A review: influence of nano particles reinforced on solder alloy
Abstract
Purpose
Recently nanoparticles reinforced lead free solders are vastly developed in electronics packaging industry. Studies and investigations have been conducted to learn and investigate the types, properties, method, availability and importance of nanoparticles in this field.
Design/methodology/approach
Mechanical properties, melting temperature and microstructural conditions are taken into major considerations in any of the preparation on nanoparticles and being reviewed in this paper. Segregation of the types of nanoparticles being added together with their properties is summarized in this paper. High temperature reliability is crucial in providing a good viable solder and hence addition of nanoparticles have been seen to give a positive outcome in this particular property.
Findings
This paper reviews on the beneficial of the various nanoparticles addition in the solder. Briefed explanations and the factors are revealed in this review.
Originality/value
This paper reviews on the beneficial of the various nanoparticles addition in the solder.
Keywords
Citation
Efzan Mhd Noor, E., Singh, A. and Tze Chuan, Y. (2013), "A review: influence of nano particles reinforced on solder alloy", Soldering & Surface Mount Technology, Vol. 25 No. 4, pp. 229-241. https://doi.org/10.1108/SSMT-11-2012-0026
Publisher
:Emerald Group Publishing Limited
Copyright © 2013, Emerald Group Publishing Limited