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Advanced surface protection for improved reliability PCB systems (ASPIS)

Andy Ballantyne (Department of Chemistry, University of Leicester, Leicester, UK)
Greg Forrest (Department of Chemistry, University of Leicester, Leicester, UK)
Martin Goosey (Institute of Circuit Technology Ltd, Tonbridge, UK)
Asta Griguceviciene (The Center for Physical Sciences and Technology, Vilnius, Lithuania)
Jurga Juodkazyte (The Center for Physical Sciences and Technology, Vilnius, Lithuania)
Rod Kellner (Env‐Aqua Solutions Ltd, Rugby, UK)
Aleksandr Kosenko (The Center for Physical Sciences and Technology, Vilnius, Lithuania)
Rimantas Ramanauskas (The Center for Physical Sciences and Technology, Vilnius, Lithuania)
Karl Ryder (Department of Chemistry, University of Leicester, Leicester, UK)
Algirdas Selskis (The Center for Physical Sciences and Technology, Vilnius, Lithuania)
Rima Tarozaite (The Center for Physical Sciences and Technology, Vilnius, Lithuania)
Erik Veninga (TNO Technical Sciences, Eindhoven, The Netherlands)

Circuit World

ISSN: 0305-6120

Article publication date: 3 February 2012

399

Abstract

Purpose

The purpose of this paper is to detail progress on the European Commission supported FP7 ASPIS project that is undertaking a multi‐faceted approach to develop novel and improved nickel‐gold (ENIG) solderable finish chemistries and processes in order to overcome issues such as “black pad” that are known to cause reliability issues.

Design/methodology/approach

The ASPIS project has four key and discrete approaches; research into “black pad” formation mechanisms, development of new aqueous chemical deposition methods, formulation of new processes based on ionic liquids and the development of prognostic screening tools to enable early prediction of reliability issues.

Findings

Key factors influencing “black pad” formation include immersion gold bath pH value, concentration of citrate and thickness of the immersion gold layer. In addition, copper substrate preparation is also important. Work to develop new metal deposition processes using ionic liquids has also been demonstrated and may provide a viable alternative to more conventional aqueous based chemistries, thereby enabling some of the conditions that lead to “black pad” to be avoided.

Research limitations/implications

This paper summarises the work carried out in the first year of a three‐year project and so the outputs to date are relatively limited. The project is continuing for another two years, when further progress will be made. It is hoped to report this progress in a future update paper.

Originality/value

The ASPIS project has undertaken multiple approaches to the development of new high reliability nickel gold finishes and this combination of approaches should offer synergies over more discrete traditional methodologies. As well as undertaking a detailed analysis of the mechanisms causing reliability problems, radical new formulation and prognostic approaches are also being developed.

Keywords

Citation

Ballantyne, A., Forrest, G., Goosey, M., Griguceviciene, A., Juodkazyte, J., Kellner, R., Kosenko, A., Ramanauskas, R., Ryder, K., Selskis, A., Tarozaite, R. and Veninga, E. (2012), "Advanced surface protection for improved reliability PCB systems (ASPIS)", Circuit World, Vol. 38 No. 1, pp. 21-29. https://doi.org/10.1108/03056121211195021

Publisher

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Emerald Group Publishing Limited

Copyright © 2012, Emerald Group Publishing Limited

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