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This paper aims to design the circuit for electromagnetic interface (EMI) reduction in liquid crystal display (LCD).

The cascode level shifter and segmented driver circuit are applied in LCD column driver integrated circuit (IC) for EMI reduction. Cascode current mirror is used in the proposed level shifter for DC voltage biasing and reduction of the driving current which passes through the level shifter. The on-off switching currents and transient times are measured and compared between the conventional and proposed level shifters. Additionally, a segmented data latch is obtained by the timing spread solution in data latch, and applied to split the large peak switching current into a number of smaller peak current. The timing spread-operation does not actually reduce the total power of the noise, instead, it spreads the noise power evenly over the frequency bandwidth. The optimal number of latch is dependent on the operating frequency and EMI allowance. The column driver IC and clock controller are integrated in 0.18 μm CMOS technology with 1-poly and 4-metal process.

The post-layout simulation shows that the proposed column driver circuit for LCD driver IC significantly reduces the peak switching current, and it results in the reduction of EMI noise level by more than 15 dB. It is obtained with 20 segmented operations in data latch at 40 MHz frequency.

The advantage of the cascode current source is that it can provide a well-controlled bias current with an accurate current transfer ratio. To reduce the EMI noise in LCD driver circuit, the cascode current source is properly located for the DC bias block in the level shifter. The application is rarely done by others, and a significant EMI noise reduction is found. The well-controlled current source provides a high performance switching in the level shifter.

The purpose of this paper is to introduce a low power digital‐to‐analog converter (DAC) by using a sequential triggering technique in cascaded current source.

The block of current cell consists of current switch and source. A sequential switching on process is implemented with the current triggering technique in source. An experiment of 12‐b 150‐MS/s DAC has been integrated in a single‐poly four‐metal 0.35 μm CMOS process.

Compared with conventional cell array in 12‐b 150‐MS/s DAC, the proposed cell array shows that more than 30 percent of power consumption is reduced in full digital bit operation with allowable linearity error of 0.4 LSB.

This paper presents a new operation method of cell array in a current‐steering digital‐to‐analog converter (DAC) to reduce the power consumption significantly.

This paper aims to propose a low-power complementary MOS (CMOS) current sensor for control circuit in an integrated DC-DC buck converter.

The integrated DC-DC converter, which is composed of feedback control circuit and power block, is designed with 0.35-µm CMOS process. Current sensor in the control circuit is integrated with sense-FET and voltage-follower circuits to reduce power consumption and improve its sensing accuracy. In the current-sensing circuit, the size ratio of the power metal oxide semiconductor field effect transistor (MOSFET) to the sensing transistor (K) is 1,000, and a current-mirror is used for a voltage follower. N-channel MOS acts as a switching device in the current-sensing circuit, where the sensing FET is in parallel with the power MOSFET. The amplifier and comparator are designed to obtain a high gain and a fast transient time.

Experiment shows that the current sensor is operated with accuracy of more than 85 per cent, and the transient time of the error amplifier is controlled within 100 µs. The sensing current is in the range of a few hundred µA at a frequency of 0.6-2 MHz and an input voltage of 3-5 V. The output voltage is obtained as expected with the ripple ratio within 5 per cent.

The proposed current sensor in DC-DC converter provides an accurately sensed inductor current with a significant reduction in power consumption in the range of 0.2 mW. High-accuracy regulation is obtained using the proposed current sensor. As the sensor utilizes simple switch-type voltage follower and sense-FET, it can be widely applied to other low-power applications such as high-frequency oscillator and over-current protection circuit.

In complementary metal-oxide-semiconductor (CMOS) logic circuits, there is a direct square proportion of supply voltage on dynamic power. If the supply voltage is high, then more amount of energy will be consumed. Therefore, if a low voltage supply is used, then dynamic power will also be reduced. In a mixed signal circuit, there can be a situation when lower voltage circuitry has to drive large voltage circuitry. In such a case, P-type metal-oxide-semiconductor of high-voltage circuitry may not be switched off completely by applying a low voltage as input. Therefore, there is a need for level shifter where low-voltage and high-voltage circuits are connected. In this paper the multi-scaling voltage level shifter is presented which overcomes the contention problems and suitable for low-power applications.

The voltage level shifter circuit is essential for digital and analog circuits in the on-chip integrated circuits. The modified voltage level shifter and reported energy-efficient voltage level shifter have been optimally designed to be functional in all process voltage and temperature corners for VDDH = 5V, VDDL = 2V and the input frequency of 5 MHz. The modified voltage level shifter and reported shifter circuits are implemented using Cadence Virtuoso at 90 nm CMOS technology and the comparison is made based on speed and power consumed by the circuit.

The voltage level shifter circuit discussed in this paper removes the contention problem that is present in conventional voltage level shifter. Moreover, it has the capability for up and down conversion and reduced power and delay as compared to conventional voltage level shifter. The efficiency of the circuit is improved in two ways, first, the current of the pull-up device is reduced and second, the strength of the pull-down device is increased.

The modified level shifter is faster for switching low input voltage to high output voltage and also high input voltage to low output voltage. The average power consumption for the multi-scaling voltage level shifter is 259.445 µW. The power consumption is very less in this technique and it is best suitable for low-power applications.

The aim of this paper is to better understand the generation and transmission mechanism of the electromagnetic acoustic transducer (EMAT).

A semi-analytical method was used to calculate the Lorentz force. Both the hypothetical magnetic field mirror method and the diffusion equation were adopted to solve the eddy current distribution by variables separation method in time domain. A three-dimension magnetostatic finite element model was used to calculate the static magnetic field and the relative permeability. And an experimental platform with a piezoelectric probe to generate and an EMAT to receive, the ultrasonic wave was set up to verify the distribution of the Lorentz force.

The Lorentz force at different time and in different positions of the steel plate can be easily calculated. The experimental results show a good agreement with the analytical results.

The accurate prediction of the Lorentz force provides an insight into the physical phenomenon of EMAT and a powerful tool to design optimum EMAT.

Because of the logic delay in the converter, the minimum turn on time of the switch is influenced by the constant time. When the inductor current gets to the threshold of the chip, the control signal will delay for a period. This makes the inductor current rising with the increasing of the clock and leads to the load current out of control. Thus, this paper aims to design an oscillator with a variable frequency protection function.

This paper presents an oscillator with the reducing frequency applied in the DC-DC converter. When the converter works normally, the operating frequency of the oscillator is 1.5 MHz. So the inductor current has enough time to decay and prevent the power transistor damaging. After the abnormal condition, the converter returns to the normal operating mode automatically.

Based on 0.5 µm CMOS process, simulated by the HSPICE, the simulation results shows that the frequency of the oscillator linearly decreases from 1.5 MHz to 380 KHz when the feedback voltage less than 0.2 V. The maximum deviation of the oscillator frequency is only 6 per cent from −50°C to 125°C within the power supply voltage of 2.7-5.5 V.

When the light load occurs at the output stage, the oscillator frequency will decrease as the load voltage drops. The test results shows that when the circuit works in the normal condition, the oscillator frequency is 1.5 MHz. When the load decreased, the operating frequency is dropped dramatically.

A fully integrated sensor microsystem for blue/ultraviolet radiation detection is presented. The photosensitive part combines a blue/UV selective stripe‐shaped photodiode with a small compensation infrared photodiode. A transimpedance amplifier with 1 GΩ feedback resistor is integrated on the same silicon chip. The main features of the op amp are a low offset (<0.5mV) and fail‐safe operation. This sensor has a maximal responsivity of 150 mV/nW at λ = 420 nm, corresponding to 43 percent quantum efficiency. A ratio of the responsivities at 420 nm and 1 μm as large as 560 is achieved. The system has a noise equivalent power of 5 10^‐13 W. The 2.2 mm² microsystem is realized in a standard CMOS 0.5 μm process.

The present paper aims to propose a basic current mirror-sensing circuit as an alternative to the traditional Wheatstone bridge circuit for the design and development of high-sensitivity complementary metal oxide semiconductor (CMOS)–microelectromechanical systems (MEMS)-integrated pressure sensors.

This paper investigates a novel current mirror-sensing-based CMOS–MEMS-integrated pressure-sensing structure based on the piezoresistive effect in metal oxide field effect transistor (MOSFET). A resistive loaded n-channel MOSFET-based current mirror pressure-sensing circuitry has been designed using 5-μm CMOS technology. The pressure-sensing structure consists of three identical 10-μm-long and 50-μm-wide n-channel MOSFETs connected in current mirror configuration, with its input transistor as a reference MOSFET and output transistors are the pressure-sensing MOSFETs embedded at the centre and near the fixed edge of a silicon diaphragm measuring 100 × 100 × 2.5 μm. This arrangement of MOSFETs enables the sensor to sense tensile and compressive stresses, developed in the diaphragm under externally applied pressure, with respect to the input reference transistor of the mirror circuit. An analytical model describing the complete behaviour of the integrated pressure sensor has been described. The simulation results of the pressure sensor show high pressure sensitivity and a good agreement with the theoretical model has been observed. A five mask level process flow for the fabrication of the current mirror-sensing-based pressure sensor has also been described. An n-channel MOSFET with aluminium gate was fabricated to verify the fabrication process and obtain its electrical characteristics using process and device simulation software. In addition, an aluminium gate metal-oxide semiconductor (MOS) capacitor was fabricated on a two-inch p-type silicon wafer and its CV characteristic curve was also measured experimentally. Finally, the paper presents a comparative study between the current mirror pressure-sensing circuit with the traditional Wheatstone bridge.

The simulated sensitivities of the pressure-sensing MOSFETs of the current mirror-integrated pressure sensor have been found to be approximately 375 and 410 mV/MPa with respect to the reference transistor, and approximately 785 mV/MPa with respect to each other. The highest pressure sensitivities of a quarter, half and full Wheatstone bridge circuits were found to be approximately 183, 366 and 738 mV/MPa, respectively. These results clearly show that the current mirror pressure-sensing circuit is comparable and better than the traditional Wheatstone bridge circuits.

The concept of using a basic current mirror circuit for sensing tensile and compressive stresses developed in micro-mechanical structures is new, fully compatible to standard CMOS processes and has a promising application in the development of miniaturized integrated micro-sensors and sensor arrays for automobile, medical and industrial applications.

This paper aims to describe the fabrication and characterization of current mirror-integrated microelectromechanical systems (MEMS)-based pressure sensor.

The integrated pressure-sensing structure consists of three identical 100-µm long and 500-µm wide n-channel MOSFETs connected in a resistive loaded current mirror configuration. The input transistor of the mirror acts as a constant current source MOSFET and the output transistors are the stress sensing MOSFETs embedded near the fixed edge and at the center of a square silicon diaphragm to sense tensile and compressive stresses, respectively, developed under applied pressure. The current mirror circuit was fabricated using standard polysilicon gate complementary metal oxide semiconductor (CMOS) technology on the front side of the silicon wafer and the flexible pressure sensing square silicon diaphragm, with a length of 1,050 µm and width of 88 µm, was formed by bulk micromachining process using tetramethylammonium hydroxide solution on the backside of the wafer. The pressure is monitored by the acquisition of drain voltages of the pressure sensing MOSFETs placed near the fixed edge and at the center of the diaphragm.

The current mirror-integrated pressure sensor was successfully fabricated and tested using in-house developed pressure measurement system. The pressure sensitivity of the tested sensor was found to be approximately 0.3 mV/psi (or 44.6 mV/MPa) for pressure range of 0 to 100 psi. In addition, the pressure sensor was also simulated using Intellisuite MEMS Software and simulated pressure sensitivity of the sensor was found to be approximately 53.6 mV/MPa. The simulated and measured pressure sensitivities of the pressure sensor are in close agreement.

The work reported in this paper validates the use of MOSFETs connected in current mirror configuration for the measurement of tensile and compressive stresses developed in a silicon diaphragm under applied pressure. This current mirror readout circuitry integrated with MEMS pressure-sensing structure is new and fully compatible to standard CMOS processes and has a promising application in the development CMOS-MEMS-integrated smart sensors.

This paper aims to describe the fabrication, packaging and testing of a resistive loaded p-channel metal-oxide-semiconductor field-effect transistor-based (MOSFET-based) current mirror-integrated pressure transducer.

Using the concept of piezoresistive effect in a MOSFET, three identical p-channel MOSFETs connected in current mirror configuration have been designed and fabricated using the standard polysilicon gate process and microelectromechanical system (MEMS) techniques for pressure sensing application. The channel length and width of the p-channel MOSFETs are 100 µm and 500 µm, respectively. The MOSFET M1 of the current mirror is the reference transistor that acts as the constant current source. MOSFETs M2 and M3 are the pressure-sensing transistors embedded on the diaphragm near the mid of fixed edge and at the center of the square diaphragm, respectively, to experience both the tensile and compressive stress developed due to externally applied input pressure. A flexible square diaphragm having a length of approximately 1,000 µm and thickness of 50 µm has been realized using deep-reactive ion etching of silicon on the backside of the wafer. Then, the fabricated sensor chip has been diced and mounted on a TO8 header for the testing with pressure.

The experimental result of the pressure sensor chip shows a sensitivity of approximately 0.2162 mV/psi (31.35 mV/MPa) for an input pressure of 0-100 psi. The output response shows a good linearity and very low-pressure hysteresis. In addition, the pressure-sensing structure has been simulated using the parameters of the fabricated pressure sensor and from the simulation result a pressure sensitivity of approximately 0.2283 mV/psi (33.11 mV/MPa) has been observed for input pressure ranging from 0 to 100 psi with a step size of 10 psi. The simulated and experimentally tested pressure sensitivities of the pressure sensor are in close agreement with each other.

This current mirror readout circuit-based MEMS pressure sensor is new and fully compatible to standard CMOS processes and has a promising application in the development CMOS-MEMS-integrated smart sensors.