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Sensing technology has been extensively researched and used due to its applications in industrial production and daily life. Due to inherent limitations of conventional silicon-based technology, researchers are now-a-days paying more attention to flexible electronics to design low-cost, high-sensitivity devices. This observational and analytical study aims to emphasis on carbon monoxide gas sensor. This review also focuses the challenges faced by flexible devices, offers the most recent research on paper-based gas sensors and pays special focus on various sensing materials and fabrication techniques.

To get the better insight into opportunities for future improvement, a number of research papers based on sensors were studied and realized the need to design carbon monoxide gas sensor. A number of parameters were then gone through to decide the flexibility parameter to be considered for design purposes. This review also focuses on the challenges faced by flexible devices and how they can be overcome.

It has been shown that carbon monoxide gas, being most contaminated gas, needs to be fabricated to sense low concentration at room temperature, considering flexibility as an important parameter. Regarding this parameter, some tests must be done to test whether the structure sustains or degrades after bending. The parameters required to perform bending are also described.

Due to inherent limitations of conventional silicon-based technology, now-a-days attention is paid towards flexible electronics to design low-cost, high-sensitivity devices. A number of research articles are provided in the literature concerning gas sensing for different applications using several sensing principles. This study aims to provide a comprehensive overview of recent developments in carbon monoxide gas sensors along with the design possibilities for flexible paper-based gas sensors. All the aspects have been taken into consideration for the fabrication, starting with paper characterization techniques, various sensing materials, manufacturing methodologies, challenges in the fabrication of flexible devices and effects of bending and humidity on the sensing performance.

The purpose of this paper is to investigate the durability of radio‐frequency identification (RFID) chips assembled on flexible substrates (paper and foil), with materials evaluated with regard to mechanical stresses and dependence on the applied substrate, antenna materials, chip pad printing and chip encapsulation.

RFID chips were assembled to antennas screen printed on flexible substrates. Shear and bending tests were conducted in order to evaluate the mechanical durability of the chip joints depending on the materials used for mounting the RFID chip structures. X‐ray inspection and cross sectioning were performed to verify the quality of the assembly process. The microstructure and the resistance of the materials used for chip pads were investigated with the aim of determining the conductivity mechanism in the printed layers.

Addition of carbon nanotubes to the conductive adhesive (CA) provided a higher shear force for the assembled RFID chips, compared to the unmodified conductive adhesive or a polymer paste with silver flakes. However, this additive resulted in an increase in the material's resistance. It was found that the RFID substrate material had a significant influence on the shear force of mounted chips, contrary to the materials used for printing antennas. The lower shear force for chips assembled on antennas printed on paper rather than on foil was probably connected with its higher absorption of solvent from the pastes. Increasing the curing temperature and time resulted in an additional increase in the shear force for chips assembled to antennas printed on foil. A reverse dependence was observed for chips mounted on the antennas made on paper. An improvement in the durability of the RFID chip structures was achieved by chip encapsulation. Bending tests showed that a low‐melting adhesive was the best candidate for encapsulation, as it provided flexibility of the assembled structure.

Further studies are necessary to investigate the mechanical durability of RFID chips assembled with a conductive adhesive, with different addition levels and types of carbon nanotubes.

The results revealed that the best candidate for providing the highest RFID chip durability related to mechanical stresses was the low‐melting adhesive. It can be recommended for practical use, as it simplified the assembly process and reduced the curing step in the encapsulation of the RFID devices. From the results of shear testing, conductive adhesives with carbon nanotubes can be used in RFID chip assembly because of their ability to increase the shear force of joints created between the antenna and the chip.

In this paper, the influence of the materials used for antenna, chip pads, encapsulation and the curing conditions on the mechanical durability (shear and bending) of RFID chips was analyzed. Commercial and elaborated materials were compared. Some new materials containing a conductive adhesive and carbon nanotubes were proposed and tested in RFID chip assembly to antennas printed on flexible substrates (paper and foil).

The purpose of this study is to investigate the changes in the performance of ink formulations caused by the addition of compounds that improve the ink’s physical properties to achieve an optimum formulation for inkjet printing, because of the importance and simplicity of this method.

Ink samples were formulated using Acid Red 14 as ink colorant, different percentages of polymeric compounds including polyvinyl alcohol (PVA), polyvinylpyrrolidone and Carboxy methyl cellulose (CMC) as viscosity modifier compounds and surfactant as the surface tension enhancer. Formulated samples were adjusted in terms of fluid physical properties e.g. viscosity, density and surface tension, and the effect of used compounds on the improvement of both physical and colorimetric properties such as viscosity, surface tension, colorimetric coordinates and lightfastness has been evaluated to achieve the optimum printing inks to be printed on three different substrates.

The experimental observations showed that CMC was the most compatible compound as the viscosity modifier as its viscosity value was in the printable range of 2–22 cP. Moreover, a flow-curve test was applied to the ink samples and their Newtonian behavior was approved. Based on the spectrophotometric test results of printed samples, the samples containing PVA provided acceptable lightfastness in comparison to other ink samples on every used substrate.

An optimum relation between colorimetric coordinates of the printed samples and ink formulation could be considered and achieved.

On 20 April ISHM‐Benelux held its 1988 Spring meeting at the Grand Hotel Heerlen. This meeting was totally devoted to implantable devices, in particular to the technologies used for these high reliability, extremely demanding devices. For this meeting ISHM‐Benelux was the guest of the Kerkrade facility of Medtronic. Medtronic (headquartered in Minneapolis, USA) is the world's leading manufacturer of implantable electronic devices. Apart from the assembly of pacemakers and heart‐wires, the Kerkrade facility acts as a manufacturing technology centre for Medtronic's European facilities.

The ISHM CAN‐AM Chapter recently organised a half‐day programme of paper presentations followed by a tour of a local hybrid facility. The event took place on 26 April at the Holiday Inn, Montreal (Pointe Claire), Quebec, with the theme of the papers concentrating on advances in hybrid manufacturing processes and some coverage of SMT.

The purpose of this paper is to present a sophisticated methodology for inkjet printing of silver nanoparticles (AgNPs) in the range of 80-200 nm on different flexible substrate. AgNPs was chemically deposited by ejection of silver nitrate and ascorbic acid solutions onto different substrates such as paper and textile fabrics. The fabricated pattern was used to employ as electrode for electrochemical sensors.

The morphology of deposited AgNPs was characterized by means of scanning electron microscopy. Moreover, conductivity and electrochemical behavior were identified, respectively, using four probe and cyclic voltammetry techniques. Acquired image shows a well-defined shape and size for the deposited AgNP.

The conductivity of the paper substrate after printing process reached 5.54 × 105 S/m. This printed electrode shows a sharp electrochemical response for early determination of glucose. The proposed electrode provides a new alternative to develop electrochemical sensors using AgNPs chemically deposited on paper and textile fabric surfaces.

The purpose of this study was to develop flexible sensors for detection of different concentrations of bacteria, such as Pseudomonas aeruginosa and Staphylococcus aureus, in saline.

The sensors were fabricated using ink-jet printing technology and they consist of a pair of silver interdigitated electrodes printed on mechanically flexible substrates – foil and paper. In house measurement setup for testing and characterization of sensors has been developed. Structural, electrical and mechanical properties of flexible sensors have been determined and compared.

The characteristics of sensor – the resonant frequency as a function of different concentrations of each bacteria – are presented. The obtained results demonstrate different resonant frequencies for each dilution of Pseudomonas aeruginosa and Staphylococcus aureus in physiological saline.

Both sensors showed accurate measurements of bacterial count, which can be achieved with detection of resonant frequency, and this is reflective of the number of bacterial cells within a sample.

The findings suggest that the newly developed method based on measuring resonant frequency corresponds well with bacterial cell count, thus establishing a new proof-of-concept that such method can have significant applications in bacterial cell counting that are economic and easily maintained.

Fast, cost-effective, accurate and non-invasive method for detection of different bacteria from saline was developed.

For the first time, comparison between performances of flexible sensors on foil and paper for bacteria detection is demonstrated. Almost linear dependence between shift of resonant frequency of developed sensors and concentration of bacteria has been obtained.

In flexible electronics applications, organic inks are mostly used for inkjet printing. Three-dimensional (3 D) printing technology has the advantages of low cost, high speed and good precision in modern electronic printing. The purpose of this study is to solve the high cost of traditional printing and the pollution emissions of organic ink. It is necessary to develop a water-based conductive ink that is easily degradable and can be 3 D printed. A nano-silver ink printed circuit pattern with high precision, high conductivity and good mechanical properties is a promising strategy.

The researched nano-silver conductive ink is mainly composed of silver nanoparticles and resin. The effect of adding methyl cellulose on the ink was also explored. A simple 3 D circuit pattern was printed on photographic paper. The line width, line length, line thickness and conductivity of the printed circuit were tested. The influence of sintering temperature and sintering time on pattern resistivity was studied. The relationship between circuit pattern bending performance and electrical conductivity is analyzed.

The experimental results show that the ink has the characteristics of low silver content and good environmental protection effect. The printing feasibility of 3 D printing circuit patterns on paper substrates was confirmed. The best printing temperature is 160°C–180°C, and the best sintering time is 30 min. The circuit pattern can be folded 120°, and the cycle is folded more than 60 times. The minimum resistivity of the circuit pattern is 6.07 µΩ·cm. Methyl cellulose can control the viscosity of the ink. The mechanical properties of the pattern have been improved. The printing method of 3 D printing can significantly reduce the sintering time and temperature of the conductive ink. These findings may provide innovation for the flexible electronics industry and pave the way for alternatives to cost-effective solutions.

In this study, direct ink writing technology was used to print circuit patterns on paper substrates. This process is simple and convenient and can control the thickness of the ink layer. The ink material is nonpolluting to the environment. Nano-silver ink has suitable viscosity and pH value. It can meet the requirements of pneumatic 3 D printers. The method has the characteristics of simple process, fast forming, low cost and high environmental friendliness.

The purpose of this paper is to examine electrical and mechanical properties of radio frequency identification (RFID) chip joints assembled on a flexible substrate and made from isotropic conductive adhesives (ICAs) reinforced with graphene nanoplatelets (GPNs) or graphite nanofibers (GFNs).

The ICAs reinforced with GPNs or GFNs were prepared and screen printed on a test pattern to investigate resistance and thickness of these adhesive layers. Differential Scanning Calorimetry (DSC) was performed to assess a curing behaviour of the prepared ICAs. Then, RFID chips were mounted with the prepared ICAs to the pattern of silver tracks prepared on foil. Shear test was carried out to evaluate mechanical durability of the created chip joints, and resistance measurements were carried out to evaluate electrical properties of the tested ICAs.

The 0.5 per cent (by weight) addition of GFNs or GPNs to the ICA improved shear force values of the assembled RFID chip joints, whereas resistance of these modified adhesives increased. The DSC analysis showed that a processing temperature of the tested adhesives may range from 80 to 170°C with different curing times. It revealed a crucial influence of curing time and temperature on electrical and mechanical properties of the tested chip joints. When the chip pads were cured for too long (i.e. 60 minutes), it resulted in a resistance increase and shear force decrease of the chip joints. In turn, the increase of curing temperature from 80 to 120°C entailed improvement of electrical and mechanical properties of the assembled chips. It was also found that a failure location changed from the chip – adhesive interface towards the adhesive – substrate one when the curing temperature and time were increased.

Further investigations are required to examine changes thoroughly in the adhesive reinforced with GFNs after a growth of curing time. It could also be worth studying electrical and mechanical properties of the conductive adhesive with a different amount of GFNs or GPNs.

The tested conductive adhesive reinforced with GFNs or GPNs can be applied in the production of RFID tags because it may enhance the mechanical properties of tags fabricated on flexible substrates.

Influence of GFNs and GPNs on the electrical and mechanical properties of commercial ICAs was investigated. These properties were also examined depending on a curing time and temperature. New conductive materials were proposed and tested for a chip assembly process in fabrication of RFID tags on flexible substrates.

The purpose of this paper is provide a broad view for the standardization efforts of color quality evaluation of color 3D printing techniques. Further, this review paper demonstrates the processes and color properties of most color 3D printing techniques with specific devices and applications to extend the range of possible memberships of standardization group.

Six color 3D printing techniques including plastic-based, paper-based, powder-based, organism-based, food-based and metal-based color 3D printing have been introduced and illustrated with colorization principles and forming features in detail. Moreover, for printed 3D color objects, literature about color measurement, color specification and color reproduction are described and analyzed, respectively.

Four color 3D printing techniques including plastic-based, paper-based, powder-based and food-based color 3D printing show great affinity toward standardization of color quality evaluation, while their colorization principles indicate that it is difficult with a single standard frame. It is possible to develop a completed color quality evaluation standard for color 3D printing based on approaches in color 2D printing when color measurement method and devices are standardized together.

The paper provides an important guide focusing on the efforts to standardize the colorization processes and color quality evaluation of the color 3D printing techniques.