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Power electronics are usually soldered to Al₂‐O₃ direct‐bond‐copper (DBC) substrates to increase thermal diffusivity, while at the same time increasing electrical isolation. However, soldering gives rise to inherent residual stresses and out‐of‐plane deformation. The purpose of this paper is to look at the effect of soldering processes of Al₂‐O₃ DBC substrates to copper plates and power electronics, on their thermal fatigue life and warpage.

A numerical thermo‐mechanical finite element model, using the Chaboche material model, was developed to identify the thermal plastic strains evolved during soldering of DBC substrates to copper plates and power electronics. The plastic strains in conjunction with established extremely low cycle fatigue life prediction model for ductile material were used to predict the number of soldering cycles to failure. The predicted out‐of‐plane deformation and number of soldering cycles to failures was compared to realistic tests.

Soldering processes drastically reduce the thermal fatigue life of DBC substrates, giving rise to thermal cracking and premature failure. In this study the soldering process considered gave rise to out‐of‐plane deformations, consequently reducing heat dispersion in soldered DBC substrate assemblies. Furthermore, soldering gave rise to interface cracking and failed after three soldering cycles. Numerical finite element models were developed and are in good agreement with the experimental tests results.

The influence of soldering processes of DBC substrates to copper plates and electronics on the thermal fatigue life should be taken into consideration when establishing the design life of DBC substrates. Finite element models can be utilised to optimize soldering processes and optimize the design of DBC substrates.

The effect of soldering processes on DBC substrates was studied. A numerical finite element model used for the prediction of design life cycle and out‐of‐plane deformation is proposed.

Due to increasing density and high demands on electrical and thermal performance, modern packages require alternative chip interconnection and substrate technologies. Flip‐chip (FC) bonding is a suitable method for high interconnection densities. Compared with wire bonding and TAB, FC provides the highest contact density. This is due to the possibility of using the whole chip surface for bondpads (area bumps). In this paper, an adapted FC technology on green tape ceramic substrates was investigated. In order to reduce the substrate costs, FC bonding was performed directly on the thick film metallisation without the application of thin film technology for the upper substrate layers. Two solder bump metallurgies: PbSn95/5 and Au/Sn solder bumps were applied for fluxless FC bonding on adapted substrate metallisations. Fluxless soldering is performed by single chip bonding and requires substrates with narrow planarity tolerances. An alternative method using a wet eutectic Au/Sn solder paste on the substrate and Au bumps permits the application of substrates with standard planarity tolerances used in thick film applications. A common reflow of all chips of a multichip module is possible. First reliability results of metallurgical analysis and of the mechanical and electrical behaviour of the FC contacts after thermal cycling are presented.

Strain gauges can be realised by printing and firing thick‐film resistors on ceramic substrates that are usually based on alumina. However, sensing elements made on some other substrates – tetragonal zirconia or stainless steel – would exhibit some improved characteristics, either due to a lower modulus of elasticity or a higher mechanical strength. As thick‐film resistors are developed for firing on alumina substrates their compatibility and possible interactions with other kinds of substrates have to be evaluated. The sheet resistivities and noise indices of the resistors were comparable, whereas the gauge factors were lower for the dielectric‐on‐steel substrates. The temperature coefficients of resistivity (TCR) of the resistors on the ZrO₂ and dielectric‐on‐steel substrates were higher than the TCRs on the alumina substrates, which was attributed to the higher thermal expansion coefficient of the tetragonal zirconia and the stainless steel.

A novel interconnect technology, introducing thin film on a laminate substrate base, is presented. A specially constructed laminate board is used as a substrate for the thin film build‐up process. The main characteristics of the laminate core substrate are the z‐axis electrical connections, the absence of holes in the substrate and the very flat nature of the top surface. As a result, the base substrate can be processed further in a thin film processing line. The manufacturing and properties of these substrates are discussed.

A new hybrid substrate technology for power electronic applications has been characterised by thermal resistance and mechanical stress measurements. The new substrate utilises thermal spray technology for deposition of dielectric layer and electrical conductors. The results are compared with the more established technology of alumina substrates with direct copper bonding (DCB) metallisation. Silicon test chips for thermal resistance and mechanical stress measurement were used for the characterisation. The experimental results were compared with finite element analysis and a reasonable agreement was found.

The purpose of this paper is to address the influence of deposition process parameters. The substrate heating mechanisms are also discussed.

Deposition duration, sputtering power, working gas pressure, and substrate heater temperature on substrate heating in the direct current (DC) magnetron sputtering deposition process were investigated.

Results from the experiments show that, in DC magnetron sputtering deposition process, substrate heating is largely influenced by the process parameters and conditions.

This paper usefully demonstrates that substrate heating effects can be minimized by adjusting and selecting the proper sputtering process parameters; the production cost can be reduced by employing a higher sputtering power, lower working gas pressure and shorter deposition duration.

This study aims to investigate the factors responsible for substrate cracking reliability problem in through-glass vias (TGVs), which are critical components for glass-based 2.5 D integration.

Numerical models were used to examine the driving force for substrate cracking in glass interposers due to stress coupling during heating. An analytical solution was used to demonstrate how the energy release rate (ERR) for the glass substrate cracking is affected by the via design and the mismatch in thermal strain. Then, the numerical models were implemented to investigate the design factors effects, such as the pitch distance, via diameter, via pattern, via design, effect from a stress buffer layer and the interposer materials selection on the susceptibility to substrate cracking.

ERR for substrate cracking was found to be directly proportional to the via diameter and the thermal mismatch strain. When a via pattern is implemented for high-density integration, a coupling in the stress fields was identified. This coupling effect was found to depend on the pitch distance, the position of the vias, and the via arrangement, suggesting a via pattern-dependent reliability behavior for glass interposers. Changing the design of the via to an annular shape or a substrate-cored via was found to be a promising approach to reduce the susceptibility to substrate cracking compared to a fully filled solid via. Also, the use of a stress buffer layer, an encouraging design prospect presented for the first time for TGVs in this study, was found to significantly reduce cracking. Finally, alternative via and substrate materials showed lower tendency for substrate cracking, indicating that the reliability of glass interposers can be further enhanced with the implementation of such new materials.

This study signifies the first attempt to comprehensively evaluate the susceptibility to crack formation in glass interposers during heating. Therefore, this study provides new perspectives on how to achieve a significant potential reliability improvement for TGVs.

Nowadays, hydroponic cultivation represents a widely used agricultural methodology. The purpose of this paper is to study comparatively on hydroponic substrates. This study is highlighting the best substrate to be involved in hydroponic systems, considering its costs and its sustainability.

Seven substrates were evaluated: rock wool, perlite, vermiculite, peat, coconut fibres, bark and sand. Life cycle assessment (life cycle inventory, life cycle impact assessment (LCIA) and life cycle costing (LCC)) was applied to evaluate the environmental and economic impact. Through the results of the impacts, the carbon footprint of each substrate was calculated.

Perlite is the most impacting substrate, as highlighted by LCIA, followed by rock wool and vermiculite. The most sustainable ones, instead, are sand and bark. Sand has the lower carbon footprint (0.0121 kg CO₂ eq.); instead, bark carbon footprint results in one of the highest (1.1197 kg CO₂ eq.), while in the total impact analysis this substrate seems to be highly sustainable. Also for perlite the two results are in disagreement: it has a high total impact but very low carbon footprint (0.0209 kg CO₂ eq.) compared to the other substrates. From the LCC analysis it appears that peat is the most expensive substrate (€6.67/1,000 cm³), while sand is the cheaper one (€0.26/1,000 cm³).

The LCA and carbon footprint methodologies were applied to a growing agriculture practice. This study has highlighted the economic and environmental sustainability of seven substrates examined. This analysis has shown that sand can be the best substrate to be involved in hydroponic systems by considering its costs and its sustainability.

Selective laser melting (SLM) is a promising additive manufacturing technology in the field of complex parts’ fabrication. High temperature gradient and residual stress are vital problems for the development of SLM technology. The purpose of this paper is to investigate the influence of substrate characteristics on the residual stress of SLMed Inconel 718 (IN718).

The SLMed IN718 samples were fabricated on the substrates with different characteristics, including pre-compression stress, materials and pre-heating. The residual stress at the center of the top surface was measured and compared through Vickers micro-indentation.

The results indicate that the residual stress reduces when the substrate contains pre-compression stress before the SLM process starts. Both substrate thermal expansion coefficient and thermal conductivity affect the residual stress. In addition to reducing the difference of thermal expansion coefficient between the substrate and the deposited material, the substrate with low thermal conductivity can also decrease the residual stress. Substrate pre-heating at 150°C reduces nearly 42.6 per cent residual stress because of the reduction of the temperature gradient.

The influence of substrate characteristics on the residual stress has been studied. The investigation results can help to control the residual stress generated in SLM processing.

Once an uneven substrate is aligned, traditional control theories and methods can be used on it, so aligning is of great significance for the development of wire and arc additive manufacturing (WAAM). This paper aims to propose a shape-driven control method for aligning a substrate with slopes to expand the application of WAAM.

A substrate with slopes must be aligned by depositing weld beads with slopes. First, considering the large height differences of slopes, multi-layer deposition is needed, and the number of layer of weld beads must be ascertained. Second, the change in the deposition rate is controlled as a ramp function to generate weld beads with slopes. Third, the variation of the deposition rate must be fine-tuned to compensate for the deviation between the actual and theoretical layer heights at the deposition of each layer. Finally, the parameters of the ramp functions at the deposition of each layer are determined through an optimization method.

First, to model the response function of layer height to deposition rate, the experiments are conducted with the deposition rate jumping from 4 to 8 mm/s and from 8 to 4 mm/s. When the deposition rate jumps from 4 to 8 mm/s and from 8 to 4 mm/s, the difference in the height of each layer decreases as the number of layer increases. Second, the variation of the deposition rate can be fine-tuned based on the deviation between the measured and theoretical layer heights because the variation of the deposition rate is proportional to the layer height when the initial and end deposition rates are near 4 or 8 mm/s, respectively. Third, the experimental results demonstrate that the proposed method is effective for single-layer aligning and aligning a substrate with one or more slopes.

The proposed method can expand the application of WAAM to an uneven substrate with slopes and lays the foundation for aligning tasks focused on uneven substrates with more complex shapes.