Search results

Based on the mechanical model of typical shear tests, this study aims to propose the test principle and method of freshwater/seawater ice adhesion shear strength of carbon ceramic brake pads for amphibious aircraft, designs and builds the test equipment, prepares the freshwater/seawater ice samples and completes the tests.

This study examines the influence of the icing process, mechanism, temperature and freshwater/seawater on ice adhesion shear strength of carbon ceramic brake pads and puts forward a test method for the freshwater/seawater ice adhesion shear strength of amphibious aircraft brake pads.

The obtained results examine the influence of the icing process, mechanism, temperature and freshwater/seawater on ice adhesion shear strength of carbon ceramic brake pads. The adhesion shear strength of frozen freshwater and of the seawater of Dalian, Qingdao, Fuzhou and Zhuhai on the surface of aircraft brake pads is measured at –10 to –50°C. It is found that the shear strength of freshwater increases first and then decreases with the decrease of temperature. The adhesion shear strength of seawater; however, increases mainly linear with the decrease of temperature.

The value of this paper is that the test method proposed and test results for the freshwater/seawater ice adhesion shear strength of amphibious aircraft brake pads provide technical support for the anti-icing design of amphibious aircraft brake devices.

The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints.

To evaluate the shear strength and IMC thickness of the 1206 chip resistor solder joints, the test vehicles were conventionally reflowed for 480 seconds at a peak temperature of 240°C at different isothermal ageing times of 100, 200 and 300 hours. A cross-sectional study was conducted on the reflowed and aged 1206 chip resistor solder joints. The shear strength of the solder joints aged at 100, 200 and 300 hours was measured using a shear tester (Dage-4000PXY bond tester).

It was found that the growth of IMC layer thickness increases as the ageing time increases at a constant temperature of 175°C, which resulted in a reduction of solder joint strength due to its brittle nature. It was also found that the shear strength of the reflowed 1206 chip resistor solder joint was higher than the aged joints. Moreover, it was revealed that the shear strength of the 1206 resistor solder joints aged at 100, 200 and 300 hours was influenced by the ageing reaction times. The results also indicate that an increase in ageing time and temperature does not have much influence on the formation and growth of Kirkendall voids.

A proper correlation between shear strength and fracture mode is required.

The IMC thickness can be used to predict the shear strength of the component/printed circuit board pad solder joint.

The shear strength of the 1206 chip resistor solder joint is a function of ageing time and temperature (°C). Therefore, it is vital to consider the shear strength of the surface-mount chip component in high-temperature electronics.

To review, analyze and present the effects of the contact‐fluid interfacial shear strength and contact‐fluid interfacial slippage and the critical importance of these effects in elastohydrodynamic lubrication (EHL).

The experimental and theoretical research results of the contact‐fluid interfacial shear strength and its caused contact‐fluid interfacial slippage in hydrodynamic lubrication and especially in EHL obtained in the past decades and progressed in recent years by the present author and by others are reviewed. Analysis and presentation are made on both the contact‐fluid interfacial shear strength versus fluid pressure curve for a given bulk fluid temperature in an isothermal EHL and the influence of the bulk fluid temperature on this curve.

It is very clearly and well understood from the present paper that the value of the contact‐fluid interfacial shear strength in the inlet zone in an EHL contact, i.e. at low EHL fluid film pressures is usually low and usually has rather a weak dependence on the EHL fluid film pressure. This proves the correctness of the EHL theories previously developed by the author based on the assumption of this low value and dependence on the EHL fluid film pressure of the contact‐fluid interfacial shear strength. It is also very clearly understood that the bulk fluid temperature usually has a strong influence on the value of the contact‐fluid interfacial shear strength in EHL and the increase of this temperature usually significantly reduces the value of the contact‐fluid interfacial shear strength in EHL.

A very useful material for the engineers who are engaged in the design of EHL on gears, cams and roller bearings, and for the tribology scientists who thrust efforts in studying EHL and mixed EHL both by theoretical modeling and by experiments.

A new and generalized mode of mixed EHL is originally proposed by incorporating the finding of a more realistic mode of the contact regimes in a practical mixed EHL based on the contact‐fluid interfacial shear strength and contact‐fluid interfacial slippage effects. This mode of mixed EHL should become the direction of the theoretical research of mixed EHL in the future.

This study aims to analyze the shear strength and fracture mechanism of full Cu-Sn IMCs joints with different Cu₃Sn proportion and joints with the conventional interfacial structure in electronic packaging.

The Cu-Sn IMCs joints with different Cu₃Sn proportion were fabricated through soldering Cu-6 μm Sn-Cu sandwich structure under the extended soldering time and suitable pressure. The joints of conventional interfacial structure were fabricated through soldering Cu-100 μm Sn-Cu sandwich structure. After the shear test was conducted, the fracture mechanism of different joints was studied through observing the cross-sectional fracture morphology and top-view fracture morphology of sheared joints.

The strength of joints with the conventional interfacial structure was 26.6 MPa, while the strength of full Cu-Sn IMCs joints with 46.7, 60.6, 76.7 and 100 per cent Cu₃Sn was, respectively, 33.5, 39.7, 45.7 and 57.9 MPa. The detailed reason for the strength of joints showing such regularity was proposed. For the joint of conventional interfacial structure, the microvoids accumulation fracture happened within the Sn solder. However, for the full Cu-Sn IMCs joint with 46.7 per cent Cu₃Sn, the cleavage fracture happened within the Cu6Sn5. As the Cu₃Sn proportion increased to 60.6 per cent, the inter-granular fracture, which resulted in the interfacial delamination of Cu₃Sn and Cu6Sn5, occurred along the Cu₃Sn/Cu6Sn5 interface, while the cleavage fracture happened within the Cu6Sn5. Then, with the Cu₃Sn proportion increasing to 76.7 per cent, the cleavage fracture happened within the Cu6Sn5, while the transgranular fracture happened within the Cu₃Sn. The inter-granular fracture, which led to the interfacial delamination of Cu₃Sn and Cu, happened along the Cu/Cu₃Sn interface. For the full Cu₃Sn joint, the cleavage fracture happened within the Cu₃Sn.

The shear strength and fracture mechanism of full Cu-Sn IMCs joints was systematically studied. A direct comparison regarding the shear strength and fracture mechanism between the full Cu-Sn IMCs joints and joints with the conventional interfacial structure was conducted.

This study aims to develop a bimodal nano-silver paste with improved mechanical property and reliability. Silicon carbide (SiC) particles coated with Ag were introduced in nano-silver paste to improve bonding strength between SiC and Ag particles and enhance high-temperature stability of bimodal nano-silver paste. The effect of sintering parameters such as sintering temperature, sintering time and the proportion of SiC particles on mechanical property and reliability of sintered bimodal nano-silver structure were investigated.

Sandwich structures consist of dummy chips and copper substrates with nickel and silver coating bonded by nano-silver paste were designed for shear testing. Shear strength testing was conducted to study the influence of SiC particles proportions on the mechanical property of sintered nano-silver joints. The reliability of the bimodal nano-silver paste was evaluated experimentally by means of shear test for samples subjected to thermal aging test at 150°C and humidity and temperature testing at 85°C and 85 per cent RH, respectively.

Shear strength was enhanced obviously with the increase of sintering temperature and sintering time. The maximum shear strength was achieved for nano-silver paste sintered at 260°C for 10 min. There was a negative correlation between the proportion of SiC particles and shear strength. After thermal aging testing and humidity and temperature testing for 240 h, the shear strength decreased a little. High-temperature stability and high-hydrothermal stability were improved by the addition of SiC particles.

Submicron-scale SiC particles coated with Ag were used as alternative materials to replace part of nano-silver particles to prepare bimodal nano-silver paste due to its high thermal conductivity and excellent mechanical property.

The purpose of this paper is to study the variation of the mechanical strength and failure modes of solder balls with reducing diameters under conditions of multiple reflows.

The solder balls with diameters from 250 to 760 µm were mounted on the copper-clad laminate by 1-5 reflows. The strength of the solder balls was tested by the single ball shear test and pull test, respectively. The failure modes of tested samples were identified by combing morphologies of fracture surfaces and force-displacement curves. The stresses were revealed and the failure explanations were assisted by the finite element analysis for the shear test of single solder ball.

The average strength of a smaller solder ball (e.g. 250 µm in diameter) is higher than that of a larger one (e.g. 760 µm in diameter). The strength of smaller solder balls is more highly variable with multiple reflows than larger diameters balls, where the strength increased mostly with the number of reflows. According to load-displacement curves or fracture surface morphologies, the failure modes of solder ball in the shear and pull tests can be categorized into three kinds.

The strength of solder balls will not deteriorate when the diameter of solder ball is decreased with a reflow, but a smaller solder ball has a higher failure risk after multiple reflows. The failure modes for shear and pull tests can be identified quickly by the combination of force-displacement curves and the morphologies of fracture surfaces.

The purpose of this study is to clarify both tensile and shear strength for self-drilling screws, which are manufactured from high-strength, martensitic-stainless and austenitic stainless-steel bars, and the load-bearing capacity of single overlapped screwed connections using steel sheets and self-drilling screws at elevated temperatures.

Tensile/shear loading tests for the self-drilling screw were conducted to obtain basic information on the tensile and shear strengths at elevated temperatures and examine the relationships between both. Shear loading tests for the screwed connections at elevated temperatures were conducted to examine the shear strength and transition of failure modes depending on the test temperature.

The tensile and shear strengths as well as the reduction factors at the elevated temperature for each steel grade of the self-drilling screw were quantified. Furthermore, either screw shear or sheet bearing failure mode depending on the test temperature was observed for the screwed connection.

The transition of the failure modes for the screwed connection could be explained using the calculation formulae for the shear strengths at elevated temperatures, which were proposed in this study.

Material properties, such as shear and compressive strength of masonry, have a crucial impact on the seismic analysis results of masonry structures. Considering that most of the historical buildings are masonry structures, the damage caused by obtaining shear strengths with known methods exceeds acceptable limits. Instead of traditional shear strength index tests, this paper presents a test technique that has been developed which causes less damage to the structure, to obtain mechanical properties in masonry structures.

A new approach to shear testing and a test probe has been developed to minimize the destructive effects of mechanical in situ testing on masonry structures. The comparison of the results obtained with reduced destruction level using the novel shear strength index test probe with those obtained from the traditional method is addressed. Masonry specimens were tested in the laboratory and in situ tests were carried out on 12 historical buildings.

Test results obtained from the proposed probe shear strength index test were consistent with the results obtained from the conventional shear strength test both at the laboratory setting and in situ. Although a large number of data is needed for the validation of a method, satisfactory agreement with the conventional shear strength index test method was obtained.

The authors believe that the proposed method would give the opportunity to collect more mechanical strength data with much less destruction. The experimental work in the laboratory and in situ tests and their comparisons are the supportive and original values of this research.

Seeks to study the dependence of the shear strength of a fluid on the fluid pressure and the bulk fluid temperature, respectively, theoretically for given bulk fluid temperatures and fluid pressures in the whole ranges of fluid pressure and bulk fluid temperature.

The analyses are, respectively, carried out with emphasis on the dependence of the shear strength of a fluid in liquid state, i.e. at low pressures on the fluid pressure and the bulk fluid temperature for given bulk fluid temperatures and fluid pressures based on the theory of the compression of the fluid by the pressurization of the fluid.

The fluid shear strength versus fluid pressure curve in the whole range of fluid pressure and the fluid shear strength versus bulk fluid temperature curve in the whole range of bulk fluid temperature, respectively, for a given bulk fluid temperature and a given fluid pressure are obtained. It is shown by this fluid shear strength versus fluid pressure curve that, for a given bulk fluid temperature, when the fluid is in liquid state, i.e. at low pressures, the value of the shear strength of the fluid is insensitive to the variation of the pressure of the fluid and is low: when the fluid is in solidification state, i.e. at medium and high but not extremely high pressures, the value of the shear strength of the fluid is the most sensitive to the variation of the pressure of the fluid and is very approximately linearly increased with the increase of the pressure of the fluid; when the fluid is in high solidification state, i.e. at extremely high pressures, the value of the shear strength of the fluid is insensitive to the variation of the pressure of the fluid and is the highest, i.e. approaches the value of the shear strength of the fluid in solid state.

Extends one's knowledge of the shear strength of a fluid in the while ranges of pressure and temperature.

This paper aims to present the methodology and results of the experimental characterization of three-dimensional (3D) printed acrylonitrile butadiene styrene (ABS) and polycarbonate (PC) parts utilizing digital image correlation (DIC).

Tensile and shear characterizations of ABS and PC 3D-printed parts were performed to determine the extent of anisotropy present in 3D-printed materials. Specimens were printed with varying raster ([+45/−45], [+30/−60], [+15/−75] and [0/90]) and build orientations (flat, on-edge and up-right) to determine the directional properties of the materials. Tensile and Iosipescu shear specimens were printed and loaded in a universal testing machine utilizing two-dimensional (2D) DIC to measure strain. The Poisson’s ratio, Young’s modulus, offset yield strength, tensile strength at yield, elongation at break, tensile stress at break and strain energy density were gathered for each tensile orientation combination. Shear modulus, offset yield strength and shear strength at yield values were collected for each shear combination.

Results indicated that raster and build orientations had negligible effects on the Young’s modulus or Poisson’s ratio in ABS tensile specimens. Shear modulus and shear offset yield strength varied by up to 33 per cent in ABS specimens, signifying that tensile properties are not indicative of shear properties. Raster orientation in the flat build samples reveals anisotropic behavior in PC specimens as the moduli and strengths varied by up to 20 per cent. Similar variations were observed in shear for PC. Changing the build orientation of PC specimens appeared to reveal a similar magnitude of variation in material properties.

This article tests tensile and shear specimens utilizing DIC, which has not been employed previously with 3D-printed specimens. The extensive shear testing conducted in this paper has not been previously attempted, and the results indicate the need for shear testing to understand the 3D-printed material behavior fully.