To read this content please select one of the options below:

Addition of cobalt nanoparticles into Sn‐3.8Ag‐0.7Cu lead‐free solder by paste mixing

S.L. Tay (Department of Mechanical Engineering, University of Malaya, Kuala Lumpur, Malaysia)
A.S.M.A. Haseeb (Department of Mechanical Engineering, University of Malaya, Kuala Lumpur, Malaysia)
Mohd Rafie Johan (Department of Mechanical Engineering, University of Malaya, Kuala Lumpur, Malaysia)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 8 February 2011

678

Abstract

Purpose

The purpose of this paper is to investigate the effects of addition Co nanoparticles on the characteristic properties of Sn‐3.8Ag‐0.7Cu solder.

Design/methodology/approach

Cobalt (Co) nanoparticles were added to Sn‐Ag‐Cu solders by thoroughly blending various weight percentages (0‐2.0 wt%) of Co nanoparticles with near eutectic SAC387 solder paste. Blending was done mechanically for 30 min to ensure a homogeneous mixture. The paste mixture was then reflowed on a hot plate at 250°C for 45 s. The melting points of nanocomposite solder were determined by differential scanning calorimetry. Spreading rate of nanocomposite was calculated following the JIS Z3198‐3 standard. The wetting angle was measured after cross‐sectional metallographic preparation.

Findings

No significant change in melting point of the solder was observed as a result of Co nanoparticle addition. The wetting angles of the solder increased with the addition of nanoparticles, while the spreading rate decreased. Although the wetting angle increased, the values were still within the acceptable range. Scanning micrograph observations revealed that the as‐solidified microstructure of the composite solder was altered by the addition of Co nanoparticles. Microhardness of the solders slightly increased upon Co nanoparticles addition to SAC387.

Originality/value

The paper demonstrates that a simple process like paste mixing can be used to incorporate nanoparticles into solder.

Keywords

Citation

Tay, S.L., Haseeb, A.S.M.A. and Rafie Johan, M. (2011), "Addition of cobalt nanoparticles into Sn‐3.8Ag‐0.7Cu lead‐free solder by paste mixing", Soldering & Surface Mount Technology, Vol. 23 No. 1, pp. 10-14. https://doi.org/10.1108/09540911111099659

Publisher

:

Emerald Group Publishing Limited

Copyright © 2011, Emerald Group Publishing Limited

Related articles