Search results

This study aims to develop a bimodal nano-silver paste with improved mechanical property and reliability. Silicon carbide (SiC) particles coated with Ag were introduced in nano-silver paste to improve bonding strength between SiC and Ag particles and enhance high-temperature stability of bimodal nano-silver paste. The effect of sintering parameters such as sintering temperature, sintering time and the proportion of SiC particles on mechanical property and reliability of sintered bimodal nano-silver structure were investigated.

Sandwich structures consist of dummy chips and copper substrates with nickel and silver coating bonded by nano-silver paste were designed for shear testing. Shear strength testing was conducted to study the influence of SiC particles proportions on the mechanical property of sintered nano-silver joints. The reliability of the bimodal nano-silver paste was evaluated experimentally by means of shear test for samples subjected to thermal aging test at 150°C and humidity and temperature testing at 85°C and 85 per cent RH, respectively.

Shear strength was enhanced obviously with the increase of sintering temperature and sintering time. The maximum shear strength was achieved for nano-silver paste sintered at 260°C for 10 min. There was a negative correlation between the proportion of SiC particles and shear strength. After thermal aging testing and humidity and temperature testing for 240 h, the shear strength decreased a little. High-temperature stability and high-hydrothermal stability were improved by the addition of SiC particles.

Submicron-scale SiC particles coated with Ag were used as alternative materials to replace part of nano-silver particles to prepare bimodal nano-silver paste due to its high thermal conductivity and excellent mechanical property.

The purpose of this paper is to study the variation of the mechanical strength and failure modes of solder balls with reducing diameters under conditions of multiple reflows.

The solder balls with diameters from 250 to 760 µm were mounted on the copper-clad laminate by 1-5 reflows. The strength of the solder balls was tested by the single ball shear test and pull test, respectively. The failure modes of tested samples were identified by combing morphologies of fracture surfaces and force-displacement curves. The stresses were revealed and the failure explanations were assisted by the finite element analysis for the shear test of single solder ball.

The average strength of a smaller solder ball (e.g. 250 µm in diameter) is higher than that of a larger one (e.g. 760 µm in diameter). The strength of smaller solder balls is more highly variable with multiple reflows than larger diameters balls, where the strength increased mostly with the number of reflows. According to load-displacement curves or fracture surface morphologies, the failure modes of solder ball in the shear and pull tests can be categorized into three kinds.

The strength of solder balls will not deteriorate when the diameter of solder ball is decreased with a reflow, but a smaller solder ball has a higher failure risk after multiple reflows. The failure modes for shear and pull tests can be identified quickly by the combination of force-displacement curves and the morphologies of fracture surfaces.

The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints.

To evaluate the shear strength and IMC thickness of the 1206 chip resistor solder joints, the test vehicles were conventionally reflowed for 480 seconds at a peak temperature of 240°C at different isothermal ageing times of 100, 200 and 300 hours. A cross-sectional study was conducted on the reflowed and aged 1206 chip resistor solder joints. The shear strength of the solder joints aged at 100, 200 and 300 hours was measured using a shear tester (Dage-4000PXY bond tester).

It was found that the growth of IMC layer thickness increases as the ageing time increases at a constant temperature of 175°C, which resulted in a reduction of solder joint strength due to its brittle nature. It was also found that the shear strength of the reflowed 1206 chip resistor solder joint was higher than the aged joints. Moreover, it was revealed that the shear strength of the 1206 resistor solder joints aged at 100, 200 and 300 hours was influenced by the ageing reaction times. The results also indicate that an increase in ageing time and temperature does not have much influence on the formation and growth of Kirkendall voids.

A proper correlation between shear strength and fracture mode is required.

The IMC thickness can be used to predict the shear strength of the component/printed circuit board pad solder joint.

The shear strength of the 1206 chip resistor solder joint is a function of ageing time and temperature (°C). Therefore, it is vital to consider the shear strength of the surface-mount chip component in high-temperature electronics.

To review, analyze and present the effects of the contact‐fluid interfacial shear strength and contact‐fluid interfacial slippage and the critical importance of these effects in elastohydrodynamic lubrication (EHL).

The experimental and theoretical research results of the contact‐fluid interfacial shear strength and its caused contact‐fluid interfacial slippage in hydrodynamic lubrication and especially in EHL obtained in the past decades and progressed in recent years by the present author and by others are reviewed. Analysis and presentation are made on both the contact‐fluid interfacial shear strength versus fluid pressure curve for a given bulk fluid temperature in an isothermal EHL and the influence of the bulk fluid temperature on this curve.

It is very clearly and well understood from the present paper that the value of the contact‐fluid interfacial shear strength in the inlet zone in an EHL contact, i.e. at low EHL fluid film pressures is usually low and usually has rather a weak dependence on the EHL fluid film pressure. This proves the correctness of the EHL theories previously developed by the author based on the assumption of this low value and dependence on the EHL fluid film pressure of the contact‐fluid interfacial shear strength. It is also very clearly understood that the bulk fluid temperature usually has a strong influence on the value of the contact‐fluid interfacial shear strength in EHL and the increase of this temperature usually significantly reduces the value of the contact‐fluid interfacial shear strength in EHL.

A very useful material for the engineers who are engaged in the design of EHL on gears, cams and roller bearings, and for the tribology scientists who thrust efforts in studying EHL and mixed EHL both by theoretical modeling and by experiments.

A new and generalized mode of mixed EHL is originally proposed by incorporating the finding of a more realistic mode of the contact regimes in a practical mixed EHL based on the contact‐fluid interfacial shear strength and contact‐fluid interfacial slippage effects. This mode of mixed EHL should become the direction of the theoretical research of mixed EHL in the future.

This study aims to analyze the shear strength and fracture mechanism of full Cu-Sn IMCs joints with different Cu₃Sn proportion and joints with the conventional interfacial structure in electronic packaging.

The Cu-Sn IMCs joints with different Cu₃Sn proportion were fabricated through soldering Cu-6 μm Sn-Cu sandwich structure under the extended soldering time and suitable pressure. The joints of conventional interfacial structure were fabricated through soldering Cu-100 μm Sn-Cu sandwich structure. After the shear test was conducted, the fracture mechanism of different joints was studied through observing the cross-sectional fracture morphology and top-view fracture morphology of sheared joints.

The strength of joints with the conventional interfacial structure was 26.6 MPa, while the strength of full Cu-Sn IMCs joints with 46.7, 60.6, 76.7 and 100 per cent Cu₃Sn was, respectively, 33.5, 39.7, 45.7 and 57.9 MPa. The detailed reason for the strength of joints showing such regularity was proposed. For the joint of conventional interfacial structure, the microvoids accumulation fracture happened within the Sn solder. However, for the full Cu-Sn IMCs joint with 46.7 per cent Cu₃Sn, the cleavage fracture happened within the Cu6Sn5. As the Cu₃Sn proportion increased to 60.6 per cent, the inter-granular fracture, which resulted in the interfacial delamination of Cu₃Sn and Cu6Sn5, occurred along the Cu₃Sn/Cu6Sn5 interface, while the cleavage fracture happened within the Cu6Sn5. Then, with the Cu₃Sn proportion increasing to 76.7 per cent, the cleavage fracture happened within the Cu6Sn5, while the transgranular fracture happened within the Cu₃Sn. The inter-granular fracture, which led to the interfacial delamination of Cu₃Sn and Cu, happened along the Cu/Cu₃Sn interface. For the full Cu₃Sn joint, the cleavage fracture happened within the Cu₃Sn.

The shear strength and fracture mechanism of full Cu-Sn IMCs joints was systematically studied. A direct comparison regarding the shear strength and fracture mechanism between the full Cu-Sn IMCs joints and joints with the conventional interfacial structure was conducted.

Seeks to study the dependence of the shear strength of a fluid on the fluid pressure and the bulk fluid temperature, respectively, theoretically for given bulk fluid temperatures and fluid pressures in the whole ranges of fluid pressure and bulk fluid temperature.

The analyses are, respectively, carried out with emphasis on the dependence of the shear strength of a fluid in liquid state, i.e. at low pressures on the fluid pressure and the bulk fluid temperature for given bulk fluid temperatures and fluid pressures based on the theory of the compression of the fluid by the pressurization of the fluid.

The fluid shear strength versus fluid pressure curve in the whole range of fluid pressure and the fluid shear strength versus bulk fluid temperature curve in the whole range of bulk fluid temperature, respectively, for a given bulk fluid temperature and a given fluid pressure are obtained. It is shown by this fluid shear strength versus fluid pressure curve that, for a given bulk fluid temperature, when the fluid is in liquid state, i.e. at low pressures, the value of the shear strength of the fluid is insensitive to the variation of the pressure of the fluid and is low: when the fluid is in solidification state, i.e. at medium and high but not extremely high pressures, the value of the shear strength of the fluid is the most sensitive to the variation of the pressure of the fluid and is very approximately linearly increased with the increase of the pressure of the fluid; when the fluid is in high solidification state, i.e. at extremely high pressures, the value of the shear strength of the fluid is insensitive to the variation of the pressure of the fluid and is the highest, i.e. approaches the value of the shear strength of the fluid in solid state.

Extends one's knowledge of the shear strength of a fluid in the while ranges of pressure and temperature.

This paper aims to present the methodology and results of the experimental characterization of three-dimensional (3D) printed acrylonitrile butadiene styrene (ABS) and polycarbonate (PC) parts utilizing digital image correlation (DIC).

Tensile and shear characterizations of ABS and PC 3D-printed parts were performed to determine the extent of anisotropy present in 3D-printed materials. Specimens were printed with varying raster ([+45/−45], [+30/−60], [+15/−75] and [0/90]) and build orientations (flat, on-edge and up-right) to determine the directional properties of the materials. Tensile and Iosipescu shear specimens were printed and loaded in a universal testing machine utilizing two-dimensional (2D) DIC to measure strain. The Poisson’s ratio, Young’s modulus, offset yield strength, tensile strength at yield, elongation at break, tensile stress at break and strain energy density were gathered for each tensile orientation combination. Shear modulus, offset yield strength and shear strength at yield values were collected for each shear combination.

Results indicated that raster and build orientations had negligible effects on the Young’s modulus or Poisson’s ratio in ABS tensile specimens. Shear modulus and shear offset yield strength varied by up to 33 per cent in ABS specimens, signifying that tensile properties are not indicative of shear properties. Raster orientation in the flat build samples reveals anisotropic behavior in PC specimens as the moduli and strengths varied by up to 20 per cent. Similar variations were observed in shear for PC. Changing the build orientation of PC specimens appeared to reveal a similar magnitude of variation in material properties.

This article tests tensile and shear specimens utilizing DIC, which has not been employed previously with 3D-printed specimens. The extensive shear testing conducted in this paper has not been previously attempted, and the results indicate the need for shear testing to understand the 3D-printed material behavior fully.

The impact strength of solder joint under high strain rate was evaluated by board level test method. However, the impact shear test of single solder bump was more convenient and economical than the board level test method. With the miniaturization of solder joints, solder joints were more prone to failure under thermal shock and more attention has been paid to the impact reliability of solder joint. But Pb-free solder joints may be paid too much attention and Sn-Pb solder joints may be ignored.

In this study, thermal shock test between −55°C and 125°C was conducted on Sn-37Pb solder bumps in the BGA package to investigate microstructural evolution and growth mechanism of interfacial intermetallic compounds (IMCs) layer. The effects of thermal shock and ball diameter on the mechanical property and fracture behavior of Sn-37Pb solder bumps were discussed.

With the increase of ball size, the same change tendency of shear strength with thermal shock cycles. The shear strength of the solder bumps was the highest after reflow; with the increase of the number of thermal shocks, the shear strength of the solder bumps was decreased. But at the time of 2,000 cycles, the shear strength was increased to the initial strength. Minimum shear strength almost took place at 1,500 cycles in all solder bumps. The differences between maximum shear strength and minimum shear strength were 9.11 MPa and 16.83 MPa, 17.07 MPa and 15.59 MPa in φ0.3 mm and φ0.4 mm, φ0.5 mm and φ0.6 mm, respectively, differences were increased with increasing of ball size. With similar reflow profile, the thickness of IMC decreased as the diameter of the ball increased. The thickness of IMC was 2.42 µm and 2.17 µm, 1.63 µm and 1.77 µm with increasing of the ball size, respectively.

Pb-free solder was gradually used to replace traditional Sn-Pb solder and has been widely used in industry. Nevertheless, some products inevitably used a mixture of Sn-Pb and Pb-free solder to make the transition from Sn-Pb to Pb-free solder. Therefore, it was very important to understand the reliability of Sn-Pb solder joint and more further research works were also needed.

This paper introduces a simple computational model for the analysis on the solder ball shear testing conditions. Both two‐dimensional (2‐D) and three‐dimensional (3‐D) finite element models are used to investigate the effect of shear ram speed on the solder ball shear strength of plastic ball grid array (PBGA) packages. An effective thickness is identified for the 2‐D finite element analysis. By using this effective thickness as a scale factor, it is shown that the 2D model is feasible for the study of 3‐D problems. The computational model is validated by experimental data in terms of load‐displacement curves. The results from both testing and modeling indicate that the shear ram speed has a substantial effect on the solder ball shear strength. In general, faster ram speed can result in higher ball shear strength. Therefore, the characterization of solder ball shear strength is loading rate‐dependent.

This research is part of a project that aims to investigate using foamed concrete structurally in houses. Foamed concrete has a porous structure that makes it light in weight, good in thermal insulation, good in sound insulation and workable.

An experimental program is conducted in this research to investigate the behavior of polypropylene fiber reinforced foam concrete beams laterally reinforced with/without glass fiber grid.

The results proved the effectiveness and efficiency of using glass fiber grid as lateral reinforcements on the shear strength of reinforced foam concrete ribs, in reducing the cracks width and increasing its shear capacity, contrary to using glass fiber grid of reinforced foam concrete beams since glass fiber grid did not play good role in beams.

Limited literature is available regarding the structural use of foam concrete. However, work has been done in many countries concerning its use as insulation material, while limited work was done on structural type of foam concrete.