The purpose of this paper is to investigate the electrodeposition of copper coatings directly onto AZ31 magnesium alloy, considered as a substrate of electroplating nickel. The additive, pH, complexing agent, current density, time, and temperature of electrolytic bath were studied to understand electrodepositing copper coating on AZ31 magnesium alloy.
Electrodeposition of copper was carried out in an aqueous solution containing copper hydroxide, citrate, and fluorine ion, which avoids the replacement or corrosion of the magnesium alloy. The morphology, structure, and interface of the electrodeposited copper coating were investigated by a scanning electron microscope (SEM).
The copper coating was dense, and there was good adhesion of the copper coating on the AZ31 magnesium alloy. This suggests that successful deposition of copper using an electroplating process could decrease the cost of coating AZ31 magnesium alloy.
This paper will be helpful for the development of coating on magnesium alloy using electroplating processes.
Copper hydroxide and citrate were the main compositions of the electrolyte, combined with sodium poly dipropyl (SP) and polyethylene glycol (PEG) as brightening agents and can be used to electrodeposit copper directly onto AZ31 magnesium alloy.
Zhu, P., You Wang, L., Ren Qian, G., Hua Cao, T. and Zhou, M. (2013), "Copper coating electrodeposited directly onto AZ31 magnesium alloy", Anti-Corrosion Methods and Materials, Vol. 60 No. 3, pp. 127-133. https://doi.org/10.1108/00035591311315247Download as .RIS
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