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The improvement of the hydrogen evolution reaction (HER) performance requires more efficient and inexpensive electrocatalysts. The purpose of this study is to prepare Ni-W and Ni-W-P thin films using the electrodeposition technique using a pulse current and investigate their behaviors toward HER in an acidic solution.

The aim is to prepare Ni-W and Ni-W-P films by the electrodeposition technique using a pulse current and estimate their performance for the HER. The surface morphologies and chemical compositions of the deposited films were assessed using scanning electron microscopy, energy-dispersive X-ray analysis and X-ray diffraction. Linear sweep voltammetry, chronoamperometry, Tafel plots and electrochemical impedance spectroscopy were used to evaluate the prepared electrodes toward the hydrogen evolution process.

The main conclusion is that the surface morphology of Ni–W deposited film is a crystalline structure, while that of Ni-W-P deposit is an amorphous structure. HER activity on Ni-W electrodes increases with decreasing the Wt.% of W to 7.83 Wt.% in the prepared electrodes. In addition, the presence of P enhances HER activity, which increases with increasing the Wt.% of P in the prepared Ni-W-P electrodes. Both Ni-W (7.83 Wt.% W) and Ni-W-P (20.34 Wt.% P), which have been prepared at 8 A dm⁻² display the best performance toward HER compared to the other prepared electrodes. They exhibit high catalytic activities toward HER, which is evidenced by high hydrogen evolution current density values of 9.52 and 33.98 mA cm⁻², low onset potentials of −0.73 and −0.63 V, low Tafel slopes of −125 mV/dec, high exchange current densities of 0.058 and 0.20 mA cm⁻², low charge transfer resistances (Rct) of 226.28 and 75.8 ohm·cm² for Ni-W (7.83  Wt.% W) and Ni-W-P (20.34  Wt.% P), respectively; moreover, they exhibited considerable stabilities too.

The results presented in this work are an insight into understanding the performance of the prepared Cu electrodes coated by Ni-W and Ni-W-P films toward HER. In this work, a consistent assessment of the results achieved on laboratory scale has been conducted.

This paper aims to research the effect of different concentrations for Nd(NO₃)₃ and Ce(NO₃)₃ on the microstructures and corrosion resistance of Ni-W-P composite coatings through electroless plating method.

Scanning electron microscope, attached energy dispersive spectroscopy system and X-ray diffraction were used in this work. Meanwhile, the immersion test and electrochemical tests were used to characterize the corrosion behavior of the coating.

The coatings prepared at 1.00 g·L⁻¹ Nd(NO₃)₃ exhibit a dense structure and high phosphorus content (12.38 wt.%). In addition, compared to the addition of Ce(NO₃)₃, when Nd(NO₃)₃ was introduced at a concentration of 1.00 g·L⁻¹, the minimum corrosion rate of the coating was 1.209 g·m⁻²·h⁻¹, with a noble E_corr (−0.29 V) and lower I_corr (8.29 × 10⁻⁴ A·cm⁻²).

The effects of rare earths on the deposition and corrosion resistance mechanisms of Ni-W-P composite coatings were explored, with the rare earth elements promoting the deposition of nickel and tungsten atoms. Simultaneously, the amorphization of the coating increases, which excellently enhances the corrosion resistance of the coating.

The purpose of this paper is to investigate the hardness and elastic modulus on interfacial phases formed between Sn-3.5Ag solder and Ni-18 at. % W alloy film by nanoindentation. It has been found that a ternary amorphous Sn-Ni-W layer formed below Ni3Sn4 IMC at the interface. In this study, mechanical properties of the IMC formed between SA solder and Ni-18 at. % W film after six times reflows were performed by nanoindentation.

The characterization was carried at 25°C, and 100 indents were generated. The elastic modulus and hardness were investigated.

The results showed that hardness of Ni3Sn4 IMC was higher than amorphous Sn-Ni-W phase. A slight bigger indent was observed on the Sn-Ni-W layer compared with that on the Ni3Sn4 IMC. Lower topographical height in the Sn-Ni-W layer indicated that the Sn-Ni-W phase was softer compared with the Ni3Sn4 IMC. The lower hardness and soft Sn-Ni-W phase is significantly related to the amorphous structure that formed through solid-state amorphization.

There are no publications about the indentation on the interfacial between the Ni-W layer and the Sn-Ag solder.

This paper aims to select parameters such as temperature thermal stability and temperature coefficient of resistance (TCR) for Ni–P resistive alloys obtained by electroless metallization. Ni–P alloys are used in the manufacture of precision resistors characterized by TCR in the range of ± 10 ppm/K. The correlation of the technological parameters with the electrical properties of resistors enables the accurate prediction of the TCR resistors.

The Ni–P layers were obtained by a continuous process at about 373 K in a solution with the acidity of pH = 2 and then dried for two hours at 393 K. Subsequently, the Ni–P layer was stabilized for two hours in the temperature range of 453-533 K. Resistance was measured with an accuracy of 1 mΩ. TCR was determined with an accuracy of 1 ppm/K in the temperature range 298-398 K. In the next stage of the investigation, the increase in TCR of the Ni–P alloy was correlated with the increase in stabilization temperature. Scanning electron microscope images of the alloy surface were studied to assess grain sizes and to relate the average grain size with TCR values of resistive alloys. The X-ray diffraction analysis was performed to determine the crystallization temperature of Ni–P alloy.

The conducted investigation showed that the TCR increase in alloy is a linear function of stabilization temperature in the temperature range in which transition from amorphous phase to crystalline phases did not occur. TCR increase in Ni–P alloy arises from the increase of average size of grains resulting in decrease of scattering of electrons on grain boundaries. The analysis of alloy composition in chosen fragments of surface shows inhomogeneity growing with decreasing analyzed surface dimensions which proves that, before the stabilization, the structural arrangement of alloy is inconsiderable.

The obtained results are the first attempt to relate the morphology of surface with TCR of alloy and demonstration of linear dependence between an increase in TCR of amorphic Ni–P alloy and stabilization temperature of resistive layer. Such correlations are not described in available literature.

The ability to produce a uniform composition, high corrosion resistance with a hard coating layer during the electroless coating techniques are mainly based on the plating bath composition. The complexing agent is one of the most important components that control the coating layer properties. This paper aims to investigate the effect of the glycine as a complex agent on the surface and corrosion properties of Ni-P and Ni-P/Al₂O₃ electroless coating.

In this study, the effect of glycine as a complexing agent on the final surface and corrosion properties of the Ni-P and Ni-P/Al₂O₃ coatings has been investigated. The surface morphology and composition of the coated samples were investigated by scanning electron microscope (SEM) imaging and energy dispersive x-ray spectroscopy (EDS) analysis. Linear polarization scan and electrochemical impedance spectroscopy techniques were used to investigate the corrosion properties of the coating layer.

The results clarify that, glycine has a remarkable effect on the porosity content of Ni-P and Ni-P/Al₂O₃. It was found that increasing of glycine concentration results in higher porosity content in the coating layers. Also, the porosity in the coating layers minimizes the protectability of the coating against corrosion. The results also show that adding nano-alumina (Al₂O₃) to the coating path has improved the corrosion properties by decreasing the porosity in the coating layer. The scanning electron microscope (SEM) images showed that the concentration of glycine affects the content and distribution of alumina nanoparticles embedded in the coating layer. Also, it was observed that using a high concentration of glycine (0.4 M glycine), the alumina tends to agglomerate and the final alumina content in the coating was decreased.

The present study reveals that the quality of the final coating plays a major role in the corrosion performance of the steel substrate. The coating quality can by improve remarkably by optimization of the complexing agent used in the plating bath, to minimize the porosity involve in the coating layer.

The purpose of this paper is to present the possibility of technology of chemical metallization for the production of electrodes and resistors based on Ni–P alloy on silicon (Si), alundum (Al₂O₃) and low temperature cofired ceramic (LTCC) substrates. The developed technology provides low cost in any form.

During the study monocrystalline Si plates and Al₂O₃ and LTCC substrates were used. On the surface of the substrates, the electrodes (resistors) by the electroless metallization were made. Subsequently, the electrical parameters of obtained structures were measured. Afterwards, trial soldering was made to demonstrate that the layer is fully soldered.

Optimal parameters of the metallization bath were specified. As a result of the research conducted, it has been stated that the most appropriate way leading to the production of soldered metal layers with good adhesion to the portion of selectively activated Si plate and Al₂O₃ and LTCC substrates comprises the following technology: masking, selective activation, nickel-plating of activated plate. Such obtained metal layers have a great variety of application; in particular they can be used for the preparation of electric contacts in Si solar cells, production of electrodes and resistors and production of electrodes in thermoelectric structures.

The paper presents a new, unpublished method of manufacturing electrodes (resistors) on Si plate and Al₂O₃ and LTCC substrates.

This paper aims to report a study of the influence of tungsten carbide (WC) nanoparticles on corrosion resistance properties of electroless nickel–phosphorus (Ni–P) coatings in NaCl solution.

The morphology of Ni–P–WC nanocomposite coatings was observed by scanning electron microscopy (SEM). The anodic polarization curves, electrochemical impedance spectra (EIS) and weight loss measurements were used to study the corrosion resistance properties of Ni–P–WC nanocomposite coatings in NaCl solution.

The WC nanoparticles content in the coatings increased with the increase of its concentration in the bath, and the WC nanoparticles are uniformly distributed in Ni–P alloy matrix. The results showed that the incorporation of WC nanoparticles elevated the corrosion resistance properties of Ni–P alloy matrix.

This study shows that the corrosion resistance was improved by the addition of WC nanoparticles to the Ni–P alloy matrix.

The purpose of this paper is to investigate the electrodeposition of copper coatings directly onto AZ31 magnesium alloy, considered as a substrate of electroplating nickel. The additive, pH, complexing agent, current density, time, and temperature of electrolytic bath were studied to understand electrodepositing copper coating on AZ31 magnesium alloy.

Electrodeposition of copper was carried out in an aqueous solution containing copper hydroxide, citrate, and fluorine ion, which avoids the replacement or corrosion of the magnesium alloy. The morphology, structure, and interface of the electrodeposited copper coating were investigated by a scanning electron microscope (SEM).

The copper coating was dense, and there was good adhesion of the copper coating on the AZ31 magnesium alloy. This suggests that successful deposition of copper using an electroplating process could decrease the cost of coating AZ31 magnesium alloy.

This paper will be helpful for the development of coating on magnesium alloy using electroplating processes.

Copper hydroxide and citrate were the main compositions of the electrolyte, combined with sodium poly dipropyl (SP) and polyethylene glycol (PEG) as brightening agents and can be used to electrodeposit copper directly onto AZ31 magnesium alloy.

The purpose of this study is to reveal the effect of nano-Al₂O₃ particle addition on the nucleation/growth kinetics, microhardness, wear resistance and corrosion resistance of Co–P–xAl₂O₃ nanocomposite plating.

The kinetics and properties of Co–P–xAl₂O₃ nanocomposite plating prepared by electroplating were investigated by electrochemical measurements, scanning electron microscopy, X-ray diffraction, X-ray photoelectron spectroscopy, Vickers microhardness measurement, SRV5 friction and wear tester and atomic force microscopy.

A 12 g/L nano-Al₂O₃ addition in the plating solution can transform the nucleation/growth kinetics of the plating from the 3D progressive model to the 3D instantaneous model. The microhardness of the plating increased with the increase of nano-Al₂O₃ content in plating. The wear resistance of the plating did not adhere strictly to Archard’s law. An even and denser corrosion product film was generated due to the finer grains, with a high corrosion resistance.

The effect of different nano-Al₂O₃ addition on the nucleation/growth kinetics and properties of Co–P–xAl₂O₃ nanocomposite plating was investigated, and an anticorrosion mechanism of Co–P–xAl₂O₃ nanocomposite plating was proposed.

This paper aims to comprehensively review the preparation methods of superhydrophobic surfaces (SHPS) for corrosion protection of Mg alloy in recent years.

The preparation methods, wettability and corrosion resistance of SHPS on Mg alloy in the past three years are systematically described in this paper.

Two types of SHPS, including single-layer and multilayer coatings for corrosion protection of Mg alloy are summarized. Preparing multilayered coatings with multifunction is the current trend in developing SHPS on Mg alloy.

This paper reviewed the preparation methods and corrosion resistance of SHPS on Mg alloys. It provides a valuable reference for researchers to develop highly durable SHPS with excellent corrosion resistance for Mg alloys.