Category:Electrical and Electronic Engineering
Table Of Contents: Volume 24 Issue 1
The purpose of the paper is to focus on the development of an asynchronous application which helps to compute the least common multiple (LCM) of two 4‐bit numbers.
The paper aims to study the variation of electrical properties like electrical resistivity and current noise of a polymer thick film resistor, namely, PVC‐graphite thick…
The paper aims to deal with a tuning method to reduce warpage of microelectronic substrates.
Wire bonding is an important method of interconnection in microelectronics. Ultrasonic energy is known to soften metallic materials and hence when used in the wire bond…
The paper aims to focus on thick film planar thermistors.
λ/2 Microstrip rejection filter behavior due to ferrite thin film overlay in the absence of external magnetic fieldVandan Surve, Vijaya Puri
To study nonreciprocal effects in microstrip components due to ferrite thin film overlay.
Study of the effect of substrate bias on the electrical properties of sputtered HfO2 thin film deposited on silicon substrateR.K. Nahar, Aparna Sharma
HfO2 has emerged as the most promising high k dielectric for an alternative gate material. As‐deposited HfO2 thin films have large number of defects resulting in increased…
Investigations of mechanical strength and electrical resistance of adhesives and adhesive joints in liquid nitrogenB. Bober, A. Bochenek, B. Olszewska‐Mateja, Z. Żaluk
The paper aims to present the original and easy for application methods of mechanical strength and electrical properties examination of conductive adhesives and adhesive…
Online date, start – end:1982
Copyright Holder:Emerald Publishing Limited
- Professor John Atkinson