigations of mechanical strength and electrical resistance of adhesives and adhesive joints in liquid nitrogen

B. Bober, A. Bochenek, B. Olszewska‐Mateja, Z. Żaluk

The paper aims to present the original and easy for application methods of mechanical strength and electrical properties examination of conductive adhesives and adhesive…

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  • Professor John Atkinson