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The purpose of this paper is to study the effect of temperature on Zn–Ni alloys in ChCl–Urea.

Based on cyclic voltammetry experiments, the deposition behavior and kinetics of the Zn–Ni alloy are studied. The nucleation process of the Zn–Ni alloy is studied in detail via chronoamperometry experiments. The effects of the deposition temperature on the microstructure, Ni content and phase composition of Zn–Ni alloy coatings are investigated via scanning electron microscopy and X-ray diffraction (XRD) combined with classical thermodynamics.

The results show that with increasing temperature, the reduction peak shifts toward a more positive electric potential, which is beneficial for the co-electric deposition process, and the diffusion coefficient is estimated. With increasing temperature, the nucleation process of the Zn–Ni alloy becomes a three-dimensional instantaneous nucleation, the typical kinetic parameters are determined using the standard 3D growth proliferation control model and the Gibbs free energy is estimated. The Zn–Ni alloy coatings are prepared via normal co-deposition. With increasing temperature, the degree of crystallinity increases, the coating gradually becomes uniform and compact and the XRD peak intensity increases.

The nucleation process of the Zn–Ni alloy at different temperatures is analyzed. The diffusion coefficient D and Gibbs free energy are calculated. The contribution of the three processes at different temperatures is analyzed. The effect of temperature on the morphology of the Zn–Ni alloy coatings is studied.

Fluorinated silicon polymers are expected to be adopted in specific coatings to afford outstanding advantages, such as high chemical and photochemical resistance, low surface tension and low refractive index. The modified acrylate resin is prepared via solution polymerization of fluorine and silicon monomers, acrylate monomers and other functional monomers. The purpose of this paper is that the fluorine and silicon monomers such as vinyltriethoxysilane (VTES) and hexafluorobutyl methacrylate (HFMA) and some cheap monomers such as styrene are used to prepare the cationic acrylic resin.

The fluorine and silicon modified cationic acrylic resin is prepared via solution polymerization technology, which uses butyl acrylate (BA), methyl methacrylate (MMA), styrene (St), HFMA, VTES, dimethylaminoethyl methacrylate (DMAEMA) and hydroxypropyl methacrylate (HPMA) as the co-polymerized monomers, propylene glycol monomethyl ether (PGME) as solvent and 2,2-Azo-bis-iso-butyronitrile (AIBN) as the initiator to create a resin to introduce the Si–O and C–F into the polymer chains. The cathodic electrodeposition (CED) coatings were prepared by mixing the synthetic resin and blocked isocyanate.

The influence of the amounts of HFMA and VETS on the resin and the resultant CED coatings is investigated in detail. The optimum amounts of HFMA and VETS are obtained, which is 7–8% and 4–5%, respectively. The hydrophobicity and the acid and alkaline resistance of the film are improved when VETS and HFMA are introduced to co-polymerize with other monomers.

The fluorine and silicon monomers such as VTES and HFMA and some cheap monomers such as styrene, which are used to prepare the cationic acrylic resin, are seldom reported in the open literature.

The main aim of this study was to improve current efficiency and to obtain thicker coatings via aluminum oxide (Al₂O₃) addition to the chromium (Cr) (III) bath.

Pure Cr and nanocomposite Cr–Al₂O₃ coatings were electrodeposited from Cr (III) bath onto cathode copper substrates by conventional method. Dependence of current efficiency to current density, Al₂O₃ content and particle size were investigated.

Current efficiency increased with Al₂O₃ amount and decreased with Al₂O₃ particle size. Maximum current efficiency was achieved at 25 A/dm₂ for pure Cr and 30 A/dm₂ for composite coatings. Al₂O₃ bath content, current density and stirring rate increased the coating Al₂O₃ weight per cent significantly. Addition of Al3+ bath composition inhibited nanoparticle agglomeration, increasing film homogeneity. Cr–Al₂O₃ nanocomposites showed higher microhardness and better corrosion resistance than pure Cr layer.

Cr (III) is not as toxic and as carcinogenic as Cr (VI) which is widely used for Cr electroplating these days. Low current efficiency and poor product quality are, however, major drawbacks of the former. This paper describes significant improvements obtainable by addition of Al₂O₃ nanoparticles to the Cr (III) bath for increasing the microhardness, the corrosion resistance and the current efficiency of the deposition.

The commercial success of electro‐deposition of aqueous coating is mainly concerned with the development of water‐soluble film forming polymers. The field of these water‐soluble polymer systems for surface coating application is growing rapidly and expanding vigorously and they are destined to play a leading role in the near future. This may be mainly attributed to regulations on emissions, environment and ecology. In doing so, the electrodeposition technique offers a remarkable assistance to these systems at comparatively low cost, low energy requirement and high utilization efficiency. Research workers have done work on water‐soluble alkyds, epoxies and acrylics.

The paper aims to show application of the electrochemically deposited coatings for thickening of the screen printed electric paths potentially applied in photovoltaic cells.

The electric paths were screen printed with the use of silver-based paste. The paths were thickened by electrodeposition of thin copper layer in potentiostatic regime from surfactant-free plating bath. The morphology and surface quality of the paths were studied by imaging with scanning electron microscopy.

The electric paths can be thickened successfully, but quality for the screen printed substrate determines quality of deposited layer. The EDX analysis confirmed that the deposited copper layer covered uniformly the printed paths.

The adhesion of the copper-covered path to the silicon wafer surface depends on adhesion of the original screen printed path.

This paper confirms that electrodeposited copper can be applied for screen printed silver paths thickening in a controllable way.

With the nickel foam made by the technique of electrodeposition on polymer foam, the purpose of this paper is to investigate the influence of several deferent processes on the surface morphology and the specific surface area of this porous product.

The surface morphologies of the nickel foam were examined by SEM. The specific surface area of the porous product was measured by gas (N₂) permeability method and also calculated by the reported formula.

The nickel foam from sintering in NH₃ decomposition atmosphere at 850°C will achieve the same specific surface area as that at 980°C, whether this porous structure after electrodeposition comes through direct sintering in NH₃ decomposition atmosphere, or through burning in air at 600°C for 4 min beforehand then the same reductive sintering.

There have been some studies on the preparation and application of nickel foam, but few works focus on the processing influence on the specific surface of this porous product. The present work provides the investigations on the difference of the product made under different producing conditions, and the influence of several deferent processes on the specific surface area of the product.

The purpose of this paper is to investigate the electrodeposition of copper coatings directly onto AZ31 magnesium alloy, considered as a substrate of electroplating nickel. The additive, pH, complexing agent, current density, time, and temperature of electrolytic bath were studied to understand electrodepositing copper coating on AZ31 magnesium alloy.

Electrodeposition of copper was carried out in an aqueous solution containing copper hydroxide, citrate, and fluorine ion, which avoids the replacement or corrosion of the magnesium alloy. The morphology, structure, and interface of the electrodeposited copper coating were investigated by a scanning electron microscope (SEM).

The copper coating was dense, and there was good adhesion of the copper coating on the AZ31 magnesium alloy. This suggests that successful deposition of copper using an electroplating process could decrease the cost of coating AZ31 magnesium alloy.

This paper will be helpful for the development of coating on magnesium alloy using electroplating processes.

Copper hydroxide and citrate were the main compositions of the electrolyte, combined with sodium poly dipropyl (SP) and polyethylene glycol (PEG) as brightening agents and can be used to electrodeposit copper directly onto AZ31 magnesium alloy.

This work concerns the electrodeposition of highly pure brushite (CaHPO₄·2H₂O) on titanium alloy substrates and the transformation of the brushite to hydroxyapatite (HAp) Ca₁₀(PO₄)₆(OH)₂ as a coating for orthopaedic implants. Thus, the electrodeposition of electrolyte containing calcium nitrate and ammonium hydrogen phosphate was carried out. The influences of the substrate surface treatment, the electroplating conditions (bath composition, current density, pH value and temperature) and the hydrothermal post treatment conditions on the deposition rate, the throwing power, the adhesion, the morphology and the structure of the coating were evaluated. High adhesion bond strength (around 23 mPa) was achieved on a rough clean substrate, which is slightly higher than plasma sprayed HAp coating on titanium alloy.

The improvement of the hydrogen evolution reaction (HER) performance requires more efficient and inexpensive electrocatalysts. The purpose of this study is to prepare Ni-W and Ni-W-P thin films using the electrodeposition technique using a pulse current and investigate their behaviors toward HER in an acidic solution.

The aim is to prepare Ni-W and Ni-W-P films by the electrodeposition technique using a pulse current and estimate their performance for the HER. The surface morphologies and chemical compositions of the deposited films were assessed using scanning electron microscopy, energy-dispersive X-ray analysis and X-ray diffraction. Linear sweep voltammetry, chronoamperometry, Tafel plots and electrochemical impedance spectroscopy were used to evaluate the prepared electrodes toward the hydrogen evolution process.

The main conclusion is that the surface morphology of Ni–W deposited film is a crystalline structure, while that of Ni-W-P deposit is an amorphous structure. HER activity on Ni-W electrodes increases with decreasing the Wt.% of W to 7.83 Wt.% in the prepared electrodes. In addition, the presence of P enhances HER activity, which increases with increasing the Wt.% of P in the prepared Ni-W-P electrodes. Both Ni-W (7.83 Wt.% W) and Ni-W-P (20.34 Wt.% P), which have been prepared at 8 A dm⁻² display the best performance toward HER compared to the other prepared electrodes. They exhibit high catalytic activities toward HER, which is evidenced by high hydrogen evolution current density values of 9.52 and 33.98 mA cm⁻², low onset potentials of −0.73 and −0.63 V, low Tafel slopes of −125 mV/dec, high exchange current densities of 0.058 and 0.20 mA cm⁻², low charge transfer resistances (Rct) of 226.28 and 75.8 ohm·cm² for Ni-W (7.83  Wt.% W) and Ni-W-P (20.34  Wt.% P), respectively; moreover, they exhibited considerable stabilities too.

The results presented in this work are an insight into understanding the performance of the prepared Cu electrodes coated by Ni-W and Ni-W-P films toward HER. In this work, a consistent assessment of the results achieved on laboratory scale has been conducted.

The purpose of this paper was prepared a Ni-based superhydrophobic coating on the surface of copper to enhence its corrosion resistance. The superhydrophobic coating (SHPC) has proven to be an effective surface treatment in corrosion protection. In this paper, a Ni-based SHPC was prepared on the surface of copper (Cu) to enhance its corrosion resistance.

The coating was prepared through a two-step electrodeposition process. The first step involves the formation of a micro-nano structure Ni layer formed by an electrodeposition process. Subsequently, the polysiloxane layer was deposited on the Ni surface to create an SHPC. The morphology, composition, structure, wettability and corrosion resistance of the coating were characterized and discussed.

The results show that the water contact angle of the as-prepared coating reaches 155.5°±1.0°. The corrosion current density (i_corr = 3.90 × 10⁻⁹ A·cm⁻²) decreased by three orders of magnitude compared to the substrate, whereas |Z|_{f = 0.01 Hz} (2.40 × 10⁶ Ω·cm²) increased by three orders of magnitude. It indicated that the prepared coating has excellent superhydrophobicity and high corrosion resistance, which can provide better protection for the substrate.

The prepared coating provides long-lasting protection for Cu and other metals and offers valuable data for developing SHPCs.