Search results

The purpose of this paper is to present current state of understanding on jet electrodeposition manufacturing; to compare various experimental parameters and their implication on as deposited features; and to understand the characteristics of jet electrodeposition deposition defects and its preventive procedures through available research articles.

A systematic review has been done based on available research articles focused on jet electrodeposition and its characteristics. The review begins with a brief introduction to micro-electrodeposition and high-speed selective jet electrodeposition (HSSJED). The research and developments on how jet electrochemical manufacturing are clustered with conventional micro-electrodeposition and their developments. Furthermore, this study converges on comparative analysis on HSSJED and recent research trends in high-speed jet electrodeposition of metals, their alloys and composites and presents potential perspectives for the future research direction in the final section.

Edge defect, optimum nozzle height and controlled deposition remain major challenges in electrochemical manufacturing. On-situ deposition can be used as initial structural material for micro and nanoelectronic devices. Integration of ultrasonic, laser and acoustic source to jet electrochemical manufacturing are current trends that are promising enhanced homogeneity, controlled density and porosity with high precision manufacturing.

This paper discusses the key issue associated to high-speed jet electrodeposition process. Emphasis has been given to various electrochemical parameters and their effect on deposition. Pros and cons of variations in electrochemical parameters have been studied by comparing the available reports on experimental investigations. Defects and their preventive measures have also been discussed. This review presented a summary of past achievements and recent advancements in the field of jet electrochemical manufacturing.

The purpose of this paper is to familiarize the reader with the capabilities of EFAB technology, a unique additive manufacturing process which yields fully assembled, functional mechanisms from metal on the micro to millimeter scale, and applications in medical devices.

The process is based on multi‐layer electrodeposition and planarization of at least two metals: one structural and one sacrificial. After a period of initial commercial development, it was scaled up from a prototyping‐only to a production process, and biocompatible metals were developed for medical applications.

The process yields complex, functional metal micro‐components and mechanisms with tight tolerances from biocompatible metals, in low‐high production volume.

The process described has multiple commercial applications, including minimally invasive medical instruments and implants, probes for semiconductor testing, military fuzing and inertial sensing devices, millimeter wave components, and microfluidic devices.

The process described in this paper is unusual among additive fabrication processes in being able to manufacture in high volume, and in its ability to produce devices with microscale features. It is one of only a few additive manufacturing processes that can produce metal parts or multi‐component mechanisms.

The technological development and characteristics of an innovative process and composition for immersion plating and fusing of a solderable tin/lead deposit over copper are discussed. The process offers a viable alternative to hot air solder levelling, electrodeposition/selective stripping, or inhibitor coatings for maintaining solderability of printed wiring boards. A flat, uniform solderable tin/lead coating on all feature surfaces and edges is achieved. A number of important benefits are derived. The ability to coat any copper surface uniformly, including fine pitch features, is substantially enhanced. Solderability is improved because of a thick, flat, co‐planar and uniform tin/lead deposit on all copper surfaces. Typical thickness and composition of the fused alloy are 150 to 300 microinches (4 to 8 microns) and 65 to 75% tin.

The purpose of this study is to model a multisource uncertain unit-cost learning process to estimate the future unit cost of manufactured products.

A multilayer fuzzy neural network (FNN) is constructed to model a multisource uncertain unit-cost learning process. A fuzzy constrained gradient descent algorithm is proposed to train the FNN.

The proposed methodology was applied to a wafer fabrication factory. Wafer fabrication, a well-known additive manufacturing process, is a highly competitive industry; therefore, the manager of a wafer fabrication factory is concerned about the unit cost of each product. This cost can be reduced through learning processes, but these involve much uncertainty, making the estimation of the unit cost a challenging task. Existing methods for modeling these processes and outcomes cannot account for multiple learning sources. However, the multilayer FNN constructed in this study successfully addressed these problems and improved the accuracy of the unit cost estimation by 88 per cent in a real case study.

Modeling an uncertain unit-cost learning process is an innovative application of an FNN. In addition, the proposed methodology is the first attempt to separate the effects of several learning sources, which is considered conducive to the estimation performance.

The purpose of this paper is to optimize experimental parameters and gain further insights into the plating process in the fabrication of high-density interconnections of printed circuit boards (PCBs) by the rotating disc electrode (RDE) model. Via metallization by copper electrodeposition for interconnection of PCBs has become increasingly important. In this metallization technique, copper is directly filled into the vias using special additives. To investigate electrochemical reaction mechanisms of electrodeposition in aqueous solutions, using experiments on an RDE is common practice.

An electrochemical model is presented to describe the kinetics of copper electrodeposition on an RDE, which builds a bridge between the theoretical and experimental study for non-uniform copper electrodeposition in PCB manufacturing. Comsol Multiphysics, a multiphysics simulation platform, is invited to modeling flow field and potential distribution based on a two-dimensional (2D) axisymmetric physical modeling. The flow pattern in the electrolyte is determined by the 2D Navier–Stokes equations. Primary, secondary and tertiary current distributions are performed by the finite element method of multiphysics coupling.

The ion concentration gradient near the cathode and the thickness of the diffusion layer under different rotating velocities are achieved by the finite element method of multiphysics coupling. The calculated concentration and boundary layer thicknesses agree well with those from the theoretical Levich equation. The effect of fluid flow on the current distribution over the electrode surface is also investigated in this model. The results reveal the impact of flow parameters on the current density distribution and thickness of plating layer, which are most concerned in the production of PCBs.

By RDE electrochemical model, we build a bridge between the theoretical and experimental study for control of uniformity of plating layer by concentration boundary layer in PCB manufacturing. By means of a multiphysics coupling platform, we can accurately analyze and forecast the characteristic of the entire electrochemical system. These results reveal theoretical connections of current density distribution and plating thickness, with controlled parameters in the plating process to further help us comprehensively understand the mechanism of copper electrodeposition.

The purpose of this paper is to enhance the understanding on the electrodeposition of various lead (Pb)‐free solder alloys, so that new studies can be carried out to solve processing issues.

The paper reviews the available reports on the electrodeposition of tin (Sn)‐based solder systems and identifies the challenges in this area.

Compositional control remains a major challenge in this area, where the achievement of desired composition for binary and ternary alloys is subjected to uncertainties. The use of chelating agents in the bath and optimization of parameters can assist the achievement of near‐desired alloy composition. Acidic plating baths are preferred due to their compatibility with photoresists but oxidation of stannous ions causes poor bath stability. Antioxidants, reducing agents and low oxygen overpotential anodes can suppress the oxidation rate and increase the lifespan of plating baths. Apart from chelating agents and antioxidants, various categories of additives can be added to improve quality of deposits. Surfactants, grain refiners and brighteners are routinely used to obtain smooth, fine‐grained and bright deposits with good thermo‐mechanical properties.

The paper provides information on the key issues in electrodeposition of Pb‐free solder alloys. Possible measures to alleviate the issues are suggested so that the electrodeposition technique can be established for mass production of a wider range of solder alloys.

Solar selective coatings are designed and formulated for effective collection and retention of solar energy. Several types of coatings can be utilized for economical collection of solar energy, the most common and simplest will be ordinary non‐glass, heat resistant black paint. The coatings may be moderately selective or non‐selective absorbers, consisting of organic or inorganic matt black paints. These are easiest to apply and the least expensive of all collector coatings. In this category other types are ceramic and organic enamels and chemical or electrochemical metal conversion coatings. An impending energy crisis has already aroused interest and scientific pursuit in the field. An analysis of the state‐of‐the‐art in solar selective coatings was felt necessary at this time.

The purpose of this paper is to study the effect of chromium content on the microstructure and corrosion resistance of Ni-Cr coating.

Ni-Cr coating was prepared by pulse current electrodeposition with trivalent chromium. On the basis of studying effect of electroplating parameters on composition and morphology, Ni-Cr alloy coatings with various chromium contents were obtained. The microstructure was characterized by scanning electron microscopy, X-ray diffractometer and transmission electron microscopy. Corrosion behavior was studied by potentiodynamic polarization and electrochemical impedance spectroscopy techniques.

Electrodeposited chromium was solidly dissolved in nickel and refined the grain of the coating. With the increase of Cr content, the corrosion resistance of Ni-Cr coating was enhanced, which is due to the formation of continuous nickel hydroxide and compact chromium oxide passive films.

Ni-Cr alloy coating without penetration crack was prepared in trivalent chromium electrolyte, and the mechanism of its excellent corrosion resistance was proposed.

As an advanced manufacturing method, additive manufacturing (AM) technology provides new possibilities for efficient production and design of parts. However, with the continuous expansion of the application of AM materials, subtractive processing has become one of the necessary steps to improve the accuracy and performance of parts. In this paper, the processing process of AM materials is discussed in depth, and the surface integrity problem caused by it is discussed.

Firstly, we listed and analyzed the characterization parameters of metal surface integrity and its influence on the performance of parts and then introduced the application of integrated processing of metal adding and subtracting materials and the influence of different processing forms on the surface integrity of parts. The surface of the trial-cut material is detected and analyzed, and the surface of the integrated processing of adding and subtracting materials is compared with that of the pure processing of reducing materials, so that the corresponding conclusions are obtained.

In this process, we also found some surface integrity problems, such as knife marks, residual stress and thermal effects. These problems may have a potential negative impact on the performance of the final parts. In processing, we can try to use other integrated processing technologies of adding and subtracting materials, try to combine various integrated processing technologies of adding and subtracting materials, or consider exploring more efficient AM technology to improve processing efficiency. We can also consider adopting production process optimization measures to reduce the processing cost of adding and subtracting materials.

With the gradual improvement of the requirements for the surface quality of parts in the production process and the in-depth implementation of sustainable manufacturing, the demand for integrated processing of metal addition and subtraction materials is likely to continue to grow in the future. By deeply understanding and studying the problems of material reduction and surface integrity of AM materials, we can better meet the challenges in the manufacturing process and improve the quality and performance of parts. This research is very important for promoting the development of manufacturing technology and achieving success in practical application.

Cyclic voltametric studies were carried out on mixtures of nickel sulphate, ferrous ammonium sulphate containing ethylene diamine tetra acetic acid, triammonium citrate, boric acid, Sodium chloride in the pH range of 8.5‐10.5 on platinum. The deposition of iron was found to involve the formation of FeOH⁺ and the second electron transfer is slow. The formation of iron nickel alloy film is anomalous. The charge transfer rates of FeOH⁺ and NiOH⁺ determine the deposition. Stripping voltametric curves revealed the dissolution of iron from an intermediate phase rich of iron in the iron‐nickel films.