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The purpose of this paper is to investigate the effects of addition Co nanoparticles on the characteristic properties of Sn‐3.8Ag‐0.7Cu solder.

Cobalt (Co) nanoparticles were added to Sn‐Ag‐Cu solders by thoroughly blending various weight percentages (0‐2.0 wt%) of Co nanoparticles with near eutectic SAC387 solder paste. Blending was done mechanically for 30 min to ensure a homogeneous mixture. The paste mixture was then reflowed on a hot plate at 250°C for 45 s. The melting points of nanocomposite solder were determined by differential scanning calorimetry. Spreading rate of nanocomposite was calculated following the JIS Z3198‐3 standard. The wetting angle was measured after cross‐sectional metallographic preparation.

No significant change in melting point of the solder was observed as a result of Co nanoparticle addition. The wetting angles of the solder increased with the addition of nanoparticles, while the spreading rate decreased. Although the wetting angle increased, the values were still within the acceptable range. Scanning micrograph observations revealed that the as‐solidified microstructure of the composite solder was altered by the addition of Co nanoparticles. Microhardness of the solders slightly increased upon Co nanoparticles addition to SAC387.

The paper demonstrates that a simple process like paste mixing can be used to incorporate nanoparticles into solder.

The aim of the present study was to gather and review all the important properties of the Sn–Ag–Cu (SAC) solder alloy. The SAC solder alloy has been proposed as the alternative solder to overcome the environmental concern of lead (Pb) solder. Many researchers have studied the SAC solder alloy and found that the properties such as melting temperature, wettability, microstructure and interfacial, together with mechanical properties, are better for the SAC solder than the tin – lead (SnPb) solders. Meanwhile, addition of various elements and nanoparticles seems to produce enhancement on the prior bulk solder alloy as well. These benefits suggest that the SAC solder alloy could be the next alternative solder for the electronic packaging industry. Although many studies have been conducted for this particular solder alloy, a compilation of all these properties regarding the SAC solder alloy is still not available for a review to say.

Soldering is identified as the metallurgical joining method in electronic packaging industry which uses filler metal, or well known as the solder, with a melting point < 425°C (Yoon et al., 2009; Ervina and Marini, 2012). The SAC solder has been developed by many methods and even alloying it with some elements to enhance its properties (Law et al., 2006; Tsao et al., 2010; Wang et al., 2002; Gain et al., 2011). The development toward miniaturization, meanwhile, requires much smaller solder joints and fine-pitch interconnections for microelectronic packaging in electronic devices which demand better solder joint reliability of SAC solder Although many studies have been done based on the SAC solder, a review based on the important characteristics and the fundamental factor involving the SAC solder is still not sufficient. Henceforth, this paper resolves in stating all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding.

Various Pb-free solders have been studied and investigated to overcome the health and environmental concern of the SnPb solder. In terms of the melting temperature, the SAC solder seems to possess a high melting temperature of 227°C than the Pb solder SnPb. Here, the melting temperature of this solder falls within the range of the average reflow temperature in the electronic packaging industry and would not really affect the process of connection. A good amendment here is, this melting temperature can actually be reduced by adding some element such as titanium and zinc. The addition of these elements tends to decrease the melting temperature of the SAC solder alloy to about 3°C. Adding nanoparticles, meanwhile, tend to increase the melting temperature slightly; nonetheless, this increment was not seemed to damage other devices due to the very slight increment and no drastic changes in the solidification temperature. Henceforth, this paper reviews all the properties of the Pb-free SAC solder system by how it is developed from overcoming environmental problem to achieving and sustaining as the viable candidate in the electronic packaging industry. The Pb-free SAC solder can be the alternative to all drawbacks that the traditional SnPb solder possesses and also an upcoming new invention for the future needs. Although many studies have been done in this particular solder, not much information is gathered in a review to give better understanding for SAC solder alloy. In that, this paper reviews and gathers the importance of this SAC solder in the electronic packaging industry and provides information for better knowledge.

This paper resolves in stating of all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding.

Recently nanoparticles reinforced lead free solders are vastly developed in electronics packaging industry. Studies and investigations have been conducted to learn and investigate the types, properties, method, availability and importance of nanoparticles in this field.

Mechanical properties, melting temperature and microstructural conditions are taken into major considerations in any of the preparation on nanoparticles and being reviewed in this paper. Segregation of the types of nanoparticles being added together with their properties is summarized in this paper. High temperature reliability is crucial in providing a good viable solder and hence addition of nanoparticles have been seen to give a positive outcome in this particular property.

This paper reviews on the beneficial of the various nanoparticles addition in the solder. Briefed explanations and the factors are revealed in this review.

This paper reviews on the beneficial of the various nanoparticles addition in the solder.

The purpose of this work is to investigate the static performance characteristics of thermohydrodynamic journal bearing operating under nanolubricants (lubricants containing per cent weight concentration of nanoparticles).

Addition of nanoparticles in the lubricant increases lubricant viscosity. To study the effect of this variation on journal bearing, analytical models are developed for the relationship between viscosity, 0-0.5 per cent weight concentration of nanoparticles and temperature range of 300-900°C. To obtain pressure and temperature distribution, modified Reynolds and energy equations are solved by using the finite element method. The viscosity field (varies with temperature and per cent weight concentration of nanoparticles) is updated in these two equations by using the developed analytical model. The steady-state performance characteristics are computed for various values of eccentricity ratios for non-thermoviscous (viscosity of lubricant varies with per cent weight concentration of nanoparticles) and thermoviscous (viscosity of lubricant varies with per cent weight concentration of nanoparticles and temperature) cases. The lubricant and the nanoparticles used for the present work are SAE15W40, copper oxide (CuO), cerium oxide (CeO₂) and aluminum oxide (Al₂O₃).

The pressure and temperature distribution across the lubricant film in the clearance space of journal bearing and static performance characteristics are calculated.

The computed results show that addition of nanoparticles in the lubricant influences the performance characteristics considerable in thermoviscous case than non-thermoviscous case.

The purpose of this paper is to investigate of the effects of Mn nanoparticle addition on the wettability, microstructure and microhardness of SAC0307-xMn(np) (SAC: Sn–Ag–Cu; x = 0, 0.02, 0.05, 0.1 and 0.3 Wt.%) composite solders.

The SAC0307-xMn(np) composite solders were prepared by mechanically mixing different weight percentages of Mn nanopowders into the SAC0307 solder paste with rosin flux. In this study, the wettability of the solders was studied using contact angle and spread ratio methods. Afterward, the microstructure of the solders was investigated using scanning electron microscopy, energy-dispersive X-ray spectroscopy and X-ray diffractometry. Moreover, the microhardness of the solders was studied.

The wetting process of SAC0307-xMn(np) composite solders was found to experience four stages. Adding a small amount of Mn nanoparticles (x = 0.05 Wt.%) could improve the wettability compared to Mn-free solder. Beyond this level, the wettability deteriorated. The addition of Mn nanoparticles significantly refined the size and spacing of Ag₃Sn grains in the solder matrix. When 0.1 Wt.% Mn nanoparticles was added, both the average size of the Ag₃Sn grains and the spacing between the Ag₃Sn grains decreased significantly and approached minimum values. Beyond this amount, the size and spacing between Ag₃Sn grains increased slightly but remained smaller than those in the Mn-free solder matrix. The refined Ag₃Sn grains increased the microhardness of the Mn-containing composite solders by 6-25 per cent, in good agreement with the prediction of the classic theory of dispersion strengthening.

The paper demonstrates that Mn nanoparticle addition could improve the SAC0307-xMn(np) solder wettability and reduce the grain size and spacing between Ag₃Sn grains. The enhancement of the solder microhardness shows good correlation with the microstructure.

The purpose of this paper is to investigate the influence of silver nanoparticle additions on the wetting properties of Sn‐Ag‐Cu (SAC) solder paste. In this investigation, the basic solder paste contained 85 wt.% of commercial Sn 96.5 Ag 3 Cu 0.5 powder (with the particle sizes in the range of 20‐38 μm) and 15 wt.% of self‐prepared middle activated rosin flux. To this paste was added 0.5, 1, 2 and 4 wt.% of self‐prepared silver nano‐powders of different grain sizes (from 9 to 138 nm). After the pastes had stabilized, their wetting properties were tested. The main goal of these investigations was to improve the wetting properties of SAC solder paste and to find correlations between the results of the wetting of solder paste with nanoparticles on the copper substrate with the microstructure of the solder joints.

The following methods were applied for the wetting solder paste investigation: spreading on the copper substrate, contact angle measurement on the copper and wetting on a FR‐4 laminate double sided with an 18‐μm thick copper foil. The investigations were performed at temperatures of 220, 230, 240 and 250°C. Cross‐sectioning was performed on the solder paste after reflow on the copper substrate. For the microstructural analysis of the “nano” modified solder joints obtained at 250°C, standard metallographic procedures were applied. Changes in the microstructure, the thickness of the inter‐metallic compounds (IMCs) and their chemical compositions were observed by means of scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS).

As expected, a higher silver nanoparticle addition to the SAC solder paste resulted in better wetting properties on copper. The results indicated the possibility of an improvement of the reflow soldering process by using SAC solder paste with silver nanoparticles and by lowering its soldering temperature. An improvement was also observed in the wettability with a decrease in the silver nanoparticle grain size. Also, the wettability proceeded at a lower temperature (20°C lower) than that for the SAC paste, without the nano‐additives. For the 4 per cent silver nanoparticle addition, Ag₃Sn star‐like IMCs were also found, which grew with the lowering of the silver nanoparticle grain size.

Further studies are necessary for confirmation of the practical application, especially of the mechanical properties, as well as the reliability properties of the solder joints, for the chosen solder paste with silver nanoparticles.

Taking into account the wetting data, the best results of the “nano” SAC solder pastes were obtained for the highest addition of the silver nanoparticles. It was found that the spreading on copper was higher and the contact angles were lower for the SAC solder paste with 4 per cent (by wt.) of 138‐nm grain size silver nanoparticles. A comparison of SAC solder pastes with a 4 per cent silver nanoparticle addition but of a different grain size (138‐9 nm), suggested a further improvement in wetting properties with lowering of the silver nanoparticle grain size. The results suggested the possibility of an improvement in the reflow soldering process by using SAC solder paste with silver nanoparticles and by lowering its soldering temperature.

Spreading, wetting and contact angle measurement methods were used for the wetting determination of the SAC solder paste with the silver nanoparticles on copper under the same temperature conditions. Also, the microstructure of the solder joints obtained at 250°C was determined with the use of SEM and EDS methods. The results obtained made it possible to draw conclusions regarding the correlation between the output of the wetting results and the amount and the grain size of the added silver nanoparticles, and also the microstructure and thickness of the IMCs of the “nano” solder joints.

The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn‐3.8Ag‐0.7Cu (SAC) solder and Cu substrate during multiple reflow.

The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250°C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma‐optical emission spectroscopy (ICP‐OES). The wetting behavior of the solders was characterized by analyzing the contact angles and spreading rates according to the Japanese Industrial Standard (JIS 23198‐3, 2003). The interfacial microstructure of the solder joints were investigated by field emission scanning electron microscope (FESEM) and energy dispersive X‐ray spectroscopy (EDAX).

It was found that upon the addition of 0.3 wt% Zn nanoparticles to the SAC solder, the growth of interfacial intermetallic compound (IMC) layers was retarded to a minimum value. Excessive amount of Zn nanoparticles (0.8 wt%) induced an additional IMC layer (Cu₅Zn₈) which increased the total IMC thickness and raising the reliability issue.

It is concluded that Zn nanoparticles undergo melting/reaction during reflow and impart their effect on the IMCs through alloying effects.

The purpose of this study was to investigate the effects of CaCO₃ nanoparticles on the mechanical properties, and mixed-mode fracture behavior of acrylonitrile butadiene styrene 3D printed samples with different internal architectures.

The nanocomposite filaments have been fabricated by a melt-blending technique. The standard tensile, compact tension and special fracture test samples, named Arcan specimens, have been printed at constant extrusion parameters and at four different internal patterns. A special fixture was used to carry out the mixed-mode fracture tests of Arcan samples. Finite element analyses using the J-integral method were performed to calculate the fracture toughness of such samples. The fractographic observations were used to evaluate the mechanism of fracture at different concentrations of nanoparticles.

The addition of CaCO₃ nanoparticles has resulted in a significant increase in the fracture loading of the samples, although this increase was not consistent for all the filling patterns, being more significant for samples with linear and triangular structures. According to the fractographic observations, the creation of uniformly distributed microvoids due to the blunting effect of nanoparticles and 3D stress state at the crack tip in the samples with linear and triangular structures justify the enhancement in the fracture loading by the addition of CaCO₃ nanoparticles in the matrix.

There is a significant gap in the knowledge of the effects of different nanoparticles in the polymer samples produced by the fused filament fabrication process. One of such nanoparticles is an inorganic CaCO₃ nanoparticle that has been frequently used as nanofillers to improve the thermomechanical properties of thermoplastic polymers. Here, experimental and numerical studies have been conducted to investigate the effects of such nanoadditives on the mechanical and fracture behavior of 3D printed samples.

This study aims to investigate the numerical analysis of mixed convection within the horizontal annulus in the presence of water-based fluid with nanoparticles of aluminum oxide, copper, silver and titanium oxide. Numerical solution is performed using a finite-volume method based on the SIMPLE algorithm, and the discretization of the equations is generally of the second order. Inner and outer cylinders have a constant temperature, and the inner cylinder temperature is higher than the outer one. The two cylinders can be rotated in both directions at a constant angular velocity. The effect of parameters such as Rayleigh, Richardson, Reynolds and the volume fraction of nanoparticles on heat transfer and flow pattern are investigated. The results show that the heat transfer rate increases with the increase of the Rayleigh number, as well as by increasing the volume fraction of the nanoparticles, the heat transfer rate increases, and this increase is about 8.25 per cent for 5 per cent volumetric fraction. Rotation of the cylinders reduces the overall heat transfer. Different directions of rotation have a great influence on the flow pattern and isotherms, and ultimately on heat transfer. The addition of nanoparticles does not have much effect on the flow pattern and isotherms, but it is quantitatively effective. The extracted results are in good agreement with previous works.

Studying mixed convection heat transfer in the horizontal annulus in the presence of a water-based fluid with aluminum oxide, copper, silver and titanium oxide nanoparticles is carried out quantitatively using a finite-volume method based on the SIMPLE algorithm.

Increasing the Rayleigh number increases the Nusselt number. Increasing the Richardson number increases heat transfer. Adding nanoparticles does not have much effect on the flow pattern but is effective quantitatively on heat transfer parameters. The addition of nanoparticles sometimes increases the heat transfer rate by about 8.25 per cent. In constant Rayleigh numbers, increasing the Reynolds number reduces heat transfer. The Rayleigh and Reynolds numbers greatly affect the isotherms and streamlines. In addition to the thermal conductivity of nanoparticles, the thermo-physical properties of nanoparticles has great effect in the formation of isotherms and streamlines and ultimately heat transfer.

Studying the effect of different direction of rotation on the isotherms and streamlines, as well as the comparison of different nanoparticles on mixed convection heat transfer in annulus.

The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the introduction and development of different grades of lead-free solder alloys in the global market. Tin-silver-copper is a lead-free alloy which has been acknowledged by different consortia as a good alternative to conventional tin-lead alloy. The purpose of this paper is to provide comprehensive knowledge about the tin-silver-copper series.

The approach of this study reviews the microstructure and some other properties of tin-silver-copper series after the addition of indium, titanium, iron, zinc, zirconium, bismuth, nickel, antimony, gallium, aluminium, cerium, lanthanum, yttrium, erbium, praseodymium, neodymium, ytterbium, nanoparticles of nickel, cobalt, silicon carbide, aluminium oxide, zinc oxide, titanium dioxide, cerium oxide, zirconium oxide and titanium diboride, as well as carbon nanotubes, nickel-coated carbon nanotubes, single-walled carbon nanotubes and graphene-nano-sheets.

The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials.

This paper summarises the useful findings of the tin-silver-copper series comprehensively. This information will assist in future work for the design and development of novel lead-free solder alloys.