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This study aims to investigate the effect of electrodeposition parameters (i.e. time and voltage) on the properties of hydroxyapatite (HA) coating fabricated on Ti6Al4V surface.

A full factorial design along with response surface methodology was utilized to evaluate the main effect of independent variables and their relative interactions on response variables. The effect of electrodeposition voltage and deposition time on HA coatings Ca/P molar ratio and the size of deposited HA crystals were examined by structural equation modeling (SEM). The formation of plate-like and needle-like HA crystals was observed for all experiments.

The results obtained showed that the higher electrodeposition voltage leads to lower Ca/P values for HA coatings. This is more significant at lower deposition times, where at a 20-minute deposition time, the voltage increased from 2 to 3 V and the Ca/P decreased from 2.27 to 1.52. Full factorial design results showed that electrodeposition voltage has a more significant effect on the size of the deposited HA crystal. With increasing the voltage from 2 to 3 V at a deposition time of 20 min, the HA crystal size varied from 99 to 36 µm.

The investigation delved into the impact of two critical parameters, deposition time and voltage, within the electrodeposition process on two paramount properties of HA coatings. Analyzing the alterations in coating characteristics relative to variations in these process parameters can serve as a foundational guide for subsequent research in the domain of calcium-phosphate deposition for implants.

The purpose of this paper is to present current state of understanding on jet electrodeposition manufacturing; to compare various experimental parameters and their implication on as deposited features; and to understand the characteristics of jet electrodeposition deposition defects and its preventive procedures through available research articles.

A systematic review has been done based on available research articles focused on jet electrodeposition and its characteristics. The review begins with a brief introduction to micro-electrodeposition and high-speed selective jet electrodeposition (HSSJED). The research and developments on how jet electrochemical manufacturing are clustered with conventional micro-electrodeposition and their developments. Furthermore, this study converges on comparative analysis on HSSJED and recent research trends in high-speed jet electrodeposition of metals, their alloys and composites and presents potential perspectives for the future research direction in the final section.

Edge defect, optimum nozzle height and controlled deposition remain major challenges in electrochemical manufacturing. On-situ deposition can be used as initial structural material for micro and nanoelectronic devices. Integration of ultrasonic, laser and acoustic source to jet electrochemical manufacturing are current trends that are promising enhanced homogeneity, controlled density and porosity with high precision manufacturing.

This paper discusses the key issue associated to high-speed jet electrodeposition process. Emphasis has been given to various electrochemical parameters and their effect on deposition. Pros and cons of variations in electrochemical parameters have been studied by comparing the available reports on experimental investigations. Defects and their preventive measures have also been discussed. This review presented a summary of past achievements and recent advancements in the field of jet electrochemical manufacturing.

Copper electrodeposition acts as a crucial step in the manufacture of high-density interconnect board. The stability of plating solution and the uniformity of copper electrodeposit are the hotspot and difficulty for the research of electrodeposition. Because a large number of factors are included in electrodeposition, experimentally determining all parameters and electrodeposition conditions becomes unmanageable. Therefore, a multiphysics coupling technology was introduced to investigate microvia filling process, and the mechanism of copper electrodeposition was analyzed. The results provide a strong theoretical basis and technical guidance for the actual electroplating experiments. The purpose of this paper is to provide an excellent tool for quickly and cheaply studying the process behavior of copper electrodeposition without actually needing to execute time-consuming and costly experiments.

The interactions among additives used in acidic copper plating solution for microvia filling and the effect on the copper deposition potential were characterized through galvanostatic measurement (GM). The adsorption behavior and surface coverage of additives with various concentrations under different rotating speeds of working electrode were investigated using cyclic voltammetry (CV) measurements. Further, a microvia filling model was constructed using multiphysics coupling technology based on the finite element method.

GM tests showed that accelerator, inhibitor and leveler affected the potential of copper electrodeposition, and bis(3-sulfopropyl) disulfide (SPS), ethylene oxide-propylene oxide (EO/PO) co-polymer, and self-made leveler were the effective additives in acidic copper plating solution. CV tests showed that EO/PO–Cu⁺-Cl⁻ complex was adsorbed on the electrode surface by intermolecular forces, thus inhibiting copper electrodeposition. Numerical simulation indicated that the process of microvia filling included initial growth period, the outbreak period and the stable growth period, and modeling result was compared with the measured data, and a good agreement was observed.

The research is still in progress with the development of high-performance computers.

A multiphysics coupling platform is an excellent tool for quickly and cheaply studying the electrodeposited process behaviors under a variety of operating conditions.

The numerical simulation method has laid the foundation for mechanism of copper electrodeposition.

By using multiphysics coupling technology, the authors built a bridge between theoretical and experimental study for microvia filling. This method can help explain the mechanism of copper electrodeposition.

This study aims to review the current one-step electrodeposition of superhydrophobic coatings on metal surfaces.

One-step electrodeposition is a versatile and simple technology to prepare superhydrophobic coatings on metal surfaces.

Preparing superhydrophobic coatings by one-step electrodeposition is an efficient method to protect metal surfaces.

Even though there are several technologies, one-step electrodeposition still plays a significant role in producing superhydrophobic coatings.

The purpose of this paper is to enhance the understanding on the electrodeposition of various lead (Pb)‐free solder alloys, so that new studies can be carried out to solve processing issues.

The paper reviews the available reports on the electrodeposition of tin (Sn)‐based solder systems and identifies the challenges in this area.

Compositional control remains a major challenge in this area, where the achievement of desired composition for binary and ternary alloys is subjected to uncertainties. The use of chelating agents in the bath and optimization of parameters can assist the achievement of near‐desired alloy composition. Acidic plating baths are preferred due to their compatibility with photoresists but oxidation of stannous ions causes poor bath stability. Antioxidants, reducing agents and low oxygen overpotential anodes can suppress the oxidation rate and increase the lifespan of plating baths. Apart from chelating agents and antioxidants, various categories of additives can be added to improve quality of deposits. Surfactants, grain refiners and brighteners are routinely used to obtain smooth, fine‐grained and bright deposits with good thermo‐mechanical properties.

The paper provides information on the key issues in electrodeposition of Pb‐free solder alloys. Possible measures to alleviate the issues are suggested so that the electrodeposition technique can be established for mass production of a wider range of solder alloys.

Water soluble epoxy resins were prepared from epoxy resin, linseed fatty acids, maleic anhydride, trimellitic anhydride, maleinised dehydrated castor oil and maleopimaric acid. Pigmented coating compositions for anodic electrodepositions were prepared from water soluble epoxy resins using red oxide of iron and zinc phosphate as pigment. The electrodeposition parameters such as voltage, time, solid content and pH value were optimised. The mechanical and chemical film properties of different electrocoating compositions were studied.

The uniformity of electrodeposition is the key to successful application of pattern plating because the quality of electrodeposited copper layer has a huge impact on the performance of printed circuit boards (PCBs). The multi-physics coupling technology was used to accurately analyze and forecast the characteristics of electrochemical system. Further, an optimized plating bath was used to achieve a uniform electrodeposition.

A multi-physics coupling numerical simulation based on the finite element method was used to optimize electrodeposition conditions in pattern plating process. The influences of geometric and electrochemical factors on uniformity of current distribution and electrodeposited layer thickness were discussed by multi-physics coupling.

The model results showed that the distance between cathode and anode and the insulating shield had a great impact on uniformity of electrodeposition. By numerical simulation, it had been proved that using an auxiliary cathode was an effective and simple way to improve uniformity of electrodeposition due to redistributing of the current. This helped to achieve more uniform surface of the copper patterns by preventing the edge effect and the roughness of the copper layer was reduced to 1 per cent in the secondary current distribution model.

The research is still in progress with the development of high-performance computers.

A multi-physics coupling platform is an excellent tool for quickly and cheaply studying the process behaviors under a variety of operating conditions.

The numerical simulation method has laid the foundation for the design and improvement of the plating bath.

By multi-physics coupling technology, we built a bridge between theoretical and experimental study for control of uniformity of pattern plating in PCB manufacturing. This method can help optimize the design of plating bath and uniformity of pattern plating in PCB manufacturing.

The electrodeposition of any metal over titanium substrates meets with many problems due to the formation of a non‐conductive layer of titanium oxide on the surface of substrates during the electroplating process. Trials were made to overcome these problems by the pre‐anodisation of titanium substrates in oxalic acid solution of concentration 100g/l, at high current density of 60‐95mA/cm^–2, and at ambient temperature. In these conditions, a thin, porous and conductive titanium oxide film can be obtained, which will then support electroplating processes. Rhodium metal was electrodeposited over the anodised titanium substrates from a bath consisting of Rh₂(SO₄)₃, 5.2g/l and H₂SO₄, 100g/l. At optimum conditions of electroplating, the rhodium electrodeposits were formed over the anodised titanium substrate with high adhesion, brightness and high current efficiency (92.05 per cent).

The purpose of this paper is to investigate the corrosion resistance and the electrodeposition behavior of electrodeposited nickel‐cobalt‐iron alloys. Also, to compare the electrodeposition of ternary nickel‐cobalt‐iron alloy from acidic sulfate bath onto a steel substrate with the characteristics of Co‐Fe electrodeposits.

The investigation of electrodeposition was carried out using cyclic voltammetry and galvanostatic techniques, while potentiodynamic polarization resistance and anodic linear sweep voltammetry techniques were used for corrosion study. The phase structure was characterized by means of X‐ray diffraction analysis. The surface morphology and chemical composition of the deposits were examined by using scanning electron microscopy and atomic absorption spectroscopy, respectively.

The obtained results revealed that the Ni‐Co‐Fe alloys consisted of a mixture of iron (Fe10.8Ni) and (FeCo) phases. It was found that the obtained Ni‐Co‐Fe alloy exhibited a more‐preferred surface appearance and better corrosion resistance, compared to the Co‐Fe alloy that was electrodeposited under similar conditions.

Ni‐Co‐Fe alloy was successfully electroplated from a sulfate bath. This alloy showed better anticorrosion properties compared to Co‐Fe deposits. The Ni‐Co‐Fe alloy could be used advantageously in industry, e.g. the automotive industry. The coating also has particular interest due to it is ability to exhibit stable magnetic properties.

The paper evaluates the effect of electrodeposition of the ternary alloy on the corrosion behavior of electroplated steel. To date, there has been little research on this issue. It was found that the presence of Ni could increase the corrosion resistance of steel.

Water soluble alkyds were prepared from phthalic anhydride, maleic anhydride, trimellitic anhydride and maleopimaric acid separately by monoglyceride process. Pigmented electro coating compositions were prepared from water soluble alkyd resin, red oxide of iron and zinc phosphate. The anodic electrodeposition parameters such as voltage, time, solid content and pH were optimised. The mechanical and chemical properties of different electrocoating compositions were studied. The coating compositions prepared from water soluble alkyd resin based in maleopimaric acid showed good mechanical and chemical properties.