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Integrated microsystem for blue/ultraviolet detection

A. Pauchard (Institute of Microsystems, Swiss Federal Institute of Technology Lausanne, BM 3108, CH‐1015 Lausanne EPFL, Switzerland. E‐mail: Alexandre.Pauchard@epfl.ch)
B. Furrer (Institute of Microsystems, Swiss Federal Institute of Technology Lausanne, BM 3108, CH‐1015 Lausanne EPFL, Switzerland. E‐mail: Alexandre.Pauchard@epfl.ch)
Z. Randjelovic (Institute of Microsystems, Swiss Federal Institute of Technology Lausanne, BM 3108, CH‐1015 Lausanne EPFL, Switzerland. E‐mail: Alexandre.Pauchard@epfl.ch)
A. Rochas (Institute of Microsystems, Swiss Federal Institute of Technology Lausanne, BM 3108, CH‐1015 Lausanne EPFL, Switzerland. E‐mail: Alexandre.Pauchard@epfl.ch)
D. Manic (Institute of Microsystems, Swiss Federal Institute of Technology Lausanne, BM 3108, CH‐1015 Lausanne EPFL, Switzerland. E‐mail: Alexandre.Pauchard@epfl.ch)
R.S. Popovic (Institute of Microsystems, Swiss Federal Institute of Technology Lausanne, BM 3108, CH‐1015 Lausanne EPFL, Switzerland. E‐mail: Alexandre.Pauchard@epfl.ch)

Sensor Review

ISSN: 0260-2288

Article publication date: 1 March 2000

337

Abstract

A fully integrated sensor microsystem for blue/ultraviolet radiation detection is presented. The photosensitive part combines a blue/UV selective stripe‐shaped photodiode with a small compensation infrared photodiode. A transimpedance amplifier with 1 GΩ feedback resistor is integrated on the same silicon chip. The main features of the op amp are a low offset (<0.5mV) and fail‐safe operation. This sensor has a maximal responsivity of 150 mV/nW at λ = 420 nm, corresponding to 43 percent quantum efficiency. A ratio of the responsivities at 420 nm and 1 μm as large as 560 is achieved. The system has a noise equivalent power of 5 10‐13 W. The 2.2 mm2 microsystem is realized in a standard CMOS 0.5 μm process.

Keywords

Citation

Pauchard, A., Furrer, B., Randjelovic, Z., Rochas, A., Manic, D. and Popovic, R.S. (2000), "Integrated microsystem for blue/ultraviolet detection", Sensor Review, Vol. 20 No. 1, pp. 31-35. https://doi.org/10.1108/02602280010311374

Publisher

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MCB UP Ltd

Copyright © 2000, MCB UP Limited

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