Electrodeposition of thin metallic layer for solar cell electrodes

Kazimierz Drabczyk (Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Kraków, Poland)
Robert Socha (Institute of Catalysis and Surface Chemistry, Polish Academy of Sciences, Kraków, Poland)
Piotr Panek (Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Kraków, Poland)
Grzegorz Mordarski (Institute of Catalysis and Surface Chemistry, Polish Academy of Sciences, Kraków, Poland)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Publication date: 28 January 2014

Abstract

Purpose

The paper aims to show application of the electrochemically deposited coatings for thickening of the screen printed electric paths potentially applied in photovoltaic cells.

Design/methodology/approach

The electric paths were screen printed with the use of silver-based paste. The paths were thickened by electrodeposition of thin copper layer in potentiostatic regime from surfactant-free plating bath. The morphology and surface quality of the paths were studied by imaging with scanning electron microscopy.

Findings

The electric paths can be thickened successfully, but quality for the screen printed substrate determines quality of deposited layer. The EDX analysis confirmed that the deposited copper layer covered uniformly the printed paths.

Research limitations/implications

The adhesion of the copper-covered path to the silicon wafer surface depends on adhesion of the original screen printed path.

Originality/value

This paper confirms that electrodeposited copper can be applied for screen printed silver paths thickening in a controllable way.

Keywords

Citation

Drabczyk, K., Socha, R., Panek, P. and Mordarski, G. (2014), "Electrodeposition of thin metallic layer for solar cell electrodes", Soldering & Surface Mount Technology, Vol. 26 No. 1, pp. 18-21. https://doi.org/10.1108/SSMT-10-2013-0032

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Publisher

:

Emerald Group Publishing Limited

Copyright © 2014, Emerald Group Publishing Limited

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