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The purpose of this paper is to evaluate the corrosion resistance of the electroless Ni‐P coatings in two aggressive media 3.5 wt.% NaCl and Synthetic industrial waste water. Also to study the effect of Phosphorous content in the electroless Ni‐P deposits on its surface nature, morphology and corrosion resistance.

The corrosion behavior of electroless Ni‐P coatings generated on mild steel coupons from an acidic and an alkaline baths and their anti‐corrosion performance of was compared systematically in 3.5 wt.% of NaCl solution and also in synthetic industrial waste water. Microstructure and surface composition of coatings were analyzed using X‐ray diffraction, scanning electron microscopy and energy dispersive spectroscopy techniques, respectively. The Ni‐P coated mild steel specimens were subjected to corrosion and the rate of corrosion was studied by chemical and electrochemical methods. The linear sweep voltammetry, Tafel and electrochemical impedance spectroscopy were employed to obtain corrosion data.

The electroless Ni‐P coatings with higher P content possess homogeneous, uniform and amorphous surface nature and exhibited higher corrosion resistance in the aggressive corrosive media chosen.

This paper provides corrosion behavior of electroless Ni‐P coatings in 3.5 wt.% NaCl and synthetic industrial waste water, and establishes the importance of phosphorous content on nature and properties of the coatings.

To study the influence of storage time and environment on the solderability of electroless nickel plated samples with Sn‐3.8Ag‐0.7Cu and Sn‐3.5Ag lead‐free solders and to provide criteria for the use of an electroless nickel (Ni‐P) under bump metallization (UBM) without immersion gold protection.

Electroless nickel coatings were deposited onto pure aluminium foil through a procedure developed for the UBM of wafers prior to flip chip bumping. Their solderability with lead‐free solders was studied using the wetting balance technique. Samples stored in different environments for different periods of time were tested to study the dependence of the solderability of Ni‐P coatings on the storage time and temperature. The degree of oxidation of the Ni‐P coatings was examined by means of X‐ray photoelectron spectroscopy and the surface microstructure and roughness of the coatings were analyzed by scanning electron microscopy and atomic force microscopy.

It was found that the Ni‐P coatings were unacceptable for direct soldering without the assistance of a flux, due to poor wettability, even when using a freshly prepared Ni‐P coating. Therefore, a suitable flux with nitrogen inerting had to be applied to assist the soldering process. The results also show that the solderability of Ni‐P coatings was affected by the phosphorus content, and the Ni‐P coating with high phosphorus content had a good solderability. The storage time and temperature did not influence the wettability significantly with the assistance of strong flux.

The stability of the plating solution and the consistence of the phosphorus content in the coating are not easily controlled. This has resulted in implications for surface analysis and wetting testing. Ni‐P coatings with different levels of phosphorus content are being investigated in detail.

The value of the paper lies in its study on the solderability of lead‐free solders to Ni‐P coating after storage in different environments and for different periods, which can provide some criteria for the use of Ni‐P UBM without immersion gold protection.

This paper aims to investigate the structural, corrosion and the study of tribocorrosion features of the AA7075 aluminum alloy with and without the application of electroless Ni-P/Ni-B duplex coating with a thickness of approximately 40 microns.

Surface characterization of the samples was made by structural surveys (light optic microscope, scanning electron microscopic examinations and X-ray diffraction analyses), hardness measurements, corrosion and tribocorrosion tests.

Results of the experiments showed that upper Ni-B coating deposited on the surface of first Ni-P layer by duplex treatment caused remarkable increment in the hardness, corrosion resistance and tribocorrosion performance as compared to the AA7075 aluminum alloy.

This study can be a practical reference and offers insight into the effects of duplex treating on the increase of hardness, corrosion and tribocorrosion performance.

Electrodeposited Ni‐P composite coatings incorporating a variety of inorganic particles were obtained from Watt’s nickel bath containing sodium hypophosphite. The mechanism of co‐deposition of various particles (SiC, Al₂O₃, quartz and sand) was studied in view of the electro‐kinetic charge characterizing the solid particles. Means to improve the mobility of the particles in the plating solution were investigated using sodium oleate as surface active agent. The purpose was to increase particle content in the coating to attain high hardness values. Special attention was given to the deposition process using SiC particles. The surface morphology, hardness and wear resistance of the composite coatings were determined. Hardness values were maximized by simple heat treatment in air atmosphere which led to the precipitation of the hard Ni₃P phase. Sound, coherent and high wear resistance coatings could be produced.

This study aims to elucidate the reaction mechanism of electroless NiP deposits on conductive but non-catalytic Cu films on the basis of their nucleation and growth without Pd catalyst and to measure the deposition rate and activation energy of electroless NiP deposits on the non-catalytic Cu film at various deposition times (60, 120, 240 and 480 s) and temperatures (70, 80 and 90°C) at pH 4.6.

Specimens with and without Pd catalyst on Cu film were prepared as follows: the Pd catalyst was deposited on half of the Cu film using a deposition protector, and the specimen containing the Pd catalyst deposited on half of its area was immersed in electroless NiP solution. The growth of NiP on the Cu films with and without the Pd catalyst was observed.

The number of Pd nanoparticles increased with Pd activation time; the nucleation of Pd dominated over growth at 60 s. Lattice images show that the d-spacing of Ni nanoparticles doped with less than 10 at% P increased to 2.050 Å. Nucleation of NiP deposits occurred simultaneously in the specimens with and without the Pd catalyst, because electrons could be transferred via the conductive Cu. Therefore, the reaction mechanism of the electroless NiP deposited on Cu film appears to be electrochemical. The activation energies for NiP deposits (15 s Pd with catalytic Pd, 15 s Pd without catalytic Pd, 60 s Pd with catalytic Pd and 60 s Pd without catalytic Pd) on the Cu film are 65.8, 64.0, 64.3 and 58.1 kJ/mol, respectively. This demonstrates that, regardless of the volume and the presence of catalytic Pd, the activation energy of electroless NiP has a consistent value.

It is necessary to study the relationship between the volume of Pd nanoparticles and the nucleation rate of NiP at an initial stage, as there are limited data regarding the effect of Pd volume on the nucleation rate of NiP.

The reaction mechanism of the electroless NiP deposited on conductive but non-catalytic Cu film involves electrochemical reactions because the nucleation of NiP deposits occurs on conductive Cu film regardless of the presence of the Pd catalyst.

The purpose of this paper is to detail progress on the European Commission supported FP7 ASPIS project that is undertaking a multi‐faceted approach to develop novel and improved nickel‐gold (ENIG) solderable finish chemistries and processes in order to overcome issues such as “black pad” that are known to cause reliability issues.

The ASPIS project has four key and discrete approaches; research into “black pad” formation mechanisms, development of new aqueous chemical deposition methods, formulation of new processes based on ionic liquids and the development of prognostic screening tools to enable early prediction of reliability issues.

Key factors influencing “black pad” formation include immersion gold bath pH value, concentration of citrate and thickness of the immersion gold layer. In addition, copper substrate preparation is also important. Work to develop new metal deposition processes using ionic liquids has also been demonstrated and may provide a viable alternative to more conventional aqueous based chemistries, thereby enabling some of the conditions that lead to “black pad” to be avoided.

This paper summarises the work carried out in the first year of a three‐year project and so the outputs to date are relatively limited. The project is continuing for another two years, when further progress will be made. It is hoped to report this progress in a future update paper.

The ASPIS project has undertaken multiple approaches to the development of new high reliability nickel gold finishes and this combination of approaches should offer synergies over more discrete traditional methodologies. As well as undertaking a detailed analysis of the mechanisms causing reliability problems, radical new formulation and prognostic approaches are also being developed.

The purpose of this paper is to investigate the deposition of uniform, adherent and crack‐free Ni‐P thin films on carbon fibres using the electroless deposition technique.

Before applying the electroless process, the carbon fibre surfaces must be subjected to several treatment processes to remove the organic binder, etching and surface metallization. The surface morphology of the Ni‐P coatings was assessed using a scanning electron microscope (SEM). The chemical compositions of Ni‐P layers were identified by energy dispersive X‐ray analysis (EDS). The bond strength of the coated layer was determined by measuring the electrical resistance at the fibre/coating interface. The magnetic properties of the fibres were estimated using a hysteresis diagram. The tensile performance of single fibres coated by Ni‐P has been investigated with respect to coating thickness.

Pre‐treatment processes are used to improve the adhesion of Ni‐P layers and to obtain homogeneous coatings. The influence of plating parameters (temperature, pH and time) on the coating thickness of the Ni‐P layer was investigated. It was found that the coating thickness increased as the pH value, plating time and the temperature of the bath increased. The results revealed that a complete and uniform Ni‐P coating on fibre could be obtained at optimum conditions 85°C, pH 6, for 60 min, and the results indicated that the P content in the electroless deposit is approximately 3.4 wt%. The tensile strength values are improved significantly after coating and increased by 3‐5 times with increasing of coating thickness from 0.3 to 2 μm.

The results presented in this work are an insight into understanding of the deposition and adherence of Ni‐P thin films on carbon fibre using the electroless technique and behaviour of the coated fibre.

The purpose of this paper is to present current state of understanding on jet electrodeposition manufacturing; to compare various experimental parameters and their implication on as deposited features; and to understand the characteristics of jet electrodeposition deposition defects and its preventive procedures through available research articles.

A systematic review has been done based on available research articles focused on jet electrodeposition and its characteristics. The review begins with a brief introduction to micro-electrodeposition and high-speed selective jet electrodeposition (HSSJED). The research and developments on how jet electrochemical manufacturing are clustered with conventional micro-electrodeposition and their developments. Furthermore, this study converges on comparative analysis on HSSJED and recent research trends in high-speed jet electrodeposition of metals, their alloys and composites and presents potential perspectives for the future research direction in the final section.

Edge defect, optimum nozzle height and controlled deposition remain major challenges in electrochemical manufacturing. On-situ deposition can be used as initial structural material for micro and nanoelectronic devices. Integration of ultrasonic, laser and acoustic source to jet electrochemical manufacturing are current trends that are promising enhanced homogeneity, controlled density and porosity with high precision manufacturing.

This paper discusses the key issue associated to high-speed jet electrodeposition process. Emphasis has been given to various electrochemical parameters and their effect on deposition. Pros and cons of variations in electrochemical parameters have been studied by comparing the available reports on experimental investigations. Defects and their preventive measures have also been discussed. This review presented a summary of past achievements and recent advancements in the field of jet electrochemical manufacturing.

The purpose of this paper is to determine the appropriate conditions for the chemical deposition of Ni‐P‐Al₂O₃ composite coatings, deposited on metalic matrix.

Auto catalytic reduction of Ni in nickel sulfate and sodium hypophosphate bath, including 10 percent volume fractions of nanodispersive Al₂O₃ particles is treated in the alloy steel 100Cr6. The wear resistance and friction coefficient of the coatings are determined using tester T‐01M, a ball‐disc tester for mitigated solid friction conditions, in model lubricants: oil bases, oil bases with antiwear additives AW.

The analysis of the properties of the Ni‐P‐Al₂O₃ deposits confirms that the presence of the dispersion phase of aluminium oxide determines the coating wearability.

The paper presents some indications of proper selection of antiwear coating generation methods (their parameters and conditions).

Investigations show that tribocatalytic effect of nickel coatings influence the intensity of antiwear layers generation in zinc dialkyldithiophosphates (ZDDP) tribochemical interaction in model lubricants and that tribochemical, adsorption, and reaction‐diffusion effect of ZDDP, decided on great effectiveness of generated antiwear surface layers, which was confirmed by the results of tribological investigation.

The paper aims to present a research on the impact of the stabilization process of a thin metallic layer (Ni-P) produced on a ceramic surface (Al₂O₃) by means of electroless metallization on its electric parameters and structure. On the basis of the research conducted, the existence of a relationship between resistance (R) and the temperature coefficient of resistance (TCR) of the test structure with a Ni-P alloy-based layer and the temperature of stabilization was proposed.

Metallic Ni-P layers were deposited on sensitized and activated substrates. Metallization was conducted in an aqueous solution containing two primary ingredients: sodium hypophosphite and nickel chloride. The concentration of both ingredients was (50-70) g/dm³. The process lasted 60 min, and the metallization bath pH was kept at 2.1-2.2, whereas the temperature was maintained at 363 K. The thermal stabilization process was conducted in different temperatures between 453 and 623 K. After the technological processes, the resistance and TCR of the test structures were measured with a micro ohmmeter. The composition and the morphology of the resistive layer of the structures examined was also determined.

The dependence of the resistance on the temperature of the stabilization process for the temperature range 553 to 623 K was described using mathematical relationships. The TCR of test resistors at the same thermal stabilization temperature range was also described using a mathematical equation. The measurements show that the resistive layer contains 82.01 at.% of nickel (Ni) and 17.99 at.% of phosphorus (P).

The results associate a surface morphology Ni-P alloy with the resistance and TCR according to temperature stabilization. The paper presents mathematical relationships that have not been described in the literature available.